Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/1999
11/23/1999US5989928 Method and device for detecting end point of plasma treatment, method and device for manufacturing semiconductor device, and semiconductor device
11/23/1999US5989927 Producing the ferroelectric layer by spin coating an organic solvent solution containing bismuth source and titanium source in mole ratio 4 to 3, respectively and heat treating to dry and crystallize the bismuth titanate film
11/23/1999US5989919 Method for analyzing contamination within hole in semiconductor device
11/23/1999US5989895 β-(1-3)-glucanosyltransferase, oligonucleotides encoding this enzyme, and molecules having effects on this enzyme
11/23/1999US5989788 Etching portion of protective intermediate layer exposed through secondary photoresist pattern forming a secondary photoresist pattern overlapping wiht the primary photoresist pattern so the resulting pattern has vertical profile
11/23/1999US5989784 Forming a fuse opening using an etch stop layer by using a two stage etch process where the second stage etches the etch stop layer while simultaneously forming a passivation layer over a metal pad
11/23/1999US5989783 Method of customizing integrated circuits by depositing two resist layers to selectively pattern layer interconnect material
11/23/1999US5989775 An amide-grafted polyhydroxyphenol resin of given formula useful in a photoresist composition which allows for a good pattern even though a post-baking process is carried out in a delayed time
11/23/1999US5989764 Creating a plurality of latent images in the resist, each image being characterized by at least one lithographic parameter, interrogating the latent images and utilizing the results of the interrogation to form additional latent images
11/23/1999US5989762 Method of producing a semiconductor device
11/23/1999US5989759 Pattern forming method using alignment from latent image or base pattern on substrate
11/23/1999US5989756 Transparent substrate, and at least two light blocking regions, separated by a first opening and arranged at a first pitch, formed with second openings at smaller pitches which transmit exposure light of weaker intensity; depth of focus
11/23/1999US5989755 Method of manufacturing x-ray mask blank and method of manufacturing x-ray membrane for x-ray mask
11/23/1999US5989753 To suppress projection errors where patterns are connected together; includes irradiation amount reduction, where irradiation is reduced in the periphery of small regions corresponding to the distance from the center of small region
11/23/1999US5989718 Dielectric diffusion barrier
11/23/1999US5989652 Method of low temperature plasma enhanced chemical vapor deposition of tin film over titanium for use in via level applications
11/23/1999US5989635 High dielectric constant thin film structure, method for forming high dielectric constant thin film and apparatus for forming high dielectric constant thin film
11/23/1999US5989633 Process for overcoming CVD aluminum selectivity loss with warm PVD aluminum
11/23/1999US5989632 Coating solution applying method and apparatus
11/23/1999US5989623 Dual damascene metallization
11/23/1999US5989474 Method for fabricating resin-sealed semiconductor device using leadframe provided with resin dam bar
11/23/1999US5989471 Assembly including dual in-line cavity bars having independently controlled clamping force which clamp ball grid array (bga) substrates during encapsulation
11/23/1999US5989470 Curing within a mold a liquid matrix material which encapsulates uniformly distributed microcolumns arranged in parallel to form a pad body with interspersed microcolumns, cutting into individual pads
11/23/1999US5989444 Fluid bearings and vacuum chucks and methods for producing same
11/23/1999US5989442 Wet etching
11/23/1999US5989372 Coating substrates with a sol-gel and forming oxide film, densifying film to produce dielectric, juxtapositioning pieces together and applying low voltage to bond; simplification
11/23/1999US5989364 Gold-alloy bonding wire
11/23/1999US5989359 Method for drying objects with fluids
11/23/1999US5989354 Method for removing thin, organic materials from semiconductor dies and micro-lenses
11/23/1999US5989349 Diagnostic pedestal assembly for a semiconductor wafer processing system
11/23/1999US5989346 Semiconductor processing apparatus
11/23/1999US5989345 Process-gas supply apparatus
11/23/1999US5989342 Apparatus for substrate holding
11/23/1999US5989339 Molecular beam epitaxy (mbe) to form n-type cladding, active layer, p-type cladding successively, then forming in second chamber contactor layers of alternating zinc selenide/zinc telluride capped with zinc telluride; laser light emitters
11/23/1999US5989338 Method for depositing cell nitride with improved step coverage using MOCVD in a wafer deposition system
11/23/1999US5989105 Method and apparatus for polishing chamfers of semiconductor wafers
11/23/1999US5989039 Socket apparatus for testing package
11/23/1999US5988971 Wafer transfer robot
11/23/1999US5988707 Semiconductor device of lead-on-chip structure
11/23/1999US5988487 Captured-cell solder printing and reflow methods
11/23/1999US5988485 Flux cleaning for flip chip technology using environmentally friendly solvents
11/23/1999US5988482 Discharge abnormality detection device and method for use in wire bonding apparatus
11/23/1999US5988481 Bonding apparatus with adjustable heating blocks, clamps, and rails
11/23/1999US5988480 Continuous mode solder jet apparatus
11/23/1999US5988394 Tray for containing parts for storage and transportation
11/23/1999US5988392 Shipping container
11/23/1999US5988371 Cleaning device and method
11/23/1999US5988368 Resist pattern forming method using anti-reflective layer resist pattern formed and method of etching using resist pattern and product formed
11/23/1999US5988266 Bonded cast, pin-finned heat sink and method of manufacture
11/23/1999US5988233 Evacuation-driven SMIF pod purge system
11/23/1999US5988189 Method and apparatus for cleaning wafers using multiple tanks
11/23/1999US5988187 Chemical vapor deposition system with a plasma chamber having separate process gas and cleaning gas injection ports
11/23/1999US5988104 Plasma treatment system
11/23/1999US5987744 Method for supporting one or more electronic components
11/23/1999US5987743 Automatic wiring device and its wiring method
11/23/1999US5987742 Technique for attaching a stiffener to a flexible substrate
11/23/1999US5987739 Method of making a polymer based circuit
11/23/1999US5987737 Gate break device and gate break method
11/23/1999US5987732 Method of making compact integrated microwave assembly system
11/23/1999US5987722 Apparatus for transporting lead frames
11/23/1999CA2177345C Method for the growth of industrial crystals
11/23/1999CA2119050C Self accelerating and replenishing non-formaldehyde immersion coating method and composition
11/20/1999CA2272170A1 Method of forming capacitors in a semiconductor device
11/20/1999CA2238128A1 3-step etching for contact window
11/19/1999CA2271790A1 Semiconductor device
11/18/1999WO1999059208A1 High-voltage semiconductor component, method for the production and use thereof
11/18/1999WO1999059207A1 Methods and apparatuses for binning partially completed integrated circuits based upon test results
11/18/1999WO1999059206A2 Semiconductor device and method for making the device
11/18/1999WO1999059205A1 Semiconductor plastic package and method for producing printed wiring board
11/18/1999WO1999059204A1 Methods of electrically contacting to conductive plugs, methods of forming contact openings, and methods of forming dynamic random access memory circuitry
11/18/1999WO1999059203A1 Substrate and method for manufacturing the same
11/18/1999WO1999059202A1 Method of forming a field isolation structure in a semiconductor substrate
11/18/1999WO1999059201A1 Polished ceramic chuck for low backside particles in semiconductor plasma processing
11/18/1999WO1999059200A1 Fab yield enhancement system
11/18/1999WO1999059198A1 Plasma etching method
11/18/1999WO1999059197A1 Multiple step methods for forming conformal layers
11/18/1999WO1999059196A1 Temperature control system for a thermal reactor
11/18/1999WO1999059195A1 Crystal growth method for group-iii nitride and related compound semiconductors
11/18/1999WO1999059194A1 A method of planarizing a semiconductor device using a high density plasma system
11/18/1999WO1999059193A1 Process for etching thin-film layers of a workpiece used to form microelectronic circuits or components
11/18/1999WO1999059192A1 Omni-directional high precision friction drive positioning stage
11/18/1999WO1999059191A2 Method and device for drying photoresist coatings
11/18/1999WO1999059190A2 Process and manufacturing tool architecture for use in the manufacture of one or more metallization levels on a workpiece
11/18/1999WO1999059184A1 Method and installation for correcting integrated circuit faults with an ion beam
11/18/1999WO1999059183A1 Electron beam exposure method and electron beam exposure apparatus
11/18/1999WO1999059172A1 Thin electret layer and corresponding production method
11/18/1999WO1999059155A1 High-efficiency miniature magnetic integrated circuit structures
11/18/1999WO1999059089A1 Noise checking method and device
11/18/1999WO1999059056A1 Prealigner and planarity teaching station
11/18/1999WO1999058985A1 Method for producing micromechanical components
11/18/1999WO1999058739A1 Oxygen-argon gas mixture for precleaning in vacuum processing system
11/18/1999WO1999058733A2 Method and device for the heat treatment of substrates
11/18/1999WO1999058297A1 A carrier head with a retaining ring for a chemical mechanical polishing system
11/18/1999WO1999050911A3 Electronic devices comprising thin-film transistors
11/18/1999WO1999045573A3 Device for the thermal treatment of substrates
11/18/1999WO1999041782A3 Module tape with modules for dual-mode data carriers
11/18/1999WO1999036790A3 Test probe interface unit and method of manufacturing the same
11/18/1999WO1999028952A3 Wafer-mapping load port interface
11/18/1999WO1999008850A3 Mould and method for making a composite plastic body
11/18/1999DE4113968C2 Maskenstruktur und Verfahren zur Herstellung von Halbleiterbauelementen unter Verwendung der Maskenstruktur Mask structure and process for producing semiconductor devices by using the mask structure
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