Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/1999
11/02/1999US5976960 Method of forming an electrically conductive substrate interconnect continuity region with an angled implant
11/02/1999US5976959 Method for forming large area or selective area SOI
11/02/1999US5976958 Thermal cracking
11/02/1999US5976957 Evaporating a metal as a catalyst on silicon substrate; heating; oxidation; removal
11/02/1999US5976956 Method of controlling dopant concentrations using transient-enhanced diffusion prior to gate formation in a device
11/02/1999US5976955 Packaging for bare dice employing EMR-sensitive adhesives
11/02/1999US5976954 Method and apparatus for cleaning and separating wafers bonded to a fixing member
11/02/1999US5976953 Three dimensional processor using transferred thin film circuits
11/02/1999US5976952 Implanted isolation structure formation for high density CMOS integrated circuits
11/02/1999US5976951 Forming silicon oxide and silicon nitride; development photoresist pattern; etching
11/02/1999US5976950 Polysilicon coated swami (sidewall masked isolation)
11/02/1999US5976949 Method for forming shallow trench isolation
11/02/1999US5976948 Process for forming an isolation region with trench cap
11/02/1999US5976947 Method for forming dielectric within a recess
11/02/1999US5976946 Thin film formation method for ferroelectric materials
11/02/1999US5976945 Method for fabricating a DRAM cell structure on an SOI wafer incorporating a two dimensional trench capacitor
11/02/1999US5976944 Integrated circuit with thin film resistors and a method for co-patterning thin film resistors with different compositions
11/02/1999US5976943 Method for bi-layer programmable resistor
11/02/1999US5976942 Method of manufacturing a high-voltage semiconductor device
11/02/1999US5976940 Method of making plurality of bipolar transistors
11/02/1999US5976939 Low damage doping technique for self-aligned source and drain regions
11/02/1999US5976938 Method of making enhancement-mode and depletion-mode IGFETs with different gate thicknesses
11/02/1999US5976937 Transistor having ultrashallow source and drain junctions with reduced gate overlap and method
11/02/1999US5976936 Multilyer laminate; forming trench; forming barrier electrode
11/02/1999US5976935 Method of fabricating an electrically erasable and programmable read-only memory (EEPROM) with improved quality for the tunneling oxide layer therein
11/02/1999US5976934 Method of manufacturing a nonvolatile semiconductor memory device with select gate bird's beaks
11/02/1999US5976933 Process for manufacturing an integrated circuit comprising an array of memory cells
11/02/1999US5976932 Memory cell and method for producing the memory cell
11/02/1999US5976931 Method for increasing capacitance
11/02/1999US5976930 Method for forming gate segments for an integrated circuit
11/02/1999US5976928 Chemical mechanical polishing of FeRAM capacitors
11/02/1999US5976927 Two mask method for reducing field oxide encroachment in memory arrays
11/02/1999US5976925 Process of fabricating a semiconductor devise having asymmetrically-doped active region and gate electrode
11/02/1999US5976924 Method of making a self-aligned disposable gate electrode for advanced CMOS design
11/02/1999US5976923 Method for fabricating a high-voltage semiconductor device
11/02/1999US5976922 Method for fabricating a high bias device compatible with a low bias device
11/02/1999US5976920 Single layer integrated metal process for high electron mobility transistor (HEMT) and pseudomorphic high electron mobility transistor (PHEMT)
11/02/1999US5976919 Simultaneous irradiating hydrogen and semiconductor dopantunder reduced pressure; performed in multiple sealed chambers
11/02/1999US5976918 Method of forming insulating film with few hydrogen atom inclusions
11/02/1999US5976916 Method of producing semiconductor device and encapsulating pellet employed therein
11/02/1999US5976914 Method of making plastic package for a surface mounted integrated circuit
11/02/1999US5976912 Fabrication process of semiconductor package and semiconductor package
11/02/1999US5976910 Heating solder and resin simultaneously; solder melting to connect pad and connecting structure; resin setting to couple first and second substrate
11/02/1999US5976908 Method of fabricating solid-state image sensor
11/02/1999US5976904 Method of manufacturing semiconductor device
11/02/1999US5976902 Method of fabricating a fully self-aligned TFT-LCD
11/02/1999US5976901 Process for manufacturing semiconductor devices with active structures
11/02/1999US5976900 Cleaning the chemical reactor; pretreating with glass; vapor deposition
11/02/1999US5976899 Reduced terminal testing system
11/02/1999US5976897 Method of protecting device leads of a packaged integrated circuit
11/02/1999US5976770 Reaction product of a phenolic compound and anthracene compound as dye
11/02/1999US5976769 Intermediate layer lithography
11/02/1999US5976768 Masking, exposure, development
11/02/1999US5976767 Ammonium hydroxide etch of photoresist masked silicon
11/02/1999US5976766 Forming a stepped layer on semiconductor; coating with negative photoresist; patterning; etching
11/02/1999US5976760 Chemical-sensitization resist composition
11/02/1999US5976740 Controlled lithographic process
11/02/1999US5976738 Exposure and alignment method
11/02/1999US5976737 Exposure of pattern using projector lens
11/02/1999US5976733 Integrated circuit photofabrication masks and methods for making same
11/02/1999US5976713 Exchange-coupling film and, magneto-resistance effect element and magnetic head using thereof
11/02/1999US5976705 Containing lead and antimony
11/02/1999US5976703 Material and method for planarization of substrate
11/02/1999US5976691 Process for producing chip and pressure sensitive adhesive sheet for said process
11/02/1999US5976637 Dielectric over metal
11/02/1999US5976626 Semiconductor device and method of manufacturing thereof
11/02/1999US5976625 Process for forming patterned dielectric oxide films
11/02/1999US5976624 Process for producing bismuth compounds, and bismuth compounds
11/02/1999US5976623 Vapor deposition
11/02/1999US5976620 Coating solution applying method and apparatus
11/02/1999US5976618 Process for forming silicon dioxide film
11/02/1999US5976395 Selective etching method for stacked organic film
11/02/1999US5976394 Method for dry-etching a platinum thin film
11/02/1999US5976393 Method of manufacturing multilayer circuit substrate
11/02/1999US5976392 Method for fabrication of thin film resistor
11/02/1999US5976331 Electrodeposition apparatus for coating wafers
11/02/1999US5976328 Pattern forming method using charged particle beam process and charged particle beam processing system
11/02/1999US5976327 Step coverage and overhang improvement by pedestal bias voltage modulation
11/02/1999US5976312 Semiconductor processing apparatus
11/02/1999US5976311 Semiconductor wafer wet processing device
11/02/1999US5976310 Plasma etch system
11/02/1999US5976309 Electrode assembly for plasma reactor
11/02/1999US5976308 High density plasma CVD and etching reactor
11/02/1999US5976306 Method and apparatus for removing die from an expanded wafer and conveying die to a pickup location
11/02/1999US5976302 The actual connection between the chip and the substrate is then produced by subjecting the bumps to thermal energy whereby a remelting of the bumps occurs.
11/02/1999US5976286 Multi-density ceramic structure and process thereof
11/02/1999US5976267 Semiconductors
11/02/1999US5976264 From a reactive ion etched (rie) precision surface such as a semiconductor
11/02/1999US5976260 Semiconductor producing apparatus, and wafer vacuum chucking device, gas cleaning method and nitride film forming method in semiconductor producing apparatus
11/02/1999US5976259 Semiconductor device, manufacturing method, and system
11/02/1999US5976258 High temperature substrate transfer module
11/02/1999US5976257 Apparatus for continuously forming a large area deposited film by means of microwave plasma CVD process
11/02/1999US5976256 Film coating apparatus
11/02/1999US5976255 Substrate holder for reducing non-uniform film characteristics resulting from support structures
11/02/1999US5976246 Process for producing silicon single crystal
11/02/1999US5976199 Single semiconductor wafer transfer method and manufacturing system
11/02/1999US5976198 Substrate transfer and bath apparatus
11/02/1999US5975998 Wafer processing apparatus
11/02/1999US5975997 Method of double-side lapping a wafer and an apparatus therefor
11/02/1999US5975990 Method of producing semiconductor wafers
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