Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/1999
02/09/1999US5869394 Teos-ozone planarization process
02/09/1999US5869393 Method for fabricating multi-level interconnection
02/09/1999US5869392 Method of fabricating a semiconductor device including a plurality of contact regions disposed at different depths
02/09/1999US5869391 Semiconductor method of making electrical connection between an electrically conductive line and a node location, and integrated circuitry
02/09/1999US5869390 Photolithographically forming a mask pattern on diamond layer, surface treatment with a plasma consisting at least one gas selected from helium, neon, argon, krypton, xenon and nitrogen, sputtering a metal film
02/09/1999US5869389 Semiconductor processing method of providing a doped polysilicon layer
02/09/1999US5869388 Forming conductive structure, forming insulating silicon dioxide layer, doped planarizing layer, curing, heating, forming opening to expose portion of conductive surface
02/09/1999US5869387 Process for producing semiconductor substrate by heating to flatten an unpolished surface
02/09/1999US5869386 Method of fabricating a composite silicon-on-insulator substrate
02/09/1999US5869385 Implanting impurity atoms into the semiconductor substrate to increase the oxidation rate of the substrate
02/09/1999US5869384 Trench filling method employing silicon liner layer and gap filling silicon oxide trench fill layer
02/09/1999US5869383 High contrast, low noise alignment mark for laser trimming of redundant memory arrays
02/09/1999US5869382 Structure of capacitor for dynamic random access memory and method of manufacturing thereof
02/09/1999US5869380 Method for forming a bipolar junction transistor
02/09/1999US5869379 Method of forming air gap spacer for high performance MOSFETS'
02/09/1999US5869378 Method of reducing overlap between gate electrode and LDD region
02/09/1999US5869377 Method of fabrication LDD semiconductor device with amorphous regions
02/09/1999US5869376 Production method for semiconductor device having field-shield isolation structure
02/09/1999US5869375 Forming the transistor having channel formed at a side wall of a gate and at a lower portion to prevent a short channel effect; tungsten gate electrode has a strong anti-oxide propery during thermal-oxidation
02/09/1999US5869374 Method to form mosfet with an inverse T-shaped air-gap gate structure
02/09/1999US5869373 Source/drain regions for metal oxide semiconductor field effective transitor memory cells are formed from intrinsic amorphous silicon, instead of highly doped polysilicon
02/09/1999US5869372 Method of manufacturing a power semiconductor device
02/09/1999US5869371 Structure and process for reducing the on-resistance of mos-gated power devices
02/09/1999US5869370 Ultra thin tunneling oxide using buffer CVD to improve edge thinning
02/09/1999US5869369 Method of fabricating a flash memory
02/09/1999US5869368 Method to increase capacitance
02/09/1999US5869367 Method of forming a capacitor
02/09/1999US5869365 Method of forming T electrode in field effect transistor
02/09/1999US5869364 Single layer integrated metal process for metal semiconductor field effect transistor (MESFET)
02/09/1999US5869363 Method of manufacturing semiconductor device
02/09/1999US5869362 Forming a transluscent silicon oxide film including a metal element on a first portion of a silicon semiconductor film, selective crystallization of semiconductor film by heating; irradiation first part and second portion with laser light
02/09/1999US5869361 Thin film transistor and method for fabricating the same
02/09/1999US5869360 Method for forming a thin film transistor
02/09/1999US5869359 A dielectric layer formed over silicon layer, masking, etching to form a trench, oxidizing the sidewall, forming a polysilicon gate within the trench, covering a metal silicide, minimizing agglomeration within the silicide layer
02/09/1999US5869358 Producing anode emitter with desired thickness and doping concentration, setting emitter efficiency by nuclear irradiation before applying anode metallization layer
02/09/1999US5869357 Metallization and wire bonding process for manufacturing power semiconductor devices
02/09/1999US5869356 Method and structure for constraining the flow of incapsulant applied to an I/C chip on a substrate
02/09/1999US5869355 Lead frame with increased strength and manufacture of semiconductor device
02/09/1999US5869354 Forming a etch stop layer in the substrate parallel to the principal surface, forming semiconductor on the principal surface, depositing a low stress dielectric membranes over semiconductor, etching etch barrier and a substrate portion
02/09/1999US5869353 Modular panel stacking process
02/09/1999US5869351 Method of producing an electro-optical device
02/09/1999US5869219 Purging deposition chamber with inert gas during coating of wafer with polyimide to reduce moisture content
02/09/1999US5869212 Improved image resolution and depth of focus, and a minimization of image shortening effects
02/09/1999US5869211 Substrate having opaque film on central portion covered with coating film which has benn removed from peripheral portion by dissolving in processing solution
02/09/1999US5869149 Method for preparing nitrogen surface treated fluorine doped silicon dioxide films
02/09/1999US5869139 Apparatus and method for plating pin grid array packaging modules
02/09/1999US5869134 CVD of metals capable of receiving nickel or alloys thereof using iodide
02/09/1999US5868952 Fabrication method with energy beam
02/09/1999US5868950 Masking and laser drilling
02/09/1999US5868947 Si substrate and method of processing the same
02/09/1999US5868898 Fluid dispensing device for wet chemical process tank and method of using
02/09/1999US5868897 Device and method for processing a plasma to alter the surface of a substrate using neutrals
02/09/1999US5868884 Kneading mixture of water soluble metal acids or salts, ceramic particles, sintering auxiliaries, water; slurrying with binder, drying, sintering
02/09/1999US5868870 Isolation structure of a shallow semiconductor device trench
02/09/1999US5868866 Performing a liquid jet cleaning of a surface in a plurality of cleaning steps
02/09/1999US5868865 Washing solution supply source filled with a washing solution required for chemical washing of a wafer
02/09/1999US5868863 Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF)
02/09/1999US5868862 Method of removing inorganic contamination by chemical alteration and extraction in a supercritical fluid media
02/09/1999US5868861 Pump drives washing fluid through the conduit and through the walls of the conduit so that the fluid irrigates the seal to preserve its integrity
02/09/1999US5868857 Rotating belt wafer edge cleaning apparatus
02/09/1999US5868856 Reacting inorganic contamination with a conversion agent then subjecting to a solvent agent
02/09/1999US5868855 Surface processing method and surface processing device for silicon substrates
02/09/1999US5868854 Method and apparatus for processing samples
02/09/1999US5868853 Integrated film etching/chamber cleaning process
02/09/1999US5868849 Surface processing device
02/09/1999US5868848 Plasma processing apparatus
02/09/1999US5868847 Clamp ring for shielding a substrate during film layer deposition
02/09/1999US5868843 Detachable sponge device for spin-coating machines
02/09/1999US5868836 Semiconductor single-crystal lift device
02/09/1999US5868834 Thin film epitaxy using organic metal compound of group 2 element and hydride or metal compound of group 6 element and halide or halogen gas
02/09/1999US5868833 Trichlorosilane and hydrogen gas under stoichiometric conditions to satisfy an equation; by-products chlorosilane and dichlorosilane are adsorbed on the surface to prevent the formation of corrosive hydrochloric acid
02/09/1999US5868803 Method for mounting a wafer loading device to a process machine
02/09/1999US5868560 Reticle, pattern transferred thereby, and correction method
02/09/1999US5868542 Magazine conveying device
02/09/1999US5868304 Socketable bump grid array shaped-solder on copper spheres
02/09/1999US5868301 Semiconductor inner lead bonding tool
02/09/1999US5868300 Articulated wire bonder
02/09/1999US5868150 Ultra-low particle semiconductor cleaner
02/09/1999US5867881 Pre-installation of pumping line for efficient fab expansion
02/04/1999WO1999005735A1 Inorganic hydrogen compounds, separation methods, and fuel applications
02/04/1999WO1999005725A1 Field effect semiconductor device
02/04/1999WO1999005724A1 Single-electron floating-gate mos memory
02/04/1999WO1999005720A2 Cmos circuit and method for the production thereof
02/04/1999WO1999005719A1 Device and method for producing a chip-substrate connection
02/04/1999WO1999005718A2 Material tablet and method for the production of a plastic composite body
02/04/1999WO1999005717A1 Method for making an anisotropic conductive coating with conductive inserts
02/04/1999WO1999005716A1 Method for producing a structure by growth of a material on a support exposed to air
02/04/1999WO1999005715A1 Semiconductor device and method of producing the same
02/04/1999WO1999005714A1 Method for producing a semiconductor component controlled by field effect
02/04/1999WO1999005713A1 Bipolar transistor which can be controlled by field effect and method for producing the same
02/04/1999WO1999005712A1 Process for fabricating layered superlattice materials and abo3, type metal oxides and making electronic devices including same without exposure to oxygen
02/04/1999WO1999005711A1 Producing microstructures or nanostructures on a support
02/04/1999WO1999005709A1 Exposure method and aligner
02/04/1999WO1999005706A1 A polishing composition including an inhibitor of tungsten etching
02/04/1999WO1999005705A1 Wafer out-of-pocket detection tool
02/04/1999WO1999005704A1 Method for washing silicon wafer
02/04/1999WO1999005703A1 Wafer out-of-pocket detector and susceptor leveling tool
02/04/1999WO1999005702A1 Testing and correction of faulty contact arrangements of integrated semiconductor components
02/04/1999WO1999005701A2 Composite electrical contact structure and method for manufacturing the same
02/04/1999WO1999005573A1 Supporting device with gas bearing