Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/1999
02/02/1999US5866934 Parallel and series-coupled transistors having gate conductors formed on sidewall surfaces of a sacrificial structure
02/02/1999US5866933 Integrated circuit security system and method with implanted interconnections
02/02/1999US5866932 Insulating film formed using an organic silane and method of producing semiconductor device
02/02/1999US5866930 Semiconductor device and method of manufacturing the same
02/02/1999US5866927 Integrated circuit devices having contact pads which are separated by sidewall spacers
02/02/1999US5866926 Semiconductor device
02/02/1999US5866925 Gallium nitride junction field-effect transistor
02/02/1999US5866923 Semiconductor integrated circuit device having fundamental cells and method of manufacturing the semiconductor integrated circuit device using the fundamental cells
02/02/1999US5866920 Semiconductor device and manufacturing method of the same
02/02/1999US5866485 Borophosphosilicate glass
02/02/1999US5866484 Semiconductor device and process of producing same
02/02/1999US5866483 Method for anisotropically etching tungsten using SF6, CHF3, and N2
02/02/1999US5866482 Method for masking conducting layers to abate charge damage during plasma etching
02/02/1999US5866481 Selective partial curing of spin-on-glass by ultraviolet radiation to protect integrated circuit dice near the wafer edge
02/02/1999US5866478 Metallization process using artificial gravity
02/02/1999US5866477 Method of polishing a chamfered portion of a semiconductor silicon substrate
02/02/1999US5866476 Methods for forming moisture blocking layers
02/02/1999US5866475 Method of forming solder bumps
02/02/1999US5866474 Method for manufacturing gate oxide layers
02/02/1999US5866473 Method of manufacturing a polysilicon gate having a dimension below the photolithography limitation
02/02/1999US5866472 Direct gas-phase doping of semiconductor wafers using an organic dopant source
02/02/1999US5866471 Method of forming semiconductor thin film and method of fabricating solar cell
02/02/1999US5866470 Method of using an interface layer for stacked lamination sizing and sintering
02/02/1999US5866468 Forming silicon oxide on silicon semiconductor
02/02/1999US5866467 Method of improving oxide isolation in a semiconductor device
02/02/1999US5866466 Methods of fabricating trench isolation regions with risers
02/02/1999US5866465 Semiconductor processing method of forming a contact opening to a region adjacent a field isolation mass
02/02/1999US5866463 Method of manufacturing a semiconductor apparatus
02/02/1999US5866462 Double-spacer technique for forming a bipolar transistor with a very narrow emitter
02/02/1999US5866460 Method of forming a multiple inplant lightly doped drain (MILDD) field effect transistor
02/02/1999US5866459 Method of fabricating a contact structure for an MOS transistor entirely on isolation oxide
02/02/1999US5866458 Method for fabricating a CMOS
02/02/1999US5866457 Semiconductor read-only memory device and method of fabricating the same
02/02/1999US5866456 Method for fabricating a semiconductor memory device
02/02/1999US5866455 Method for forming a dram cell with a multiple pillar-shaped capacitor
02/02/1999US5866454 Method of fabricating a capacitor structure for a dynamic random access memory cell with cellular voids
02/02/1999US5866453 Etch process for aligning a capacitor structure and an adjacent contact corridor
02/02/1999US5866452 Process for producing a silicon capacitor
02/02/1999US5866451 Method of making a semiconductor device having 4t sram and mixed-mode capacitor in logic
02/02/1999US5866450 Method for fabricating crown-shaped DRAM capacitor
02/02/1999US5866449 Method of making polysilicon-via structure for four transistor, triple polysilicon layer SRAM cell including two polysilicon layer load resistor
02/02/1999US5866448 Procedure for forming a lightly-doped-drain structure using polymer layer
02/02/1999US5866447 Modified zero layer align method of twin well MOS fabrication
02/02/1999US5866446 Method of manufacturing bimos device
02/02/1999US5866445 High density CMOS circuit with split gate oxide
02/02/1999US5866444 Integrated circuit and method of fabricating the same
02/02/1999US5866443 Very dense integrated circuit package and method for forming the same
02/02/1999US5866442 Method and apparatus for filling a gap between spaced layers of a semiconductor
02/02/1999US5866441 Inverted chip bonded module with high packaging efficiency
02/02/1999US5866438 Field emission type electron emitting device and method of producing the same
02/02/1999US5866437 Dynamic process window control using simulated wet data from current and previous layer data
02/02/1999US5866436 Process of manufacturing an intergrated circuit having an interferometrically profiled mounting film
02/02/1999US5866435 Methods of fabricating profiled device isolation trenches in integrated circuits
02/02/1999US5866306 Polyalkylphenylsilane
02/02/1999US5866305 Mixture of ethyl lactate, gamma butyrolactone and ethyl3-ethoxypropionate
02/02/1999US5866303 Resist developing method by magnetic field controlling, resist developing apparatus and method of fabricating semiconductor device
02/02/1999US5866302 Pattern formation method
02/02/1999US5866301 Method of manufacturing thin film diode
02/02/1999US5866300 Method of and system for exposing pattern on object by charged particle beam
02/02/1999US5866299 Negative photoresist composition
02/02/1999US5866283 Method of monitoring a photolithographic process through utilization of fractional radiant energy test pattern
02/02/1999US5866280 Exposure mask and manufacturing method thereof
02/02/1999US5866250 Adhesive tape for electronic parts and liquid adhesive
02/02/1999US5866226 Polishing agent used for polishing semiconductor wafers and polishing method using the same
02/02/1999US5866213 Method for producing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor
02/02/1999US5866198 Method of fabricating a compound semiconductor having a plurality of layers using a flow compensation technique
02/02/1999US5866197 Method for producing thick crack-free coating from hydrogen silsequioxane resin
02/02/1999US5866094 Method of feeding dopant for continuously-charged method and a dopant composition
02/02/1999US5866044 Lead free conductive composites for electrical interconnections
02/02/1999US5866031 Slurry formulation for chemical mechanical polishing of metals
02/02/1999US5866020 Method of manufacturing TAB tapes and laminated body for producing the same
02/02/1999US5865938 Wafer chuck for inducing an electrical bias across wafer heterojunctions
02/02/1999US5865937 Broad-band adjustable power ratio phase-inverting plasma reactor
02/02/1999US5865920 Method of forming electrode on ceramic green sheet and method of manufacturing multilayer ceramic electronic component
02/02/1999US5865902 Method for cleaning electronic hardware components
02/02/1999US5865901 Wafer surface cleaning apparatus and method
02/02/1999US5865900 Etch method for removing metal-fluoropolymer residues
02/02/1999US5865897 Method of producing film of nitrogen-doped II-VI group compound semiconductor
02/02/1999US5865893 Spin coating apparatus
02/02/1999US5865891 Planarization process using artificial gravity
02/02/1999US5865888 Semiconductor device epitaxial layer lateral growth rate control method using CBr4
02/02/1999US5865879 Gas scrubber used in fabricating semiconductor devices and gas filtering method using the same
02/02/1999US5865588 Chamber, at least for the transport of workpieces, a chamber combination, a vacuum treatment facility as well as a transport method
02/02/1999US5865421 Valve structure for use in a vaporizer
02/02/1999US5865365 Method of fabricating an electronic circuit device
02/02/1999US5865321 Slip free vertical rack design
02/02/1999US5865163 Dicing saw alignment for array ultrasonic transducer fabrication
02/02/1999US5864966 Method for drying a sample substrate
02/02/1999US5864946 Method of making contact tip structures
02/02/1999US5864932 Partially or completely encapsulated top electrode of a ferroelectric capacitor
02/02/1999CA2061624C Sub-micron device fabrication
01/1999
01/28/1999WO1999004606A2 Compact microwave downstream plasma system
01/28/1999WO1999004453A1 Contact and method for producing a contact
01/28/1999WO1999004440A1 Microelectronic components and electronic networks comprising dna
01/28/1999WO1999004437A1 Vertical power mosfet
01/28/1999WO1999004436A1 Method for making a vertical mos transistor
01/28/1999WO1999004434A2 Hemispherical grained polysilicon semiconductor capacitor structure and method
01/28/1999WO1999004431A1 Integrated circuit and method for the production thereof
01/28/1999WO1999004430A1 Semiconductor flip-chip package and method for the fabrication thereof
01/28/1999WO1999004428A1 Method for producing a matrix from thin film transistors with storage capacities