Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1999
06/02/1999DE19840385A1 Integrated circuit trench isolation includes an oxide resistant nitride layer
06/02/1999DE19829292A1 Integrated circuit defect detection
06/02/1999DE19820474A1 Semiconductor component e.g. bipolar transistor
06/02/1999DE19817749A1 Semiconductor component has a corrosion resistant connection section inserted in a fusible link
06/02/1999DE19815869C1 Stack capacitor production process involves reverse doping to eliminate p-n junction
06/02/1999DE19813741A1 Semiconductor device has a stopper layer below a contact via connecting two wiring levels
06/02/1999DE19803424C1 Semiconductor insulator structure with reduced field strength at surface, esp. for component technology silicon carbide
06/02/1999DE19752713A1 UV-Optisches System mit reduzierter Alterung UV-optical system with reduced aging
06/02/1999DE19751911A1 Manufacturing LED with hermetically sealed casing
06/02/1999DE19751740A1 Integrated electronic circuit manufacturing method, e.g. for CMOS BiCMOS
06/02/1999DE19751487A1 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate Method and apparatus for the thermal connection of connecting surfaces of two substrates
06/02/1999DE19750992A1 Halbleiterbauelement Semiconductor device
06/02/1999DE19750965A1 High capacitance charge storage capacitor for a DRAM
06/02/1999DE19750340A1 Integrated CMOS circuit, e.g. for DRAM, logic
06/02/1999CN1218577A Laminated structure stable for climate and corrosion
06/02/1999CN1218576A Semiconductor device shielded by an array of electrically conducting pins and manufacture thereof
06/02/1999CN1218559A Thermal treatment of positive photoresist composition
06/02/1999CN1218299A Semiconductor device and method of manufacturing the same
06/02/1999CN1218298A MOS transistor and thereof manufacturing method
06/02/1999CN1218297A Semiconductor device and method of fabricating the same
06/02/1999CN1218296A Dielectric separate type semiconductor device
06/02/1999CN1218295A Reduced parasitic leakage in semiconductor devices
06/02/1999CN1218294A Nonvolatile PMOS two transistor memory cell and array
06/02/1999CN1218293A Capacitor and method of manufacturing the same
06/02/1999CN1218292A Semiconductor device
06/02/1999CN1218291A Semiconductor device
06/02/1999CN1218290A Semiconductor integrated circuit device having dummy bonding wires
06/02/1999CN1218289A Semiconductor device
06/02/1999CN1218288A Semiconductor device and manufacturing method thereof
06/02/1999CN1218287A Spacers to block deep junction implants and silicide formation in integrated circuits
06/02/1999CN1218286A Semiconductor device and method of forming the same
06/02/1999CN1218284A Process for integrated circuit wiring
06/02/1999CN1218283A Fabrication method of semiconductor device using selective epitaxial growth
06/02/1999CN1218282A Titanium film forming method
06/02/1999CN1218281A Improved dielectric material and process for manufacture of integrated circuit device
06/02/1999CN1218280A Method and apparatus for chemically grinding process for manufacture of integrated circuits
06/02/1999CN1218279A Method for selectively etching silicon nitride film from silicon oxide film
06/02/1999CN1218278A Method for pattering insulator film by electron beam irradiation
06/02/1999CN1218277A Method of manufacturing semiconductor devices
06/02/1999CN1218276A Ultra-shallow semiconductor junction formation
06/02/1999CN1218275A Semiconductor device manufacturing method
06/02/1999CN1218274A Hard etch mask
06/02/1999CN1218262A Semiconductor memory having space-efficient layout
06/02/1999CN1218261A Semiconductor storage device
06/02/1999CN1218077A PH-buffered slurry and use thereof for polishing
06/01/1999US5909637 Copper adhesion to a diffusion barrier surface and method for same
06/01/1999US5909636 Method of forming a landing pad structure in an integrated circuit
06/01/1999US5909635 Cladding of an interconnect for improved electromigration performance
06/01/1999US5909634 Method and apparatus for forming solder on a substrate
06/01/1999US5909633 Method of manufacturing an electronic component
06/01/1999US5909631 Method of making ohmic contact between a thin film polysilicon layer and a subsequently provided conductive layer and integrated circuitry
06/01/1999US5909630 Field isolation process
06/01/1999US5909629 Semiconductor processing method of forming field oxide regions on a semiconductor substrate
06/01/1999US5909628 Reducing non-uniformity in a refill layer thickness for a semiconductor device
06/01/1999US5909627 Process for production of thin layers of semiconductor material
06/01/1999US5909626 SOI substrate and fabrication process therefor
06/01/1999US5909625 Method for forming layer of hemispherical grains and for fabricating a capacitor of a semiconductor device
06/01/1999US5909624 Method of making integration of high value capacitor with ferroelectric memory
06/01/1999US5909623 Manufacturing method of semiconductor device
06/01/1999US5909622 Asymmetrical p-channel transistor formed by nitrided oxide and large tilt angle LDD implant
06/01/1999US5909621 Single-side corrugated cylindrical capacitor structure of high density DRAMs
06/01/1999US5909620 Method for a ring-like capacitor in a semiconductor memory device
06/01/1999US5909618 Method of making memory cell with vertical transistor and buried word and body lines
06/01/1999US5909617 In an integrated circuit
06/01/1999US5909616 Method of forming CMOS circuitry
06/01/1999US5909615 Method for making a vertically redundant dual thin film transistor
06/01/1999US5909406 Semiconductor memory device
06/01/1999US5909405 Nonvolatile semiconductor memory
06/01/1999US5909390 Techniques of programming and erasing an array of multi-state flash EEPROM cells including comparing the states of the cells to desired values
06/01/1999US5909389 Semiconductor memory device using ferroelectric capacitor
06/01/1999US5909388 Dynamic random access memory circuit and methods therefor
06/01/1999US5909355 Ceramic electrostatic chuck and method of fabricating same
06/01/1999US5909354 Electrostatic chuck member having an alumina-titania spray coated layer and a method of producing the same
06/01/1999US5909276 Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
06/01/1999US5909272 Stage and exposure apparatus using same
06/01/1999US5909142 Semiconductor integrated circuit device having burn-in test capability and method for using the same
06/01/1999US5909140 Circuit for controlling the threshold voltage in a semiconductor device
06/01/1999US5909137 Voltage adder/subtractor circuit with two differential transistor pairs
06/01/1999US5909128 FETs logic circuit
06/01/1999US5909123 Method for performing reliability screening and burn-in of semi-conductor wafers
06/01/1999US5909059 Semiconductor device having contact plug and method for manufacturing the same
06/01/1999US5909057 Integrated heat spreader/stiffener with apertures for semiconductor package
06/01/1999US5909053 Lead frame and method for manufacturing same
06/01/1999US5909052 Semiconductor device having plural chips with the sides of the chips in face-to-face contact with each other in the same crystal plane
06/01/1999US5909051 Minority carrier semiconductor devices with improved stability
06/01/1999US5909048 Micro-machining minute hollow using native oxide membrane
06/01/1999US5909047 Semiconductor memory device
06/01/1999US5909046 Semiconductor integrated circuit device having stable input protection circuit
06/01/1999US5909044 Process for forming a high density semiconductor device
06/01/1999US5909043 Sacrificial oxygen sources to prevent reduction of oxygen containing materials
06/01/1999US5909042 Electrical component having low-leakage current and low polarization fatigue made by UV radiation process
06/01/1999US5909034 Electronic device for testing bonding wire integrity
06/01/1999US5909031 Ion implanter electron shower having enhanced secondary electron emission
06/01/1999US5909030 Pattern transfer apparatus, an operation management system thereof, and an operation management system for a semiconductor manufacture apparatus
06/01/1999US5909010 Chip size package
06/01/1999US5909009 Laminate organic resin wiring board and method of producing the same
06/01/1999US5908791 Method of forming a polycide gate of a semiconductor device
06/01/1999US5908738 Undercoating composition for photolithography
06/01/1999US5908735 Method of removing polymer of semiconductor device
06/01/1999US5908733 The present invention relates to electron beam exposure, and more particularly to that for drawing such a pattern as an ic (integrated circuit) directly on a semiconductor wafer.