Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/1999
02/24/1999EP0898303A2 Electric isolating thin film system with defined residual conduction
02/24/1999EP0898302A1 Reactor and method of processing a semiconductor substrate
02/24/1999EP0898301A2 Apparatus for cleaning both sides of substrate
02/24/1999EP0898300A2 Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection
02/24/1999EP0898299A1 Compartmentalized substrate processing chamber
02/24/1999EP0898298A1 Determination of the thickness of a denuded zone in a silicon wafer
02/24/1999EP0898283A2 Semiconductor component and method of testing and operating the semiconductor component
02/24/1999EP0898214A2 Intermediate potential generation circuit
02/24/1999EP0898135A1 Cryogenic rectification system for recovery of fluorine compounds
02/24/1999EP0897975A1 Cleaning solution
02/24/1999EP0897901A1 Solution for forming ferroelectric film and method for forming ferroelectric film
02/24/1999EP0897595A1 Electric component in integrated circuit form for hot insertion in a substrate and methods for manufacturing same
02/24/1999EP0897594A1 Control of junction depth and channel length using generated interstitial gradients to oppose dopant diffusion
02/24/1999EP0897593A1 Device and process for treating substrates in a fluid container
02/24/1999EP0897557A1 Lithographical process for production of nanostructures on surfaces
02/24/1999EP0855088B1 Process for producing trench insulation in a substrate
02/24/1999EP0733268B1 Method for replacing a detection module hybridized by welding balls
02/24/1999EP0724774B1 Grippers for disc-shaped articles
02/24/1999EP0705484B1 Method of manufacturing a device whereby a support bar is provided with conductor tracks for electrically contacting a semiconductor element
02/24/1999EP0693223B1 Method of joining electrical contact points
02/24/1999EP0667036B1 Chip interconnection having a breathable etch stop layer
02/24/1999CN2308965Y Electronic elements with metal shell
02/24/1999CN2308964Y Compounding PN type semiconductor crystalline grain
02/24/1999CN1209218A III-V/II-VI semiconductor interface fabrication method
02/24/1999CN1209217A Secure semiconductor device
02/24/1999CN1209216A Shape memory alloy lift pins for semiconductor processing equipment
02/24/1999CN1209210A Process for producing chip card for contactless operation
02/24/1999CN1209034A Device and method for reducing size of semiconductor material
02/24/1999CN1208968A Method for forming complimentary wells and self-aligned trench with single mask
02/24/1999CN1208967A Semiconductor device and mfg. method of the same
02/24/1999CN1208965A Capacitor with high-dielectric-constant dielectric and thick electrode and fabrication method thereof
02/24/1999CN1208964A Semiconductor device having metal-insulator-metal capacitor
02/24/1999CN1208963A CMOS integrated circuits with reduced substrate defects
02/24/1999CN1208962A 半导体存储器 Semiconductor memory
02/24/1999CN1208957A Method of mfg. split-gate flash memory cell
02/24/1999CN1208956A Integrated circuits and mfg. methods
02/24/1999CN1208955A IC-mounted structre, liquid crystal device and electronic device
02/24/1999CN1208954A Method of implanting low doses of ions into substrate
02/24/1999CN1208953A Methods of forming barrier layer
02/24/1999CN1208952A Method of reducing loading variation during etch processing
02/24/1999CN1208951A Method and apparatus for processing semiconductor wafer on robotic track having access to in situ wafer backside particle detection
02/24/1999CN1208950A Point of use dilution tool and method
02/24/1999CN1208949A Method of forming multi-level coplanar metal/insulator films using dual damascene with sacrificial flowable oxide
02/24/1999CN1208948A Method of preparing charged particle beam drawing data and recording medium on which program thereof is recorded
02/24/1999CN1208947A Improved dual damascene structure
02/24/1999CN1208946A Method and apparatus for applying protecting film to semiconductor wafer
02/24/1999CN1208936A Semi-conductor assembly and method for testing and operating semi-conductor assembly
02/24/1999CN1208858A Semiconductor device test system with operation loss reduced
02/24/1999CN1208752A Base material and adhesive tape using the same
02/24/1999CN1208672A Apparatus and method of separating sample and substrate fabrication method
02/24/1999CN1042274C Tech. for making P-N junction
02/23/1999US5875416 Temperature adjusting method and apparatus therefor using at least two temperature sensors and a correction value
02/23/1999US5875148 Semiconductor memory
02/23/1999US5875138 Dynamic access memory equalizer circuits and methods therefor
02/23/1999US5875129 Nonvolatile semiconductor memory device including potential generating circuit
02/23/1999US5875100 High-density mounting method and structure for electronic circuit board
02/23/1999US5875086 Semiconductor integrated circuit device equipped with protective system for directly discharging surge voltage from pad to discharge line
02/23/1999US5874883 Planar-type inductor and fabrication method thereof
02/23/1999US5874859 High-frequency amplifier integrated-circuit device
02/23/1999US5874855 Voltage transferring device capable of holding boost voltage and transferring in high speed boost voltage
02/23/1999US5874851 Semiconductor integrated circuit having controllable threshold level
02/23/1999US5874827 Voltage supply circuit for a load absorbing high tentative peak current
02/23/1999US5874820 Window frame-guided stage mechanism
02/23/1999US5874784 Semiconductor device having external connection terminals provided on an interconnection plate and fabrication process therefor
02/23/1999US5874782 Wafer with elevated contact structures
02/23/1999US5874780 Method of mounting a semiconductor device to a substrate and a mounted structure
02/23/1999US5874779 Semiconductor device with improved adhesion between titanium-based metal wiring layer and insulation film
02/23/1999US5874778 Embedded power and ground plane structure
02/23/1999US5874777 Semiconductor device with enhanced thermal conductivity
02/23/1999US5874773 Semiconductor device
02/23/1999US5874772 Semiconductor device
02/23/1999US5874771 Punch-through resistor
02/23/1999US5874770 Flexible interconnect film including resistor and capacitor layers
02/23/1999US5874769 Mosfet isolation structure with planar surface
02/23/1999US5874768 Semiconductor device having a high breakdown voltage
02/23/1999US5874767 Semiconductor device including a lateral power device
02/23/1999US5874766 Semiconductor device having an oxynitride film
02/23/1999US5874765 Semiconductor device and method for fabricating the same
02/23/1999US5874764 Modular MOSFETS for high aspect ratio applications
02/23/1999US5874763 Integrated circuits having improved electrostatic discharge capability
02/23/1999US5874761 Semiconductor memory device with three-dimensional cluster distribution
02/23/1999US5874760 4F-square memory cell having vertical floating-gate transistors with self-aligned shallow trench isolation
02/23/1999US5874759 Flash memory cell and method of fabricating the same
02/23/1999US5874758 Buried strap trench cell yielding an extended transistor
02/23/1999US5874757 Dual-packed capacitor DRAM cell structure
02/23/1999US5874756 Semiconductor storage device and method for fabricating the same
02/23/1999US5874753 Field effect transistor
02/23/1999US5874745 Thin film transistor with carbonaceous gate dielectric
02/23/1999US5874739 Arrangement for shadow-casting lithography
02/23/1999US5874705 Method of and apparatus for microwave-plasma production
02/23/1999US5874704 Low inductance large area coil for an inductively coupled plasma source
02/23/1999US5874379 Barium-strontium-tantalum titanate layer coated onto storage electrode layer of semiconductor capacitor; low leakage current
02/23/1999US5874369 Method for forming vias in a dielectric film
02/23/1999US5874368 Silicon nitride from bis(tertiarybutylamino)silane
02/23/1999US5874367 Method of treating a semi-conductor wafer
02/23/1999US5874366 Method for etching a semiconductor substrate and etching system
02/23/1999US5874365 Semiconductor wafer etching method
02/23/1999US5874364 Forming ruthenium or ruthenium oxide film by vapor deposition of ruthenium, 2,5-dimethyl-3,5-heptanedione complex
02/23/1999US5874363 Polycide etching with HCL and chlorine
02/23/1999US5874362 Bromine and iodine etch process for silicon and silicides