Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/1999
02/04/1999WO1999005417A1 Hall-current ion source apparatus and method for processing materials
02/04/1999WO1999005344A1 Method for producing a filter
02/04/1999WO1999005232A1 Polishing agent for semiconductor substrates
02/04/1999WO1999005196A1 Thermosetting resin compositions useful as underfill sealants
02/04/1999WO1999004615A1 System for delivering a substantially constant vapor flow to a chemical process reactor
02/04/1999WO1998052278A3 An amplified mos biasing circuit for avoiding latch-up
02/04/1999WO1998049646A3 Dynamically reconfigurable assembly line for electronic products
02/04/1999DE19833245A1 Solid state LED light bulb for indicator
02/04/1999DE19832329A1 Silicon carbide semiconductor structure manufacturing method
02/04/1999DE19832327A1 Silicon carbide based semiconductor structure e.g. for MOSFET
02/04/1999DE19830477A1 High temperature resistant semiconductor device
02/04/1999DE19828637A1 Thermo-compression bonding apparatus for semiconductor device flip-chip mounting
02/04/1999DE19824225A1 Method of manufacturing a printed circuit board
02/04/1999DE19813198A1 Information card for workpiece identification
02/04/1999DE19804009A1 Solid state memory cell circuit
02/04/1999DE19802369A1 Phase-shift photomask production with accurate pattern
02/04/1999DE19741713C1 Encapsulation of semiconductor chip to form microelectronic package
02/04/1999CA2297077A1 Method for producing a filter
02/04/1999CA2266314A1 Thermosetting resin compositions useful as underfill sealants
02/03/1999EP0895355A2 Digitally Controlled Delay Circuit
02/03/1999EP0895331A1 Protection device for electrical load and power supply provided with such a device
02/03/1999EP0895293A2 Semiconductor device comprising an aggregate of semiconductor micro-needles
02/03/1999EP0895290A1 Edge termination method and structure for power mosfet
02/03/1999EP0895289A2 Digital circuit in MOS Technology
02/03/1999EP0895288A2 Electrode line for semiconducor device and method of manufacturing it
02/03/1999EP0895283A2 Method of forming multi-level coplanar metal/insulator films using dual damascene with sacreficial flowable oxide
02/03/1999EP0895282A2 Method of preparing a SOI substrate by using a bonding process, and SOI substrate produced by the same
02/03/1999EP0895281A1 Two-step projecting bump for semiconductor chip and method for forming the same
02/03/1999EP0895280A2 Method for forming different regions with high and low resistance values in a single polycrystalline silicon layer and structure produced by the same
02/03/1999EP0895278A2 Patterning process
02/03/1999EP0895277A2 Carrier apparatus with more than one carrier belts and processing apparatus therewith
02/03/1999EP0895276A1 Process for manufacturing integrated microstructures of single-crystal semiconductor material
02/03/1999EP0895256A1 Article comprising an inductive element with a magnetic thin film
02/03/1999EP0895090A1 Process for manufacturing high-sensitivity accelerometric and gyroscopic integrated sensors, and sensor thus produced
02/03/1999EP0894808A1 Modified cellulose compound and photopolymerizable resin composition containing the same
02/03/1999EP0894751A1 Transport system and controlling procedure for that system
02/03/1999EP0894570A2 Method and apparatus for polishing
02/03/1999EP0894339A1 Silicon carbide cmos and method of fabrication
02/03/1999EP0894338A1 Anisotropic, fluorine-based plasma etching method for silicon
02/03/1999EP0894337A2 Installation for wet-treating substrates
02/03/1999EP0894287A1 Two-dimensionally balanced positioning device, and lithographic device provided with such a positioning device
02/03/1999EP0894155A1 Composition and process for fabricating metal oxide films
02/03/1999EP0852774B1 Chip module
02/03/1999EP0828582A4 Ribbon-like core interconnection elements
02/03/1999EP0711363B1 High resistance silicon carbide and process for production thereof
02/03/1999EP0642179B1 Solid state imaging device and process for production thereof
02/03/1999EP0623957B1 Lead frame manufacturing method
02/03/1999CN2306570Y Fixing mechanism for wafer
02/03/1999CN2306569Y Improved structure for stopboard of rear engineering magazine containing integrated circuit wire frame
02/03/1999CN1207204A Highly-integrated semiconductor memory and process for preparation of the memory
02/03/1999CN1206954A Intermediate voltage generating circuit
02/03/1999CN1206936A Semiconductor device and making method thereof
02/03/1999CN1206935A Trough isolation method by using composite oxidic film
02/03/1999CN1206934A Chip packaging device
02/03/1999CN1206933A Device and method for jet-coating photoresit
02/03/1999CN1206932A Washing composition for making semiconductor device and method for making said device by using same
02/03/1999CN1206931A Method for preparing cubic boron nitride monocrystal-diamond film hetru P-N junction
02/03/1999CN1206831A Method and apparatus for quantitative measurement of corrosivity effect of residues present on surface of electronic circuit assemblies
02/03/1999CN1206755A Method for making monocrystal silicon and wafer by controlling pulling-speed distribution and products thereof
02/03/1999CN1041977C Nonvolatile semiconductor device having side wall split gate for compensating for over-erasing operation
02/03/1999CN1041974C Phase shift mask and method for fabricating same
02/03/1999CN1041973C 半导体器件 Semiconductor devices
02/02/1999US5867691 Synchronizing system between function blocks arranged in hierarchical structures and large scale integrated circuit using the same
02/02/1999US5867590 Method and apparatus for determining a location on a surface of an object
02/02/1999US5867507 Testable programmable gate array and associated LSSD/deterministic test methodology
02/02/1999US5867505 Method and apparatus for testing an integrated circuit including the step/means for storing an associated test identifier in association with integrated circuit identifier for each test to be performed on the integrated circuit
02/02/1999US5867440 Semiconductor storage device with improved layout of power supply lines
02/02/1999US5867429 High density non-volatile flash memory without adverse effects of electric field coupling between adjacent floating gates
02/02/1999US5867426 Method of programming a flash memory cell
02/02/1999US5867425 Nonvolatile memory capable of using substrate hot electron injection
02/02/1999US5867423 Memory circuit and method for multivalued logic storage by process variations
02/02/1999US5867420 Reducing oxidation stress in the fabrication of devices
02/02/1999US5867418 Semiconductor memory device and semiconductor device
02/02/1999US5867405 Method for storing history data
02/02/1999US5867389 Substrate processing management system with recipe copying functions
02/02/1999US5867362 Storage capacitor for DRAM memory cell
02/02/1999US5867359 For attachment to a wafer transfer mechanism
02/02/1999US5867319 Illumination optical system, an exposure apparatus having the illumination system, and a method for manufacturing a semiconductor device
02/02/1999US5867260 Conductive ball mounting apparatus and mounting method of conductive ball
02/02/1999US5867253 Method of correcting light proximity effect
02/02/1999US5867242 Electrically isolated pixel element in a low voltage activated active matrix liquid crystal display and method
02/02/1999US5867233 Active matrix liquid crystal display substrate with island structure covering break in signal bus line and method of producing same
02/02/1999US5867087 Three dimensional polysilicon resistor for integrated circuits
02/02/1999US5867055 Semiconductor device containing an adjustable voltage generator
02/02/1999US5867052 Level shifting output driver
02/02/1999US5867040 Integrated circuit with stacked sub-circuits between Vcc and ground so as to conserve power and reduce the voltage across any one transistor
02/02/1999US5866953 Packaged die on PCB with heat sink encapsulant
02/02/1999US5866952 High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate
02/02/1999US5866951 Hybrid circuit with an electrically conductive adhesive
02/02/1999US5866950 Semiconductor package and fabrication method
02/02/1999US5866949 Chip scale ball grid array for integrated circuit packaging
02/02/1999US5866948 Interposer for semiconductor device
02/02/1999US5866947 Post tungsten etch bank anneal, to improve aluminum step coverage
02/02/1999US5866946 Semiconductor device having a plug for diffusing hydrogen into a semiconductor substrate
02/02/1999US5866945 Borderless vias with HSQ gap filled patterned metal layers
02/02/1999US5866940 Semiconductor device
02/02/1999US5866938 Semiconductor device equipped with antifuse elements and a method for manufacturing an FPGA
02/02/1999US5866937 Double half via antifuse
02/02/1999US5866936 Mesa-structure avalanche photodiode having a buried epitaxial junction
02/02/1999US5866935 Tunneling device