| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 07/08/1999 | WO1999034030A1 A novel approach to optimizing an ild argon sputter process |
| 07/08/1999 | WO1999034028A1 SPUTTERING TARGET, Al INTERCONNECTION FILM, AND ELECTRONIC COMPONENT |
| 07/08/1999 | WO1999033726A1 Smif pod door and port door removal and return system |
| 07/08/1999 | WO1999033725A1 Contactless wafer pick-up chuck |
| 07/08/1999 | WO1999033673A1 Plasma discharge device and method with dynamic tuning |
| 07/08/1999 | WO1999033614A1 A carrier head with a removable retaining ring for a chemical mechanical polishing apparatus |
| 07/08/1999 | WO1999033613A1 A carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
| 07/08/1999 | WO1999022409A3 Semiconductor device comprising a half-bridge circuit |
| 07/08/1999 | WO1999018599A3 Holder for a semiconductor substrate, and method of manufacturing a semiconductor device using such a holder |
| 07/08/1999 | WO1999008325A8 Electrode means, with or without functional elements and an electrode device formed of said means |
| 07/08/1999 | WO1996036067A8 Self-alignment technique for junction isolation and wells |
| 07/08/1999 | DE19900171A1 Silicon carbide semiconductor structure especially a vertical power MOSFET has stable FET characteristics and high gate insulation reliability |
| 07/08/1999 | DE19900169A1 Vertical silicon carbide JFET or MOSFET with precisely controlled or adjusted channel dimensions |
| 07/08/1999 | DE19859090A1 Gate oxide films of different thicknesses are formed on active regions especially of a MOS device substrate |
| 07/08/1999 | DE19857037A1 Salicide layers are formed on a MOST structure with reduced risk of bridging defects |
| 07/08/1999 | DE19855895A1 Immersion cleaning e.g. of silicon wafer using hydrochloric acid and hydrogen peroxide mixture |
| 07/08/1999 | DE19846261A1 Semiconductor memory with ferroelectric planar capacitor having good adhesion and low inter-diffusion |
| 07/08/1999 | DE19839979A1 Device for measuring temperature of semiconductor device |
| 07/08/1999 | DE19838150A1 Semiconductor module with series of standard cells |
| 07/08/1999 | DE19836965A1 Semiconductor component, e.g. DRAM, containing capacitor |
| 07/08/1999 | DE19836163A1 Semiconductor device metal line exhibits high heat dissipation and low electromigration |
| 07/08/1999 | DE19835840A1 Structure of semiconductor wafer with several semiconductor chips |
| 07/08/1999 | DE19833955A1 Integrated semiconductor circuit, e.g. a DRAM, exhibits reduced leakage current |
| 07/08/1999 | DE19815158A1 Production of DRAM capacitor having increased surface area |
| 07/08/1999 | DE19812643C1 MOS-transistor based circuit structure integrated into semiconductor substrate, preferably mono-crystalline silicon wafer |
| 07/08/1999 | DE19758267A1 Verfahren und Vorrichtung zum Behandeln von Substraten Method and apparatus for treating substrates |
| 07/08/1999 | CA2315674A1 Process for producing a porous layer by an electrochemical etching process |
| 07/08/1999 | CA2315026A1 Method for continuous and maskless patterning of structured substrates |
| 07/07/1999 | EP0928105A1 Internet television apparatus |
| 07/07/1999 | EP0928054A2 Electrostatic discharge protection circuit |
| 07/07/1999 | EP0928032A2 Semiconductor substrate and thin film semiconductor device, method of manufacturing the same, and anodizing apparatus |
| 07/07/1999 | EP0928030A1 High voltage field-effect transistor and corresponding manufacturing method |
| 07/07/1999 | EP0928029A2 Multi-layer circuit board layout |
| 07/07/1999 | EP0928028A2 Semiconductor device comprising a wiring substrate |
| 07/07/1999 | EP0928024A2 Improvements in or relating to interconnect conducting paths |
| 07/07/1999 | EP0928023A1 Shallow trench isolation structure with recessed nitride liner and method for making same |
| 07/07/1999 | EP0928022A2 Resin package fabrication process |
| 07/07/1999 | EP0928021A1 Process for manufacturing semiconductor device |
| 07/07/1999 | EP0928020A2 Deposition of planarizing phosphosilicate glass dielectric |
| 07/07/1999 | EP0928019A2 Reduced etch stop layer erosion |
| 07/07/1999 | EP0928018A2 Reduction of black silicon in semiconductor fabrication |
| 07/07/1999 | EP0928017A2 Semiconductor wafer processing method and semiconductor wafers produced by the same |
| 07/07/1999 | EP0928016A1 Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and ic card |
| 07/07/1999 | EP0928015A2 Method of preventing boron penetration |
| 07/07/1999 | EP0928014A2 An apparatus for manufacturing a semiconductor material |
| 07/07/1999 | EP0928013A2 Wafer surface cleaning apparatus and method |
| 07/07/1999 | EP0928012A2 Optical proximity correction method and apparatus |
| 07/07/1999 | EP0927777A1 Semiconductor crystal, and method and apparatus of production |
| 07/07/1999 | EP0927432A1 Bipolar transistor which can be controlled by field effect and method for producing the same |
| 07/07/1999 | EP0927380A1 Supporting device with gas bearing |
| 07/07/1999 | EP0858688A4 Esd protection for overvoltage friendly input/output circuits |
| 07/07/1999 | EP0561271B1 Microcomputer comprising a random access memory and a nonvolatile flash memory |
| 07/07/1999 | CN2328098Y 固定装置 Fixtures |
| 07/07/1999 | CN1222254A Memory cell design with vertically stacked crossovers |
| 07/07/1999 | CN1222252A Methods for mfg. semiconductor package |
| 07/07/1999 | CN1222251A Bump bonding device and bump bonding method |
| 07/07/1999 | CN1222107A Grinding machine spindle flexibly attached to platform |
| 07/07/1999 | CN1221985A Decoupling capacitor structure distributed in thin film layer above integrated circuit, and method for making same |
| 07/07/1999 | CN1221982A Semiconductor device and its mfg. method |
| 07/07/1999 | CN1221981A Method and sysetm for semiconductor waper fabrication process real-time in-situ supervision |
| 07/07/1999 | CN1221980A Method for manufacturing semiconductor device |
| 07/07/1999 | CN1221979A Method for forming conductive layer using atomic layer deposition process |
| 07/07/1999 | CN1221978A N-shape indium phosphide ohm contact mfg. method |
| 07/07/1999 | CN1221977A Reduction of black silicon in semiconductor fabrication |
| 07/07/1999 | CN1221976A Wafer surface cleaning apparatus and method |
| 07/07/1999 | CN1221975A Improved dishing resistance |
| 07/07/1999 | CN1221974A Electron beam direct drawing method, system and recording medium |
| 07/07/1999 | CN1221973A Object separating apparatus and method, and method of manufacturing semiconductor substrate |
| 07/07/1999 | CN1221972A Sample separating apparatus and method, and substrate manufacturing method |
| 07/07/1999 | CN1221971A Semiconductor device and method for manufacturing the same |
| 07/07/1999 | CN1221970A Sputtering apparatus for sputtering high melting point metal and method for manufacturing semiconductor device having high melting point metal |
| 07/07/1999 | CN1221968A Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method |
| 07/07/1999 | CN1221810A Method for cleaning substrate and cleaning solution |
| 07/07/1999 | CN1221808A Process improvements for titanium-tungsten etching in presence of electroplated C4'S |
| 07/07/1999 | CN1221807A In-situ monitoring plasma etching apparatus, its in-situ monitoring method, and in-situ cleaning method for removing residues in plasma ething chamber |
| 07/07/1999 | CN1221711A Method of mfg. high thermal conductivity integrated circuit aluminum nitride ceramic substrate by curtain coating process |
| 07/07/1999 | CN1044046C Electrically erasable phase change memory |
| 07/06/1999 | US5920797 Method for gaseous substrate support |
| 07/06/1999 | US5920796 Bottom anti-reflective layer |
| 07/06/1999 | US5920795 Method for manufacturing semiconductor device |
| 07/06/1999 | US5920794 Electromigration resistant metallization process microcircuit interconnections with RF-reactively sputtered titanium tungsten and gold |
| 07/06/1999 | US5920793 Method for manufacturing a through hole |
| 07/06/1999 | US5920792 High density plasma enhanced chemical vapor deposition process in combination with chemical mechanical polishing process for preparation and planarization of intemetal dielectric layers |
| 07/06/1999 | US5920791 Method of manufacturing intermetal dielectrics for sub-half-micron semiconductor devices |
| 07/06/1999 | US5920790 Method of forming a semiconductor device having dual inlaid structure |
| 07/06/1999 | US5920787 Soft edge induced local oxidation of silicon |
| 07/06/1999 | US5920786 In semiconductor substrates |
| 07/06/1999 | US5920784 Method for manufacturing a buried transistor |
| 07/06/1999 | US5920783 Method of fabricating a self-aligned silicide MOSFET |
| 07/06/1999 | US5920782 Method for improving hot carrier degradation |
| 07/06/1999 | US5920781 Method of making semiconductor device |
| 07/06/1999 | US5920780 Method of forming a self aligned contact (SAC) window |
| 07/06/1999 | US5920779 Differential gate oxide thickness by nitrogen implantation for mixed mode and embedded VLSI circuits |
| 07/06/1999 | US5920778 Read-only memory cell arrangement and method for its production |
| 07/06/1999 | US5920777 Semiconductor memory device and method of manufacturing the same |
| 07/06/1999 | US5920776 Method of making asymmetric nonvolatile memory cell |
| 07/06/1999 | US5920775 Method for forming a storage capacitor within an integrated circuit |
| 07/06/1999 | US5920774 Method to fabricate short-channel MOSFETS with an improvement in ESD resistance |
| 07/06/1999 | US5920773 Method for making integrated heterojunction bipolar/high electron mobility transistor |
| 07/06/1999 | US5920772 Method of fabricating a hybrid polysilicon/amorphous silicon TFT |