Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/1999
11/10/1999CN1234453A Analog method for sputtering section
11/10/1999CN1234318A 改进的磨削和抛光机床 Improved grinding and polishing machine
11/10/1999CN1234317A 改进的磨削和抛光机床 Improved grinding and polishing machine
11/10/1999CN1046375C Gallium nitride-based III-V group compound semiconductor device and method of producing the same
11/10/1999CN1046350C System and method for testing accelerated degradation of semiconductor devices
11/09/1999US5983277 Work group computing for electronic design automation
11/09/1999US5983011 Method of simulating a profile of sputter deposition which covers a contact hole formed on a semiconductor wafer
11/09/1999US5982986 Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber
11/09/1999US5982922 Pattern inspection apparatus and method
11/09/1999US5982705 Semiconductor memory device permitting large output current from output buffer
11/09/1999US5982678 Semiconductor memory device with redundancy circuit
11/09/1999US5982669 EPROM and flash memory cells with source-side injection
11/09/1999US5982660 Magnetic memory cell with off-axis reference layer orientation for improved response
11/09/1999US5982631 X-ray detectable encapsulation material and method for its use
11/09/1999US5982629 Silicon semiconductor device,electrode structure therefor, and circuit board mounted therewith
11/09/1999US5982625 Semiconductor packaging device
11/09/1999US5982608 Semiconductor variable capacitor
11/09/1999US5982607 Monopolar electrostatic chuck having an electrode in contact with a workpiece
11/09/1999US5982600 Low-voltage triggering electrostatic discharge protection
11/09/1999US5982558 REMA objective for microlithographic projection exposure systems
11/09/1999US5982476 Process of forming pattern and exposure apparatus
11/09/1999US5982471 Liquid crystal display contact structure having conducting spacers and plural conducting films
11/09/1999US5982462 Inverse stagger or planar type thin-film transistor device and liquid-crystal display apparatus having floating gate electrode which is capacitively coupled with one or more input electrodes
11/09/1999US5982256 Wiring board equipped with a line for transmitting a high frequency signal
11/09/1999US5982227 CMOS current source circuit
11/09/1999US5982197 Dynamic circuit
11/09/1999US5982184 Test head for integrated circuits
11/09/1999US5982182 Interface apparatus for automatic test equipment with positioning modules incorporating kinematic surfaces
11/09/1999US5982166 Method for measuring a characteristic of a semiconductor wafer using cylindrical control
11/09/1999US5982132 Rotary wafer positioning system and method
11/09/1999US5982128 Lithography apparatus with movable stage and mechanical isolation of stage drive
11/09/1999US5982043 Semiconductor device having two or more bonding option pads
11/09/1999US5982042 Semiconductor wafer including semiconductor device
11/09/1999US5982041 Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices
11/09/1999US5982040 Semiconductor device and method for manufacturing the same
11/09/1999US5982039 Completely buried contact holes
11/09/1999US5982037 Al/Ti layered interconnection and method of forming same
11/09/1999US5982036 Multi-layered structure for ohmic electrode fabrication
11/09/1999US5982034 Multilayer; strontium, calcium, ruthenium oxide
11/09/1999US5982032 Electronic device having FETs on a low dielectric constant GaAs base member and passive elements on a high dielectric constant base member
11/09/1999US5982024 High concentration doped semiconductor
11/09/1999US5982023 Semiconductor device and field effect transistor
11/09/1999US5982022 Angled implant to improve high current operation of transistors
11/09/1999US5982021 Vertical polysilicon diode compatible with CMOS/BiCMOS integrated circuit processes
11/09/1999US5982020 Deuterated bipolar transistor and method of manufacture thereof
11/09/1999US5982019 Semiconductor device with a diffused resistor
11/09/1999US5982018 Thin film capacitor coupons for memory modules and multi-chip modules
11/09/1999US5982017 Recessed structure for shallow trench isolation and salicide processes
11/09/1999US5982016 Monolithic component associating a high-voltage component and logic components
11/09/1999US5982008 Semiconductor device using a shallow trench isolation
11/09/1999US5982007 Semiconductor memory device
11/09/1999US5982006 Active silicon-on-insulator region having a buried insulation layer with tapered edge
11/09/1999US5982005 Semiconductor device using an SOI substrate
11/09/1999US5982004 Polysilicon devices and a method for fabrication thereof
11/09/1999US5982003 Silicon-on-insulator transistors having improved current characteristics and reduced electrostatic discharge susceptibility
11/09/1999US5982002 Light valve having a semiconductor film and a fabrication process thereof
11/09/1999US5982001 MOSFETS structure with a recessed self-aligned silicide contact and an extended source/drain junction
11/09/1999US5981998 Single feature size MOS technology power device
11/09/1999US5981997 Horizontal field effect transistor and method of manufacturing the same
11/09/1999US5981996 Vertical trench misfet and method of manufacturing the same
11/09/1999US5981995 Static random access memory cell having buried sidewall transistors, buried bit lines, and buried vdd and vss nodes
11/09/1999US5981993 Flash memory device and method of fabricating the same
11/09/1999US5981992 Mechanical supports for very thin stacked capacitor plates
11/09/1999US5981990 Semiconductor memory device, method of manufacturing the same and method of using the same
11/09/1999US5981989 Semiconductor memory device having improved stacked capacitor cells
11/09/1999US5981987 Power ground metallization routing in a semiconductor device
11/09/1999US5981986 Semiconductor device having a heterojunction
11/09/1999US5981985 Heterojunction bipolar transistor with buried selective sub-collector layer, and methods of manufacture
11/09/1999US5981981 Semiconductor device including a bipolar structure
11/09/1999US5981974 Semiconductor device and method for fabricating the same
11/09/1999US5981972 Actived matrix substrate having a transistor with multi-layered ohmic contact
11/09/1999US5981971 Semiconductor ROM wafer test structure, and IC card
11/09/1999US5981970 Thin-film field-effect transistor with organic semiconductor requiring low operating voltages
11/09/1999US5981966 Auto-teaching method in semiconductor processing system
11/09/1999US5981961 Apparatus and method for improved scanning efficiency in an ion implanter
11/09/1999US5981960 Charged particle beam exposure method and apparatus therefor
11/09/1999US5981913 Static electricity chuck and wafer stage
11/09/1999US5981900 Method of annealing silicon carbide for activation of ion-implanted dopants
11/09/1999US5981899 Capacitively coupled RF-plasma reactor
11/09/1999US5981880 Electronic device packages having glass free non conductive layers
11/09/1999US5981873 Printed circuit board for ball grid array semiconductor package
11/09/1999US5981454 Post clean treatment composition comprising an organic acid and hydroxylamine
11/09/1999US5981404 Multilayer ONO structure
11/09/1999US5981403 Layered silicon nitride deposition process
11/09/1999US5981402 Method of fabricating shallow trench isolation
11/09/1999US5981401 Method for selective etching of anitreflective coatings
11/09/1999US5981400 Compliant universal substrate for epitaxial growth
11/09/1999US5981399 Method and apparatus for fabricating semiconductor devices
11/09/1999US5981398 A blanket target upon the blanket hard mask layer is formed of a silsesquioxane spin-on glass material and amorphous carbon, then forming a patterned photoresists layer upon blanket hard mask layer, etching
11/09/1999US5981397 Integrated circuitry having a pair of adjacent conductive lines and method of forming
11/09/1999US5981396 Positioning the stop-on feature semiconductor wafer against a layer of liquid solution on a planarizing surface of polishing pad, moving one pad or wafer with respect to other at low velocity, controlling temperature of platen
11/09/1999US5981395 Method of fabricating an unlanded metal via of multi-level interconnection
11/09/1999US5981394 Chemical mechanical polishing method, polisher used in chemical mechanical polishing and method of manufacturing semiconductor device
11/09/1999US5981392 Method of manufacturing semiconductor monocrystalline mirror-surface wafers which includes a gas phase etching process, and semiconductor monocrystalline mirror-surface wafers manufactured by the method
11/09/1999US5981391 Fabrication process of a semiconductor device including grinding of a semiconductor wafer
11/09/1999US5981390 Depositing first platinum layer over platinum oxide dielectric layer under oxygen containing atmosphere to form an oxygen containing platinum layer, annealing to remove oxygen present in oxygen containing platinum layer
11/09/1999US5981389 Sputter depositing chromium layers in presence of neon gas and the working gas pressure during sputtering is less than 1 pa.
11/09/1999US5981388 Reducing titanium chloride with activated hydrogen on the surface of the substrate a metal film is formed; corrosion resistance, smoothness and uniformity
11/09/1999US5981387 Supplying a first source gas for silicon and second gas for metal on to a substrate positioning in a reaction chamber while maintaining constant flow rate of first source gas and varying flow rate of metal source gas to form silicide
11/09/1999US5981386 Method for manufacturing interconnection plug