Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1999
06/17/1999WO1999029711A1 Self-addressable self-assembling microelectronic integrated systems, component devices, mechanisms, methods, and procedures for molecular biological analysis and diagnostics
06/17/1999WO1999029439A1 Photoresist coating process control with solvent vapor sensor
06/17/1999WO1999016132A3 Method for producing a plastic composite body and plastic composite body
06/17/1999WO1999009587A3 Method of etching copper for semiconductor devices
06/17/1999WO1999008057A3 Method and apparatus for drying substrates
06/17/1999WO1998040909A3 Method of forming etched structures comprising implantation steps
06/17/1999DE19857339A1 Czochralski crystal growth process uses mutually orthogonal current and magnetic field passage through the melt
06/17/1999DE19857253A1 Single crystal lifting equipment includes a winch positioning mechanism
06/17/1999DE19855476A1 Gallium nitride based semiconductor layer is formed by electron cyclotron resonance molecular beam epitaxy
06/17/1999DE19855394A1 Semiconductor substrate processing involves cleaning and forming an artificial oxide layer
06/17/1999DE19848743A1 Two-stage filter for interference signals
06/17/1999DE19846264A1 Ferro-electric random access memory
06/17/1999DE19844443A1 Photomask is washed with anodic or cathodic water after cleaned with a hot sulfuric acid and hydrogen peroxide mixture for effective removal of residual sulfuric acid from the cleaned surface
06/17/1999DE19842481A1 Stackable chip production involves forming insulation-filled slits in a wafer prior to chip separation
06/17/1999DE19833951A1 Substrate for integrated circuit with first semiconductor substrate layer
06/17/1999DE19831757A1 Multi-tank semiconductor wafer processing apparatus
06/17/1999DE19821777C1 DRAM capacitor production employs a side wall support structure and an etch-stop layer
06/17/1999DE19814152A1 Electronic component manufacturing method e.g. for SMD
06/17/1999DE19803186C1 Structured wafer production used in micro-mechanical sensor structure manufacture, without need for wafer edge lacquering or doping
06/17/1999DE19755975A1 Semiconductor wafer holder suitable also for other flat workpieces
06/17/1999DE19755088A1 Calibrated bonding device for bubble-free adhesive bonding of structured semiconductor wafers
06/17/1999DE19753790A1 Verfahren zur Untersuchung oder zum Strukturieren einer Oberflächenschicht Method for studying or for patterning a surface layer
06/17/1999DE19753448A1 Component taking-up from adhesive foil
06/17/1999CA2312777A1 Plasma reactor with a deposition shield
06/17/1999CA2312568A1 Self-addressable self-assembling microelectronic integrated systems, component devices, mechanisms, methods, and procedures for molecular biological analysis and diagnostics
06/16/1999EP0923138A2 Thin -film semiconductor device, its manufacture and display sytem
06/16/1999EP0923137A2 Trenched field effect transistor and method of its manufacture
06/16/1999EP0923135A1 Ferroelectric memory device
06/16/1999EP0923134A1 Active matrix circuit board and method of manufacturing it
06/16/1999EP0923133A1 Silicon on insulator device having an input/output protection
06/16/1999EP0923132A1 Semiconductor device
06/16/1999EP0923128A1 Semiconductor package and method for manufacturing the same
06/16/1999EP0923125A1 Method of making metallic interconnections in integrated circuits
06/16/1999EP0923124A2 A method and system of interconnecting conductors in an integrated circuit
06/16/1999EP0923122A2 A method of manufacturing an integrated circuit using chemical mechanical polishing and a chemical mechanical polishing system
06/16/1999EP0923121A1 Method for manufacturing thin film devices using the anisotropic reflectance technique
06/16/1999EP0923120A1 Method for manufacturing semiconductor device
06/16/1999EP0923119A2 Method of manufacturing a MOSFET
06/16/1999EP0923118A2 Method of manufacturing a MOSFET
06/16/1999EP0923117A1 Method of manufacture of single transistor ferroelectric memory cell using chemical-mechanical polishing
06/16/1999EP0923116A1 Process for manufacturing integrated multi-crystal silicon resistors in MOS technology and integrated MOS device comprising multi-crystal silicon resistors
06/16/1999EP0923115A1 Method for etching a silicon dioxide layer with a fluorocarbon plasma
06/16/1999EP0923114A2 Process for self-aligned implantation
06/16/1999EP0923113A2 Low temperature diffusion process for dopant concentration enhancement
06/16/1999EP0923112A1 Detergent for lithography
06/16/1999EP0923111A2 Semiconductor mounting apparatus with a reciprocating chip gripper
06/16/1999EP0923110A2 Cover tape for chip transportation and sealed structure
06/16/1999EP0923093A2 Vertical array capacitor
06/16/1999EP0923082A2 Semiconductor memory having a sense amplifier
06/16/1999EP0923000A2 Stage apparatus, exposure apparatus and device manufacturing method
06/16/1999EP0922999A2 Illumination optical system and illumination method
06/16/1999EP0922997A1 Phase shift mask and method of manufacturing phase shift mask
06/16/1999EP0922996A1 A lithographic process for device fabrication using a multilayer mask
06/16/1999EP0922991A2 Transverse electrical field type active matrix liquid crystal display apparatus and method for producing same
06/16/1999EP0922944A2 Method for manufacturing integrated structures including removing a sacrificial region
06/16/1999EP0922905A2 Improvements in or relating to methods and apparatus for the generation of water vapour
06/16/1999EP0922534A2 Slurry mixing apparatus and method
06/16/1999EP0922302A2 Lateral mos transistor device
06/16/1999EP0922301A1 Substrate with conductor formed of low-resistance aluminum alloy
06/16/1999EP0922300A1 Semiconductor device provided with low melting point metal bumps and process for producing same
06/16/1999EP0922298A1 Process for smoothening a substrate surface
06/16/1999EP0922294A1 High current ribbon beam ion implanter
06/16/1999EP0922262A2 Circuit simulation
06/16/1999EP0922198A1 Method and device for measuring the concentration of ions implanted in semiconductor materials
06/16/1999EP0922014A1 Unibody crucible and effusion source employing such a crucible
06/16/1999EP0921871A1 Removal of material by radiation applied at an oblique angle
06/16/1999EP0904604A4 Fabrication of high-density trench dmos using sidewall spacers
06/16/1999EP0886894A4 Contact carriers (tiles) for populating larger substrates with spring contacts
06/16/1999EP0702852B1 Manufacture of electronic devices comprising thin-film transistors
06/16/1999EP0673546B1 Method of producing semiconductor and insulation films
06/16/1999EP0537364B1 Apparatus and method for manufacturing semiconductor device
06/16/1999CN2324636Y Element in chip fastener for supporting semi-conductor chip
06/16/1999CN1220057A Electronic component, in particular OFW component using acoustical surface acoustic waves
06/16/1999CN1220008A Method for testing electronic components
06/16/1999CN1219985A Method and apparatus for growing oriented whisker arrays
06/16/1999CN1219837A Built-in circuit device assembly and its manufacturing method
06/16/1999CN1219801A Power source circuit of semiconductor integrated circuit
06/16/1999CN1219775A MIS semiconductor device and method for fabricating the same
06/16/1999CN1219774A Semiconductor device having selectively-grown contact pad
06/16/1999CN1219772A Method of forming semiconductor image sensor and structure
06/16/1999CN1219771A Semiconductor device and fabrication method thereof
06/16/1999CN1219766A Semiconductor device and method of manufacturing the same
06/16/1999CN1219765A Semiconductor element with crystal wafer applied and burnt beforehand and its method
06/16/1999CN1219764A Process for forming inter-level insulating layer and vapor phase deposition system and therein
06/16/1999CN1219763A Semiconductor device having sub-chip-scale package structure and method for forming same
06/16/1999CN1219762A Method and device for injecting glue to semiconductor crystal wafer
06/16/1999CN1219761A Reduced parasitic resistance and capacitance field effect transistor
06/16/1999CN1219760A Apparatus and method for manufacturing semiconductor device
06/16/1999CN1219759A Method for fabricating oxide layers of different thickness on semiconductor substrate
06/16/1999CN1219758A Washing method and device
06/16/1999CN1219757A Semiconductor wafer processing apparatus and method of controlling the same
06/16/1999CN1219756A Fabrication method of semiconductor device using ion implantation
06/16/1999CN1219755A Method for boron contamination reduction in IC fabrication
06/16/1999CN1219754A Mask blank and method of producing mask
06/16/1999CN1219753A Semiconductor device and method for manufacturing the same
06/16/1999CN1219752A Semiconductor wafer aligning system and aligning method thereby
06/16/1999CN1219741A Electrode modification using unzippable polymer paste
06/16/1999CN1219605A Apparatus for vaporizing and supplying material
06/16/1999CN1043704C Semiconductor device and method for forming same
06/16/1999CN1043703C Semiconductor device, method for producing same, and liquid crystal display including same
1 ... 5672 5673 5674 5675 5676 5677 5678 5679 5680 5681 5682 5683 5684 5685 5686 5687 5688 5689 5690 5691 5692 ... 6590