Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1999
06/29/1999US5917209 Semiconductor device including via hole and isolating circumferential member
06/29/1999US5917208 For transferring electric charges
06/29/1999US5917207 Programmable polysilicon gate array base cell architecture
06/29/1999US5917206 Disposed on a semiconductor chip
06/29/1999US5917205 Photolithographic alignment marks based on circuit pattern feature
06/29/1999US5917204 Insulated gate bipolar transistor with reduced electric fields
06/29/1999US5917203 Lateral gate vertical drift region transistor
06/29/1999US5917200 Optical semiconductor device
06/29/1999US5917199 Solid state imager including TFTS with variably doped contact layer system for reducing TFT leakage current and increasing mobility and method of making same
06/29/1999US5917198 Gate electrodes and matrix lines made of W/Ta alloy for LCD apparatus
06/29/1999US5917197 On a semiconductor wafer
06/29/1999US5917191 Apparatus for measuring surface topography
06/29/1999US5917169 Method and apparatus of identification of characters formed on a plurality of tablets of silicon
06/29/1999US5917024 Acid labile photoactive composition
06/29/1999US5916995 Superior transmissivity to deep ultraviolet light and excimer laser, improved thermal resistance and storage stability after exposure
06/29/1999US5916855 Chemical-mechanical polishing slurry formulation and method for tungsten and titanium thin films
06/29/1999US5916824 Acid gas in airtight chamber
06/29/1999US5916823 Method for making dual damascene contact
06/29/1999US5916822 Method of etching a substrate by means of chemical beams
06/29/1999US5916821 Method for producing sublithographic etching masks
06/29/1999US5916820 Thin film forming method and apparatus
06/29/1999US5916819 Planarization fluid composition chelating agents and planarization method using same
06/29/1999US5916733 Method of fabricating a semiconductor device
06/29/1999US5916696 Crack-resistant when the lead frame is bent to an angle of at least 82 degrees with a bend radius of about 150 mu.m to about 300 mu.m.
06/29/1999US5916690 Integrated circuits
06/29/1999US5916689 Electrostatic chuck with an impregnated, porous layer that exhibits the Johnson-Rahbeck effect
06/29/1999US5916688 Siloxanepolyimidepolyamic acid copolymers; chemical resistance
06/29/1999US5916640 An atomizer comprising a source of compressed gas to atomize the liquid to form aerosol droplets;treated by increasing the charge by contact with high voltage electrode and passed through separator to remove large droplets; even
06/29/1999US5916634 Refractory based thin film useful for diffusion barrier and micromachining applications
06/29/1999US5916631 Method and apparatus for spin-coating chemicals
06/29/1999US5916626 HMDS supplying apparatus
06/29/1999US5916513 Method and apparatus for affixing components to a substrate when a manufacturing line ceases operation
06/29/1999US5916476 Oxide magnetic materials, making method, antenna coils, and inductance elements
06/29/1999US5916455 Method and apparatus for generating a low pressure plasma
06/29/1999US5916453 Methods of planarizing structures on wafers and substrates by polishing
06/29/1999US5916411 Carbon electrode, cooling device in contact with electrode, temperature sensor, heat insulator covering, temperature controller
06/29/1999US5916401 Coating of substrates
06/29/1999US5916374 Supporting vertically, simultaneously spraying front and back with aqueous alkaline cleaning solution
06/29/1999US5916370 Semiconductor processing chamber having diamond coated components
06/29/1999US5916366 Substrate spin treating apparatus
06/29/1999US5916245 High capacity gas storage and dispensing system
06/29/1999US5916011 Process for polishing a semiconductor device substrate
06/29/1999US5916009 Apparatus for applying an urging force to a wafer
06/29/1999US5915977 System and interconnect for making temporary electrical connections with bumped semiconductor components
06/29/1999US5915957 Method of transferring target substrates in semiconductor processing system
06/29/1999US5915915 End effector and method for loading and unloading disks at a processing station
06/29/1999US5915910 Semiconductor wafer transfer method and apparatus
06/29/1999US5915756 Method to fill via holes between two conductive layers
06/29/1999US5915755 Method for forming an interconnect for testing unpackaged semiconductor dice
06/29/1999US5915753 Method of producing a high-density printed wiring board for mounting
06/29/1999US5915752 Method of making connections to a semiconductor chip assembly
06/29/1999US5915562 Transport module with latching door
06/29/1999US5915462 High efficiency thermal interposer
06/29/1999US5915414 Standardized gas isolation box (GIB) installation
06/29/1999US5915396 Substrate processing apparatus
06/29/1999CA2004436C Test chip for use in semiconductor fault analysis
06/24/1999WO1999031733A1 Silicon oxynitride spacer for preventing over-etching during local interconnect formation
06/24/1999WO1999031732A2 Semiconductor processing method and field effect transistor
06/24/1999WO1999031731A2 Silicon oxide insulator (soi) semiconductor having selectively linked body
06/24/1999WO1999031730A1 Formation of control and floating gates of semiconductor non-volatile memories
06/24/1999WO1999031729A1 Reduced capacitance transistor with electro-static discharge protection structure and method for forming the same
06/24/1999WO1999031728A1 A method and system for providing a tapered shallow trench isolation structure profile
06/24/1999WO1999031727A1 Electronic device inspection system and method for manufacturing electronic device using the same
06/24/1999WO1999031726A1 Method of eliminating buried contact resistance in integrated circuits
06/24/1999WO1999031725A1 High integrity borderless vias with hsq gap filled patterned conductive layers
06/24/1999WO1999031724A1 Post-lapping cleaning process for silicon wafers
06/24/1999WO1999031723A1 Method of improving the flatness of polished semiconductor wafers
06/24/1999WO1999031722A1 Barrier layer for copper metallizing
06/24/1999WO1999031721A1 High k gate electrode
06/24/1999WO1999031720A2 Thin film transistors and electronic devices comprising such
06/24/1999WO1999031719A1 Semiconductor thin film, method of producing the same, apparatus for producing the same, semiconductor device and method of producing the same
06/24/1999WO1999031718A1 Method for high temperature etching of patterned layers using an organic mask stack
06/24/1999WO1999031715A1 PROCESS FOR THE CONTROL OF NOx GENERATED BY ETCHING OF SEMICONDUCTOR WAFERS
06/24/1999WO1999031714A1 Single wafer load lock chamber for pre-processing and post-processing wafers in a vacuum processing system
06/24/1999WO1999031713A2 Integrated material management module
06/24/1999WO1999031712A1 Ion implanting apparatus and method
06/24/1999WO1999031670A2 A symmetric segmented memory array architecture
06/24/1999WO1999031669A1 Biasing method and structure for reducing band-to-band and/or avalanche currents during the erase of flash memory devices
06/24/1999WO1999031667A1 Static memory cell with load circuit using a tunnel diode
06/24/1999WO1999031586A1 Parallel test method
06/24/1999WO1999031299A1 Electrodes for semiconductor electroplating apparatus and their application
06/24/1999WO1999031290A1 Magnetron sputtering source
06/24/1999WO1999031195A1 Abrasive, method of polishing wafer, and method of producing semiconductor device
06/24/1999WO1999030840A1 Spin coating method and apparatus for liquid carbon dioxide systems
06/24/1999WO1999021220A9 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
06/24/1999WO1999019527A3 Apparatus and method for utilizing a plasma density gradient to produce a flow of particles
06/24/1999WO1999013545A3 Vaporization and deposition apparatus and process
06/24/1999DE4244882C2 CMOS structure mfr. having twin walls
06/24/1999DE19857354A1 Silicon wafers are ultrasonically cleaned in a cleaning solution of hydrofluoric acid and hydrogen peroxide or ozone
06/24/1999DE19857059A1 Silicon on insulator component
06/24/1999DE19856805A1 Trough insulation structure in silicon substrate
06/24/1999DE19853260A1 Dryer for processed substrates
06/24/1999DE19847440A1 IC has a local, buried, thick insulation layer region for reducing parasitic capacitance effects
06/24/1999DE19831349A1 Semiconductor component with top line or wiring
06/24/1999DE19821640A1 Power semiconductor component with semiconductor layer
06/24/1999DE19818298C1 Super low-ohmic vertical MOSFET
06/24/1999DE19811068C1 IC capacitor having tantalum nitride barrier layer containing a transition metal and/or a lanthanide
06/24/1999DE19808245C1 Microelectronic semiconductor element manufacturing method
06/24/1999DE19758348A1 Depth profile measuring method for detecting impurity in semiconductors
06/24/1999DE19758339A1 Vertical bipolar transistor suitable for integration