Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/1999
05/25/1999US5907077 Method and apparatus for treatment of freon gas
05/25/1999US5906951 Strained Si/SiGe layers on insulator
05/25/1999US5906950 Bombardment of pattern film with hydrogen iodide ions, etching
05/25/1999US5906949 Efficient and noncontaminated planarization using alkaline aqueous slurry containing sialon abrasive particles
05/25/1999US5906948 Method for etching high aspect-ratio multilevel contacts
05/25/1999US5906912 Crosslinking a soluble electroconductive polymer to obtain film having a sheet resistance of 10.sup.10 .omega./.quadrature. or less; forming a pattern by coating with a silicon-containing resist, and effecting exposure and
05/25/1999US5906911 Pattern exposing photoresits film to form first pattern, forming an etching and further pattern resistant film in the first pattern, exposing and developing photoresist to form second pattern, etching substrate twice
05/25/1999US5906910 Multi-level photoresist profile method
05/25/1999US5906903 Process tolerance calculating method relating exposure amount and focal point position to allowable dimension value
05/25/1999US5906902 Manufacturing system error detection
05/25/1999US5906901 Alignment method and exposure apparatus for use in such alignment method
05/25/1999US5906866 High speed hydrogen reduction of tungsten hexafluoride without the use of silane to form a tungsten film
05/25/1999US5906861 Heating the substrate, supplying a mixture of the gases tetramethylcyclotetrasiloxane, trimethylborate, trimethylphosphite, and oxygen to vapor deposit an inorganic coatings
05/25/1999US5906860 The apparatus permitting efficiently rotating a spin chuck, which holds a wafer, and a cup so as to improve the through-put and product yield, and to provide a resist treating method.
05/25/1999US5906859 Pyrolysis of hydrogen silesesquioxane resin coating to form silicon dioxide ceramic
05/25/1999US5906754 Apparatus integrating pad conditioner with a wafer carrier for chemical-mechanical polishing applications
05/25/1999US5906708 Vapor depositing an etching-stop dielectric layer
05/25/1999US5906706 Wire guide for a bonding machine
05/25/1999US5906700 Method of manufacturing circuit module
05/25/1999US5906687 Filling a tank with liquid applied with ultrasonic vibration, driving cleaner with vibration of the liquid and causing cleaner to come in contact with the cleaning target in a prefered area, thereby scrub-cleaning the surface of target
05/25/1999US5906684 Method of holding substrate and substrate holding system
05/25/1999US5906683 Lid assembly for semiconductor processing chamber
05/25/1999US5906682 Flip chip underfill system and method
05/25/1999US5906681 Cross-section sample staining tool
05/25/1999US5906680 Method and apparatus for low temperature, low pressure chemical vapor deposition of epitaxial silicon layers
05/25/1999US5906670 Spraying toward substrate aerosol droplets of metal salt dissolved in volatile solvent, desolventizing and reacting droplets while airborne with gas phase reagent to form a metal or metal compound to be coated onto substrate
05/25/1999US5906533 Infrared heater to soften a bonding agent for semiconductor wafer
05/25/1999US5906532 Method for polishing semiconductor substrate and apparatus for the same
05/25/1999US5906484 Vertical continuous oven
05/25/1999US5906472 Apparatus for removing and storing semiconductor device trays
05/25/1999US5906469 Apparatus and method for detecting and conveying substrates in cassette
05/25/1999US5906429 Optical illumination device
05/25/1999US5906312 Solder bump for flip chip assembly and method of its fabrication
05/25/1999US5906310 Packaging electrical circuits
05/25/1999US5906309 Solder bump measuring method and apparatus
05/25/1999US5906308 Capillary for use in a wire bonding apparatus
05/25/1999CA2131669C Reticle having a number of subfields
05/25/1999CA2131100C Crystallographically aligned ferroelectric films usable in memories and method of crystallographically aligning perovskite films
05/20/1999WO1999025169A1 Multiple head dispensing system and method
05/20/1999WO1999025063A1 Electrostatic chuck
05/20/1999WO1999025030A1 Semiconductor substrate and method for making the same
05/20/1999WO1999025026A1 Circuitry with at least one capacitor and process for producing the same
05/20/1999WO1999025025A1 Mos transistor and process for producing the same
05/20/1999WO1999025024A1 Quantum ridges and tips
05/20/1999WO1999025023A1 Asic routing architecture
05/20/1999WO1999025021A1 Preventing boron penetration through thin gate oxide of p-channel devices in advanced cmos technology
05/20/1999WO1999025020A1 Method for producing integrated circuits
05/20/1999WO1999025019A1 Method for thinning semiconductor wafers with circuits and wafers made by the same
05/20/1999WO1999025018A1 Semiconductor device having an improved isolation region and process of fabrication thereof
05/20/1999WO1999025017A1 Apparatus for retaining a workpiece
05/20/1999WO1999025016A1 Method of semiconductor device fabrication
05/20/1999WO1999025015A1 Self-cleaning etch process
05/20/1999WO1999025014A1 Dielectric element and manufacturing method therefor
05/20/1999WO1999025013A1 Low temperature metal fill regions for ohmic contacts and via openings
05/20/1999WO1999025012A1 ELIMINATION OF THE TITANIUM NITRIDE FILM DEPOSITION IN TUNGSTEN PLUG TECHNOLOGY USING PE-CVD-Ti AND IN-SITU PLASMA NITRIDATION
05/20/1999WO1999025007A1 Multi-electrode electrostatic chuck having fuses in hollow cavities
05/20/1999WO1999025006A2 Electrostatic chuck having improved gas conduits
05/20/1999WO1999025005A1 Method and apparatus for reducing thermal gradients within a ceramic wafer support pedestal
05/20/1999WO1999025004A1 Integrated manufacturing tool comprising electroplating, chemical-mechanical polishing, clean and dry stations, and method therefor
05/20/1999WO1999025003A2 Manufacture of a semiconductor device with a poly-emitter bipolar transistor
05/20/1999WO1999024868A1 Method of molecular-scale pattern imprinting at surfaces
05/20/1999WO1999024861A1 Three-mirror system for lithographic projection, and projection apparatus comprising such a mirror system
05/20/1999WO1999024801A1 Generator for generating voltage proportional to absolute temperature
05/20/1999WO1999024763A1 Dehumidification/humidification air supply apparatus
05/20/1999WO1999024637A1 Method for annealing an amorphous film using microwave energy
05/20/1999WO1999024635A1 Method of fabricating iridium-based materials and structures on substrates, and iridium source reagents therefor
05/20/1999WO1999024218A1 Manufacturing a memory disk or semiconductor device using an abrasive polishing system, and polishing pad
05/20/1999WO1999024176A1 Workpiece cleaning element with improved rib configuration
05/20/1999WO1999016124A3 Method for producing insulations grooves in a substrate
05/20/1999DE19852735A1 Substrate drying method for e.g. semiconductor wafer
05/20/1999DE19852256A1 Etching of platinum film to form electrode
05/20/1999DE19851382A1 Producing compound semiconductor hereto-junction bipolar transistor
05/20/1999DE19820488A1 Semiconductor device produced by dry etching a narrow connection via
05/20/1999DE19751109A1 Production of reliable microcircuit packages
05/20/1999DE19750060A1 Annular support having a high strength plastic annular area with a hard peripheral region
05/20/1999DE19749378A1 MOS-Transistor und Verfahren zu dessen Herstellung MOS transistor and method of producing the
05/20/1999CA2309618A1 Multiple head dispensing system and method
05/19/1999EP0917360A2 Solid-state image sensing apparatus, method for driving the same and camera
05/19/1999EP0917204A1 Interconnection between MOS and capacitor
05/19/1999EP0917203A2 Gain cell DRAM structure and method of producing the same
05/19/1999EP0917202A1 Integrated circuit having embedded memory with electromagnetic shield
05/19/1999EP0917201A2 Complementary MOS semiconductor device
05/19/1999EP0917199A2 Improvements in or relating to semiconductor devices
05/19/1999EP0917198A1 Semiconductor device packaging process
05/19/1999EP0917195A1 Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
05/19/1999EP0917194A2 Alignment of a contact hole
05/19/1999EP0917193A1 Laminated SOI substrate and producing method thereof
05/19/1999EP0917192A1 Method of determining the model of oxygen precipitation behaviour in a silicon monocrystalline wafer, method of determining a process for producing silicon monocrystalline wafers using said model, and recording medium carrying a program for determining the oxygen precipitation behaviour model in a silicon monocrystalline wafer
05/19/1999EP0917191A2 Electronic component unit, electronic assembly using the unit, and method for manufacturing the electronic component unit
05/19/1999EP0917190A2 Circuit support board
05/19/1999EP0917189A1 Method for mounting encapsulated body on mounting board and optical converter
05/19/1999EP0917188A2 Method for heat treatment of SOI wafer and SOI wafer heat-treated by the method
05/19/1999EP0917187A2 Method of etching aluminium-based layer
05/19/1999EP0917186A2 Integrated capacitors for microwave circuits
05/19/1999EP0917185A1 Deposition process of in-situ doped polysilicon layers
05/19/1999EP0917184A2 Electronic coatings having low dielectric constant
05/19/1999EP0917183A2 Clean box
05/19/1999EP0917150A2 Sensing methodology for a 1T/1C ferroelectric memory
05/19/1999EP0917068A2 Semiconductor integrated circuit
05/19/1999EP0917001A1 Negative photoresist compositions and use thereof
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