Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1999
06/01/1999US5908692 Ordered organic monolayers and methods of preparation thereof
06/01/1999US5908672 Method and apparatus for depositing a planarized passivation layer
06/01/1999US5908662 Method and apparatus for reducing particle contamination
06/01/1999US5908661 Apparatus and method for spin coating substrates
06/01/1999US5908659 Method for reducing the reflectivity of a silicide layer
06/01/1999US5908658 Process for forming thin film metal oxide materials having improved electrical properties
06/01/1999US5908657 The present invention relates to a coating apparatus, particularly, to a spinner type coating apparatus in which a surface of an object to be coated, which is disposed on a spin chuck, is coated with a process solution. a
06/01/1999US5908602 Apparatus for generation of a linear arc discharge for plasma processing
06/01/1999US5908565 Line plasma vapor phase deposition apparatus and method
06/01/1999US5908530 Apparatus for chemical mechanical polishing
06/01/1999US5908510 Residue removal by supercritical fluids
06/01/1999US5908509 One part ammonium hydroxide, two parts hydrogen peroxide, and 300-600 parts deionized water together with a trace of high purity surfactant.
06/01/1999US5908508 Gas diffuser plate assembly and RF electrode
06/01/1999US5908504 Method for tuning barrel reactor purge system
06/01/1999US5908334 Electrical connector for power transmission in an electrostatic chuck
06/01/1999US5908321 Semiconductor structure with stable pre-reacted particle and method for making
06/01/1999US5908320 High selectivity BPSG:TiSi2 contact etch process
06/01/1999US5908319 Cleaning and stripping of photoresist from surfaces of semiconductor wafers
06/01/1999US5908318 Method of forming low capacitance interconnect structures on semiconductor substrates
06/01/1999US5908317 Method of forming chip bumps of bump chip scale semiconductor package
06/01/1999US5908315 Method for forming a test structure to determine the effect of LDD length upon transistor performance
06/01/1999US5908314 Two-step metal salicide semiconductor process
06/01/1999US5908313 Method of forming a transistor
06/01/1999US5908312 Semiconductor device fabrication
06/01/1999US5908311 Method for forming a mixed-signal CMOS circuit that includes non-volatile memory cells
06/01/1999US5908310 In a semiconductor layer or wafer
06/01/1999US5908309 Fabrication method of semiconductor device with CMOS structure
06/01/1999US5908308 Use of borophosphorous tetraethyl orthosilicate (BPTEOS) to improve isolation in a transistor array
06/01/1999US5908307 Fabrication method for reduced-dimension FET devices
06/01/1999US5908306 Method for making a semiconductor device exploiting a quantum interferences effect
06/01/1999US5908304 Mass memory and method for the manufacture of mass memories
06/01/1999US5908292 Semiconductor processing furnace outflow cooling system
06/01/1999US5908281 Coaxial drive loader arm
06/01/1999US5908150 Method for inner lead bonding
06/01/1999US5908042 Basket for cleaning semiconductor wafers and method of cleaning semiconductor wafers using the same
06/01/1999US5907900 Device for selectively using position determination chuck or camera to correct position of a component for mounting on printed circuit board
06/01/1999US5907895 Wafer tweezer assembling device
06/01/1999CA2165069C Device for coating substrates in semiconductor manufacture
06/01/1999CA2139140C A method for fabricating a semiconductor photonic integrated circuit
06/01/1999CA2137340C Exclusive or logic gate tree and frequency multiplier incorporating said tree
06/01/1999CA2129403C Ion implanting apparatus and ion implanting method
06/01/1999CA2106713C Structure and method of making a capacitor for an integrated circuit
06/01/1999CA2002305C Method to produce a display screen with a matrix of transistors provided with an optical mask
05/1999
05/27/1999WO1999026458A1 Multilayer printed wiring board and method for manufacturing the same
05/27/1999WO1999026296A2 A SEMICONDUCTOR DEVICE OF SiC AND A TRANSISTOR OF SiC HAVING AN INSULATED GATE
05/27/1999WO1999026295A1 High voltage semiconductor component
05/27/1999WO1999026293A2 Semiconductor component and manufacturing method for semiconductor component
05/27/1999WO1999026291A2 Semiconductor component and manufacturing method for semiconductor components
05/27/1999WO1999026288A1 Semiconductor device and method for manufacturing the same
05/27/1999WO1999026287A1 Silicon film used as a substrate for semiconductor circuits in cards
05/27/1999WO1999026284A1 Ferroelectric memory or a method of producing the same
05/27/1999WO1999026283A1 Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
05/27/1999WO1999026282A1 Method of producing semiconductor wafer
05/27/1999WO1999026281A1 Uhv-compatible in-situ pre-metallization clean and metallization of semiconductor wafers
05/27/1999WO1999026280A1 Device for holding semiconductor wafer
05/27/1999WO1999026279A1 Exposure method and aligner
05/27/1999WO1999026277A1 Systems and methods for plasma enhanced processing of semiconductor wafers
05/27/1999WO1999026276A1 Apparatus for cleaning semiconductor wafers
05/27/1999WO1999026267A1 A plasma generating apparatus having an electrostatic shield
05/27/1999WO1999026113A1 Device and method for flat holding of a substrate in microlithography
05/27/1999WO1999026097A1 Mirror projection system for a scanning lithographic projection apparatus, and lithographic apparatus comprising such a system
05/27/1999WO1999025907A1 A method of growing a buffer layer using molecular beam epitaxy
05/27/1999WO1999025906A1 Chemical conversion fluid for forming metal oxide film
05/27/1999WO1999025905A1 Clamshell apparatus for electrochemically treating semiconductor wafers
05/27/1999WO1999025896A1 Method and apparatus for misted deposition of thin films
05/27/1999WO1999025895A1 Method and apparatus for misted deposition of thin films
05/27/1999WO1999025568A1 A method for minimizing the critical dimension growth of a feature on a semiconductor wafer
05/27/1999WO1999025520A1 Method and apparatus for modeling a chemical mechanical polishing process
05/27/1999WO1999025494A1 All-surface biasable and/or temperature-controlled electrostatically-shielded rf plasma source
05/27/1999WO1999012188A3 Method of manufacturing a semiconductor device with a schottky junction
05/27/1999WO1999012045A3 Apparatus for measuring minority carrier lifetimes in semiconductor materials
05/27/1999WO1999008317B1 Integrated electric circuit with a passivation layer
05/27/1999WO1999004606A9 Compact microwave downstream plasma system
05/27/1999WO1999001893A3 Method for producing layered structures on a substrate, substrate and semiconductor components produced according to said method
05/27/1999WO1998056040A3 Electrostatic chucks
05/27/1999WO1998052217A3 Method of forming a chip scale package, and a tool used in forming the chip scale package
05/27/1999WO1998050944A3 Method and apparatus for self-doping negative and positive electrodes for silicon solar cells and other devices
05/27/1999WO1998047178A3 Method and apparatus for thin film aluminum planarization
05/27/1999DE19854414A1 Light emitting module
05/27/1999DE19853441A1 MOS transistor has a self-aligned sequence of lightly, moderately and heavily doped impurity layers
05/27/1999DE19849952A1 Electronic component, e.g. piezoelectric resonator
05/27/1999DE19848283A1 Semiconductor memory with improved driver for read-out amplifier
05/27/1999DE19836164A1 Integrated circuit trench isolation includes an oxidation resistant nitride layer
05/27/1999DE19833481A1 Projection optical system for exposure system used in semiconductor device, liquid crystal display element manufacture
05/27/1999DE19808326A1 Diamond-based microactuator for ink jet spray heads
05/27/1999DE19800647C1 SOI HV switch with FET structure
05/27/1999DE19750316A1 Silicon foil carrier manufacturing method for chip card
05/27/1999DE19750167A1 Verfahren zur Herstellung integrierter Schaltkreise A process for the production of integrated circuits
05/27/1999CA2310280A1 Semiconductor component and manufacturing method for semiconductor component
05/27/1999CA2310057A1 A method for minimizing the critical dimension growth of a feature on a semiconductor wafer
05/27/1999CA2310005A1 Ferroelectric memory or a method of producing the same
05/26/1999EP0918356A1 Semiconductor device and manufacturing method thereof
05/26/1999EP0918355A2 Solder bump input/output pad for a surface mount circuit device
05/26/1999EP0918354A2 Wafer-scale assembly of chip-size packages
05/26/1999EP0918353A1 A method of manufacturing a recessed insulated gate field-effect semiconductor device
05/26/1999EP0918334A2 Magnetic memory
05/26/1999EP0918224A2 Signal processing circuit for electro-optic probe
05/26/1999EP0918100A1 Method and apparatus for producing homoepitaxial diamond thin film
05/26/1999EP0918081A1 Etching composition and use
05/26/1999EP0917741A2 Process for manufacturing an infrared-emitting luminescent diode