Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1999
06/22/1999US5915175 Method for forming a semiconductor device
06/22/1999US5915174 Semiconductor device and method for producing the same
06/22/1999US5915173 Thin film transistor and method for fabricating the same
06/22/1999US5915172 Method for manufacturing LCD and TFT
06/22/1999US5915171 Process of fabricating an antifuse structure
06/22/1999US5915170 Multiple part compliant interface for packaging of a semiconductor chip and method therefor
06/22/1999US5915169 Miniaturization
06/22/1999US5915167 Three dimensional structure memory
06/22/1999US5915164 Undercut-etching into electroconductive gallium nitride layer below masked portions of semi-dielectric aluminum nitride layer, then filling cavity with gallium nitride layer of opposite conductivity type to form p-n junction
06/22/1999US5915163 Method of manufacturing a semiconductor diode laser
06/22/1999US5914893 Programmable metallization cell structure and method of making same
06/22/1999US5914851 In a substrate
06/22/1999US5914774 Projection exposure apparatus with function to measure imaging characteristics of projection optical system
06/22/1999US5914773 Exposure apparatus and method using pulsed light and changing means to control both the light intensity and light emission timing
06/22/1999US5914626 Voltage clamping circuit for semiconductor devices
06/22/1999US5914625 Clock driver circuit and semiconductor integrated circuit device
06/22/1999US5914613 Membrane probing system with local contact scrub
06/22/1999US5914612 Tweezer probe and arm therefor
06/22/1999US5914607 Apparatus and methods for analyzing a sample solution, including first and second ion detectors
06/22/1999US5914568 For processing a target substrate
06/22/1999US5914536 Semiconductor device and soldering portion inspecting method therefor
06/22/1999US5914535 Flip chip-on-flip chip multi-chip module
06/22/1999US5914531 Semiconductor device having a ball grid array package structure using a supporting frame
06/22/1999US5914530 Semiconductor device
06/22/1999US5914526 Semiconductor device
06/22/1999US5914525 Semiconductor device
06/22/1999US5914524 Semiconductor device
06/22/1999US5914523 Semiconductor device trench isolation structure with polysilicon bias voltage contact
06/22/1999US5914522 Power semiconductor structure with lateral transistor driven by vertical transistor
06/22/1999US5914520 Micromechanical sensor device
06/22/1999US5914519 Air-gap spacer of a metal-oxide-semiconductor device
06/22/1999US5914518 Method of forming a metal contact to landing pad structure in an integrated circuit
06/22/1999US5914517 Trench-isolation type semiconductor device
06/22/1999US5914516 Buffer circuit with wide gate input transistor
06/22/1999US5914514 Two transistor flash EPROM cell
06/22/1999US5914513 Electronically tunable capacitor
06/22/1999US5914511 Circuit and method for a folded bit line memory using trench plate capacitor cells with body bias contacts
06/22/1999US5914510 Semiconductor memory device and method of manufacturing the same
06/22/1999US5914508 Two layer hermetic-like coating process for on-wafer encapsulation of GaAs MMIC's
06/22/1999US5914506 Charge coupled device having two-layer electrodes and method of manufacturing the same
06/22/1999US5914504 DRAM applications using vertical MISFET devices
06/22/1999US5914500 Junction termination for SiC Schottky diode
06/22/1999US5914499 High voltage silicon carbide semiconductor device with bended edge
06/22/1999US5914498 Semiconductor integrated circuit and method of fabricating same
06/22/1999US5914493 Charged-particle-beam exposure apparatus and methods with substrate-temperature control
06/22/1999US5914281 Apparatus for etching wafer
06/22/1999US5914280 Upper portion of trench pattern masked with photoresist is isotropically plasma etched, then the lower portion is anisotropically overetched to form bottom cavity without damaging dielectric layer
06/22/1999US5914279 Integrated circuits
06/22/1999US5914278 Backside etch process chamber and method
06/22/1999US5914277 Masking and dry etching smooth film of organic antireflectivity coating and underlying metallic wiring layer
06/22/1999US5914276 Methods of forming electrically conductive lines using nitrogen and chlorine containing gas mixtures
06/22/1999US5914275 Polishing dielectric surface using aqueous cerium oxide abrasive slurry having low impurity concentration
06/22/1999US5914274 Substrate on which bumps are formed and method of forming the same
06/22/1999US5914219 Radiation-sensitive mixture and the production of relief structures having improved contrast
06/22/1999US5914218 Spring contact anchored on one end, the free portion compliantly contacts a second contact pad, electrically interconnecting the two contact pads; spring compensates for thermal and mechanical variations
06/22/1999US5914204 Phase shifting mask and a manufacturing method therefor
06/22/1999US5914202 Providing reticle substrate, depositing partially transmitting phase shift film, opaque film, photoresist, multilevel profile, etching
06/22/1999US5914183 Porous semiconductor material
06/22/1999US5914053 Apparatus and method for double-sided polishing semiconductor wafers
06/22/1999US5914052 Wet etch method and apparatus
06/22/1999US5914050 Purged lower liner
06/22/1999US5914018 Sputter target for eliminating redeposition on the target sidewall
06/22/1999US5914001 In-situ etch of CVD chamber
06/22/1999US5914000 Apparatus for manufacturing semiconductor device and method of removing silicon oxidation film
06/22/1999US5913985 Fixture and method for securing electronic modules during wet processing
06/22/1999US5913981 Method of rinsing and drying semiconductor wafers in a chamber with a moveable side wall
06/22/1999US5913980 Applying caustic solution to remove silicon oxide impurities; less hazardous evolved gases, less dangerous to skin
06/22/1999US5913979 Immersing in cleaning solution of isopropanol and ethyl lactate, rinsing with deionized water
06/22/1999US5913978 Apparatus and method for regulating pressure in two chambers
06/22/1999US5913974 Heat treating method of a semiconductor single crystal substrate
06/22/1999US5913721 Ventilation hood with enhanced particle control and method of using
06/22/1999US5913719 Workpiece holding mechanism
06/22/1999US5913718 Head for a chemical mechanical polishing apparatus
06/22/1999US5913712 Scratch reduction in semiconductor circuit fabrication using chemical-mechanical polishing
06/22/1999US5913652 Substrate processing apparatus
06/22/1999US5913455 Apparatus for rapid dispensing of minute quantities of viscous material
06/22/1999US5913429 Wafer supporting and/or conveying apparatus
06/22/1999CA2249163A1 Process for repairing data transmission lines of imagers
06/17/1999WO1999030543A1 Method for making circuit elements for a z-axis interconnect
06/17/1999WO1999030370A1 Method of manufacturing semiconductor device and semiconductor device, method of manufacturing electrooptic device and electrooptic device, and electronic apparatus employing it
06/17/1999WO1999030369A2 Thin film transistors and electronic devices comprising such
06/17/1999WO1999030366A1 Residue-free method of assembling and disassembling a pressed joint with low thermal resistance
06/17/1999WO1999030364A1 Integrated circuit die assembly and method for making same
06/17/1999WO1999030363A2 Semiconductor device and method of manufacturing such a device
06/17/1999WO1999030362A1 Method and apparatuses for making z-axis electrical connections
06/17/1999WO1999030361A1 Spacer formation for precise salicide formation
06/17/1999WO1999030360A1 System and method for etching organic anti-reflective coating from a substrate
06/17/1999WO1999030359A1 New etch process for forming high aspect ratio trenches in silicon
06/17/1999WO1999030358A2 Ion implantation process
06/17/1999WO1999030357A1 Method for etching silicon oxynitride and inorganic antireflection coatings
06/17/1999WO1999030355A1 Wet processing methods for the manufacture of electronic components
06/17/1999WO1999030353A1 Surface modification of semiconductors using electromagnetic radiation
06/17/1999WO1999030347A1 Method and device for improving surfaces
06/17/1999WO1999030343A1 Correction device for correcting the lens defects in particle-optical apparatus
06/17/1999WO1999030342A1 Correction device for correcting the spherical aberration in particle-optical apparatus
06/17/1999WO1999030174A1 Test system with mechanical alignment for semiconductor chip scale packages and dice
06/17/1999WO1999030130A2 Method for investigating or structuring a surface layer
06/17/1999WO1999029926A1 Process for low temperature cvd using bi amides
06/17/1999WO1999029925A1 Process for low temperature cvd using bi carboxylates
06/17/1999WO1999029923A1 Plasma reactor with a deposition shield
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