Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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06/29/1999 | US5917209 Semiconductor device including via hole and isolating circumferential member |
06/29/1999 | US5917208 For transferring electric charges |
06/29/1999 | US5917207 Programmable polysilicon gate array base cell architecture |
06/29/1999 | US5917206 Disposed on a semiconductor chip |
06/29/1999 | US5917205 Photolithographic alignment marks based on circuit pattern feature |
06/29/1999 | US5917204 Insulated gate bipolar transistor with reduced electric fields |
06/29/1999 | US5917203 Lateral gate vertical drift region transistor |
06/29/1999 | US5917200 Optical semiconductor device |
06/29/1999 | US5917199 Solid state imager including TFTS with variably doped contact layer system for reducing TFT leakage current and increasing mobility and method of making same |
06/29/1999 | US5917198 Gate electrodes and matrix lines made of W/Ta alloy for LCD apparatus |
06/29/1999 | US5917197 On a semiconductor wafer |
06/29/1999 | US5917191 Apparatus for measuring surface topography |
06/29/1999 | US5917169 Method and apparatus of identification of characters formed on a plurality of tablets of silicon |
06/29/1999 | US5917024 Acid labile photoactive composition |
06/29/1999 | US5916995 Superior transmissivity to deep ultraviolet light and excimer laser, improved thermal resistance and storage stability after exposure |
06/29/1999 | US5916855 Chemical-mechanical polishing slurry formulation and method for tungsten and titanium thin films |
06/29/1999 | US5916824 Acid gas in airtight chamber |
06/29/1999 | US5916823 Method for making dual damascene contact |
06/29/1999 | US5916822 Method of etching a substrate by means of chemical beams |
06/29/1999 | US5916821 Method for producing sublithographic etching masks |
06/29/1999 | US5916820 Thin film forming method and apparatus |
06/29/1999 | US5916819 Planarization fluid composition chelating agents and planarization method using same |
06/29/1999 | US5916733 Method of fabricating a semiconductor device |
06/29/1999 | US5916696 Crack-resistant when the lead frame is bent to an angle of at least 82 degrees with a bend radius of about 150 mu.m to about 300 mu.m. |
06/29/1999 | US5916690 Integrated circuits |
06/29/1999 | US5916689 Electrostatic chuck with an impregnated, porous layer that exhibits the Johnson-Rahbeck effect |
06/29/1999 | US5916688 Siloxanepolyimidepolyamic acid copolymers; chemical resistance |
06/29/1999 | US5916640 An atomizer comprising a source of compressed gas to atomize the liquid to form aerosol droplets;treated by increasing the charge by contact with high voltage electrode and passed through separator to remove large droplets; even |
06/29/1999 | US5916634 Refractory based thin film useful for diffusion barrier and micromachining applications |
06/29/1999 | US5916631 Method and apparatus for spin-coating chemicals |
06/29/1999 | US5916626 HMDS supplying apparatus |
06/29/1999 | US5916513 Method and apparatus for affixing components to a substrate when a manufacturing line ceases operation |
06/29/1999 | US5916476 Oxide magnetic materials, making method, antenna coils, and inductance elements |
06/29/1999 | US5916455 Method and apparatus for generating a low pressure plasma |
06/29/1999 | US5916453 Methods of planarizing structures on wafers and substrates by polishing |
06/29/1999 | US5916411 Carbon electrode, cooling device in contact with electrode, temperature sensor, heat insulator covering, temperature controller |
06/29/1999 | US5916401 Coating of substrates |
06/29/1999 | US5916374 Supporting vertically, simultaneously spraying front and back with aqueous alkaline cleaning solution |
06/29/1999 | US5916370 Semiconductor processing chamber having diamond coated components |
06/29/1999 | US5916366 Substrate spin treating apparatus |
06/29/1999 | US5916245 High capacity gas storage and dispensing system |
06/29/1999 | US5916011 Process for polishing a semiconductor device substrate |
06/29/1999 | US5916009 Apparatus for applying an urging force to a wafer |
06/29/1999 | US5915977 System and interconnect for making temporary electrical connections with bumped semiconductor components |
06/29/1999 | US5915957 Method of transferring target substrates in semiconductor processing system |
06/29/1999 | US5915915 End effector and method for loading and unloading disks at a processing station |
06/29/1999 | US5915910 Semiconductor wafer transfer method and apparatus |
06/29/1999 | US5915756 Method to fill via holes between two conductive layers |
06/29/1999 | US5915755 Method for forming an interconnect for testing unpackaged semiconductor dice |
06/29/1999 | US5915753 Method of producing a high-density printed wiring board for mounting |
06/29/1999 | US5915752 Method of making connections to a semiconductor chip assembly |
06/29/1999 | US5915562 Transport module with latching door |
06/29/1999 | US5915462 High efficiency thermal interposer |
06/29/1999 | US5915414 Standardized gas isolation box (GIB) installation |
06/29/1999 | US5915396 Substrate processing apparatus |
06/29/1999 | CA2004436C Test chip for use in semiconductor fault analysis |
06/24/1999 | WO1999031733A1 Silicon oxynitride spacer for preventing over-etching during local interconnect formation |
06/24/1999 | WO1999031732A2 Semiconductor processing method and field effect transistor |
06/24/1999 | WO1999031731A2 Silicon oxide insulator (soi) semiconductor having selectively linked body |
06/24/1999 | WO1999031730A1 Formation of control and floating gates of semiconductor non-volatile memories |
06/24/1999 | WO1999031729A1 Reduced capacitance transistor with electro-static discharge protection structure and method for forming the same |
06/24/1999 | WO1999031728A1 A method and system for providing a tapered shallow trench isolation structure profile |
06/24/1999 | WO1999031727A1 Electronic device inspection system and method for manufacturing electronic device using the same |
06/24/1999 | WO1999031726A1 Method of eliminating buried contact resistance in integrated circuits |
06/24/1999 | WO1999031725A1 High integrity borderless vias with hsq gap filled patterned conductive layers |
06/24/1999 | WO1999031724A1 Post-lapping cleaning process for silicon wafers |
06/24/1999 | WO1999031723A1 Method of improving the flatness of polished semiconductor wafers |
06/24/1999 | WO1999031722A1 Barrier layer for copper metallizing |
06/24/1999 | WO1999031721A1 High k gate electrode |
06/24/1999 | WO1999031720A2 Thin film transistors and electronic devices comprising such |
06/24/1999 | WO1999031719A1 Semiconductor thin film, method of producing the same, apparatus for producing the same, semiconductor device and method of producing the same |
06/24/1999 | WO1999031718A1 Method for high temperature etching of patterned layers using an organic mask stack |
06/24/1999 | WO1999031715A1 PROCESS FOR THE CONTROL OF NOx GENERATED BY ETCHING OF SEMICONDUCTOR WAFERS |
06/24/1999 | WO1999031714A1 Single wafer load lock chamber for pre-processing and post-processing wafers in a vacuum processing system |
06/24/1999 | WO1999031713A2 Integrated material management module |
06/24/1999 | WO1999031712A1 Ion implanting apparatus and method |
06/24/1999 | WO1999031670A2 A symmetric segmented memory array architecture |
06/24/1999 | WO1999031669A1 Biasing method and structure for reducing band-to-band and/or avalanche currents during the erase of flash memory devices |
06/24/1999 | WO1999031667A1 Static memory cell with load circuit using a tunnel diode |
06/24/1999 | WO1999031586A1 Parallel test method |
06/24/1999 | WO1999031299A1 Electrodes for semiconductor electroplating apparatus and their application |
06/24/1999 | WO1999031290A1 Magnetron sputtering source |
06/24/1999 | WO1999031195A1 Abrasive, method of polishing wafer, and method of producing semiconductor device |
06/24/1999 | WO1999030840A1 Spin coating method and apparatus for liquid carbon dioxide systems |
06/24/1999 | WO1999021220A9 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film |
06/24/1999 | WO1999019527A3 Apparatus and method for utilizing a plasma density gradient to produce a flow of particles |
06/24/1999 | WO1999013545A3 Vaporization and deposition apparatus and process |
06/24/1999 | DE4244882C2 CMOS structure mfr. having twin walls |
06/24/1999 | DE19857354A1 Silicon wafers are ultrasonically cleaned in a cleaning solution of hydrofluoric acid and hydrogen peroxide or ozone |
06/24/1999 | DE19857059A1 Silicon on insulator component |
06/24/1999 | DE19856805A1 Trough insulation structure in silicon substrate |
06/24/1999 | DE19853260A1 Dryer for processed substrates |
06/24/1999 | DE19847440A1 IC has a local, buried, thick insulation layer region for reducing parasitic capacitance effects |
06/24/1999 | DE19831349A1 Semiconductor component with top line or wiring |
06/24/1999 | DE19821640A1 Power semiconductor component with semiconductor layer |
06/24/1999 | DE19818298C1 Super low-ohmic vertical MOSFET |
06/24/1999 | DE19811068C1 IC capacitor having tantalum nitride barrier layer containing a transition metal and/or a lanthanide |
06/24/1999 | DE19808245C1 Microelectronic semiconductor element manufacturing method |
06/24/1999 | DE19758348A1 Depth profile measuring method for detecting impurity in semiconductors |
06/24/1999 | DE19758339A1 Vertical bipolar transistor suitable for integration |