Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1999
03/02/1999US5877046 Methods of forming semiconductor-on-insulator substrates
03/02/1999US5877045 Method of forming a planar surface during multi-layer interconnect formation by a laser-assisted dielectric deposition
03/02/1999US5877044 Method of making MOS-gated semiconductor devices
03/02/1999US5877043 Electronic package with strain relief means and method of making
03/02/1999US5877042 Glass/Metal package and method for producing the same
03/02/1999US5877041 Self-aligned power field effect transistor in silicon carbide
03/02/1999US5877036 Overlay measuring method using correlation function
03/02/1999US5877035 Analyzing method and apparatus for minute foreign substances, and manufacturing methods for manufacturing semiconductor device and liquid crystal display device using the same
03/02/1999US5877034 Method of making a three-dimensional integrated circuit
03/02/1999US5877032 Process for device fabrication in which the plasma etch is controlled by monitoring optical emission
03/02/1999US5877031 Method for forming a metallic barrier layer in semiconductor device
03/02/1999US5876904 Irradiation; development
03/02/1999US5876903 Virtual hard mask for etching
03/02/1999US5876901 Method for fabricating semiconductor device
03/02/1999US5876900 Polyhydroxystyrene polymer
03/02/1999US5876897 Diazaquinone derivatives of chromone, thiochromone, or quinolinone
03/02/1999US5876885 Profile simulation method, dependent on curvature of processed surface, and mask design method utilizing simulation
03/02/1999US5876881 No pattern defects.
03/02/1999US5876880 Process for producing a structured mask
03/02/1999US5876879 Dimensions in the oxide layer being etched can be specifically sized smaller than openings made in the overcoating masking material.
03/02/1999US5876877 Patterned mask having a transparent etching stopper layer
03/02/1999US5876861 Stress reduced sputtered nickel layer
03/02/1999US5876859 Direct metal bonding
03/02/1999US5876838 Semiconductor integrated circuit processing wafer having a PECVD material layer of improved thickness uniformity
03/02/1999US5876798 Method of fluorinated silicon oxide film deposition
03/02/1999US5876797 Silicon chemical vapor deposition
03/02/1999US5876796 Process for selectively depositing a refractory metal silicide on silicon, and silicon wafer metallized using this process
03/02/1999US5876795 Method for producing a low-stress electrolessly deposited nickel layer
03/02/1999US5876788 High dielectric TiO2 -SiN composite films for memory applications
03/02/1999US5876614 Method of wet etching aluminum oxide to minimize undercutting
03/02/1999US5876574 Magnet design for a sputtering chamber
03/02/1999US5876556 Die-bonding device
03/02/1999US5876538 Method for manufacturing a ceramic multilayer substrate for complex electronic circuits
03/02/1999US5876536 Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate
03/02/1999US5876509 Aqueous ammonia, methanol, hydrofluoric acid, deionized water
03/02/1999US5876508 Method of cleaning slurry remnants after the completion of a chemical-mechanical polish process
03/02/1999US5876497 Fabrication process and fabrication apparatus of SOI substrate
03/02/1999US5876495 Method of pulling semiconductor single crystals
03/02/1999US5876490 Polish process and slurry for planarization
03/02/1999US5876280 Substrate treating system and substrate treating method
03/02/1999US5876272 Semiconductor wafer polishing machine
03/02/1999US5876269 Apparatus and method for polishing semiconductor device
03/02/1999US5876266 Polishing pad with controlled release of desired micro-encapsulated polishing agents
03/02/1999US5876215 Separable electrical connector assembly having a planar array of conductive protrusions
03/02/1999US5876082 Device for gripping and holding substrates
03/02/1999US5875896 Unified semiconductor wafer packaging system to unify irregular shape buffer materials
03/02/1999US5875892 Packaging container with humidity indicator
03/02/1999US5875804 Substrate treating apparatus
03/02/1999US5875560 Method and apparatus for aligning surfaces in close proximity
03/02/1999US5875559 Apparatus for measuring the profile of a polishing pad in a chemical mechanical polishing system
03/02/1999US5875545 Method of mounting a connection component on a semiconductor chip with adhesives
03/02/1999US5875507 Wafer cleaning apparatus
03/02/1999US5875505 Apparatus for cleaning and drying hard disk substrates
03/02/1999CA2131668C Isolation structure using liquid phase oxide deposition
03/02/1999CA2120610C Nitride based semiconductor device and manufacture thereof
03/02/1999CA2113752C Inspection system for cross-sectional imaging
03/02/1999CA2061504C Method of forming a single crystal material
02/1999
02/25/1999WO1999009602A1 Compound semiconductor device based on gallium nitride
02/25/1999WO1999009600A1 Semiconductor device and method for manufacturing the same
02/25/1999WO1999009599A2 Vertical interconnect process for silicon segments with dielectric isolation
02/25/1999WO1999009595A1 Multichip module structure and method for manufacturing the same
02/25/1999WO1999009593A1 Dual damascene metallization
02/25/1999WO1999009592A1 Flip-chip semiconductor package and method for manufacturing the same
02/25/1999WO1999009591A1 Component with protective layer and method for producing a protective layer for a component
02/25/1999WO1999009590A1 Method for forming bump electrode and method for manufacturing semiconductor device
02/25/1999WO1999009589A1 Method for making thin slices, in particular wafers, and resulting thin slices
02/25/1999WO1999009588A1 Method of processing semiconductor wafers
02/25/1999WO1999009587A2 Method of etching copper for semiconductor devices
02/25/1999WO1999009586A2 Method for forming titanium silicide and titanium by cvd
02/25/1999WO1999009585A1 Semiconductor substrate and semiconductor device
02/25/1999WO1999009456A1 Multiple image reticle for forming layers
02/25/1999WO1999009371A1 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
02/25/1999WO1999009233A1 Gas distribution system for a process reactor and method for processing semiconductor substrates
02/25/1999WO1999008850A2 Mould and method for making a composite plastic body
02/25/1999WO1999008838A1 Chemical mechanical polishing composition
02/25/1999WO1999008821A1 Method for producing a cooling element, and a cooling element
02/25/1999WO1999008805A1 Plasma cleaning and etching methods using non-global-warming compounds
02/25/1999WO1998053505A3 Lateral mos semiconductor device
02/25/1999WO1998053491A3 Manufacture of a semiconductor device with a mos transistor having an ldd structure
02/25/1999WO1998053447A3 Method of manufacturing a body having a structure of layers
02/25/1999WO1998052214A3 Magnetically-levitated rotor system for an rtp chamber
02/25/1999WO1998028781A3 Layer with a porous layer area, an interference filter containing such a layer and a method for the production thereof
02/25/1999DE4447663C2 Semiconductor substrate prodn.
02/25/1999DE19831876A1 Producing contact between flexible conductor and substrate
02/25/1999DE19825524A1 Thin film transistor useful for a SRAM cell
02/25/1999DE19824774A1 Capacitor production in a transistor-containing semiconductor component especially a DRAM
02/25/1999DE19809270A1 Surface roughening process for a conductive amorphous silicon film
02/25/1999DE19747579C1 Viscous fluid adhesive material dispenser e.g. semiconductor chip
02/25/1999DE19741921A1 Carrier element for semiconductor chip card data type carrier
02/25/1999DE19736318A1 Installation for coating plate shaped substrates with thin layers by cathode sputtering
02/25/1999DE19736207A1 MBE of a p-conductive carbon-doped InGaAs layer on an InP substrate
02/25/1999DE19733736A1 Integrierte elektrische Schaltung Integrated electrical circuit
02/25/1999DE19733731A1 Integrierte elektrische Schaltung mit Passivierungsschicht Integrated electrical circuit with passivation
02/25/1999DE19732871A1 Read-only memory cell device
02/24/1999EP0898310A2 Heat sink for semiconductors and manufacturing process thereof
02/24/1999EP0898308A2 A method for forming a metal interconnection in a semiconductor device
02/24/1999EP0898307A1 Method of treatment for molecular gluing and ungluing of two structures
02/24/1999EP0898306A2 Method of forming a self-aligned refractory metal silicide layer
02/24/1999EP0898305A2 Structure and method for packaging semiconductor chip
02/24/1999EP0898304A2 Asymmetric channel doped MOS structure and method for same
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