Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/1999
11/16/1999US5985719 Method of forming a programmable non-volatile memory cell
11/16/1999US5985718 Process for fabricating memory cells with two levels of polysilicon for devices of EEPROM type
11/16/1999US5985717 Method of fabricating a semiconductor device
11/16/1999US5985716 Method for manufacturing a semiconductor device
11/16/1999US5985715 Method of fabricating stacked type capacitor
11/16/1999US5985714 Method of forming a capacitor
11/16/1999US5985713 Method of forming iridium oxide local interconnect
11/16/1999US5985712 Method of fabricating field effect transistor with an LDD structure
11/16/1999US5985711 Method of fabricating semiconductor device
11/16/1999US5985710 Twin well forming method for semiconductor device
11/16/1999US5985709 Process for fabricating a triple-well structure for semiconductor integrated circuit devices
11/16/1999US5985707 Semiconductor memory device with improved current control through an access transistor and method thereof
11/16/1999US5985706 Polishing method for thin gates dielectric in semiconductor process
11/16/1999US5985705 Low threshold voltage MOS transistor and method of manufacture
11/16/1999US5985704 Patterning a silicon film with photoresist; interposingprotective film of silicon oxide between semiconductor andphotoresist films; oxide layer formed by thermal annealing silicon film
11/16/1999US5985703 Forming polycrystalline thin film channel region between thin film channel and source regions; transistor gate dielectric positioned adjacent to thin film channel region
11/16/1999US5985702 Methods of forming conductive polysilicon lines and bottom gated thin film transistors, and conductive polysilicon lines and thin film transistors
11/16/1999US5985701 Process for fabricating liquid crystal electro-optical device comprising complementary thin film field effect transistors
11/16/1999US5985700 On which a silicon coating is directly formed, patterningsilicon coating to form base and continuing fabrication steps
11/16/1999US5985699 Method for designing semiconductor integrated circuit
11/16/1999US5985697 Method and apparatus for mounting an integrated circuit to a printed circuit board
11/16/1999US5985694 Semiconductor die bumping method utilizing vacuum stencil
11/16/1999US5985693 High density three-dimensional IC interconnection
11/16/1999US5985692 Process for flip-chip bonding a semiconductor die having gold bump electrodes
11/16/1999US5985681 Method of producing bonded substrate with silicon-on-insulator structure
11/16/1999US5985680 Method and apparatus for transforming a substrate coordinate system into a wafer analysis tool coordinate system
11/16/1999US5985678 Method of evaluating and thermally processing semiconductor wafer
11/16/1999US5985677 Method of repairing semiconductor memory, electron-beam memory repairing apparatus and redundancy memory circuit to which the method of repairing semiconductor memory is applicable
11/16/1999US5985676 Forming insulating layer over bottom electrode, depositing strontium bismuth tantalate of high dielectric constant into contact via insulating layer, forming top electrode
11/16/1999US5985525 Developer solution for photoresist composition
11/16/1999US5985522 Photoresist and compounds for composing the photoresist
11/16/1999US5985521 Method for forming electrically conductive layers on chip carrier substrates having through holes or via holes
11/16/1999US5985520 Metal line structure and method of manufacturing the same
11/16/1999US5985519 Patterns on semiconductors with transparent and semitransparent layers for photoresists and films
11/16/1999US5985518 Integrated circuits with substrates, patterns, multilayer element with positive photoresists
11/16/1999US5985512 Base resin, photoacid generator, solvent and nitronenous organic compound
11/16/1999US5985511 Positive photoresists, polyvinylphenol resin, sulfonate of n hydroxyimide, amine and electron doners
11/16/1999US5985496 Photomasking patterns on photosensitive substrates, radiation, scanning and measurement
11/16/1999US5985494 Integrated circuits with substrates and markings
11/16/1999US5985493 Projecion electron beam lithography and membranes
11/16/1999US5985492 Mask for imaging and multilayer
11/16/1999US5985491 Radiation transparent substrates with phase shift layer and reflecting layer
11/16/1999US5985456 Heat curable; nonhydrolzying; corrosion resistance
11/16/1999US5985412 Method of manufacturing microstructures and also microstructure
11/16/1999US5985377 Laser marking techniques
11/16/1999US5985364 Method of exhaust control for spin-on films with reduced defects
11/16/1999US5985363 Method of providing uniform photoresist coatings for tight control of image dimensions
11/16/1999US5985357 Surface treatment; supplying photoresist or developer to semiconductor wafers
11/16/1999US5985128 Shorting connectors rather than features, so features are fully exposed to solution used in process
11/16/1999US5985126 Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover
11/16/1999US5985125 Forming barrier metal patterns on wafer, depositing copper only on barrier metal patterns by electrochemistry
11/16/1999US5985103 Method for improved bottom and side wall coverage of high aspect ratio features
11/16/1999US5985091 Microwave plasma processing apparatus and microwave plasma processing method
11/16/1999US5985090 Polishing cloth and polishing apparatus having such polishing cloth
11/16/1999US5985089 Plasma etch system
11/16/1999US5985068 Forming two thin metal film layers on supporting member, forming monolithic ceramic structure incorporating said film, changing portion of first metal film into insulating material and diffusing into ceramic
11/16/1999US5985043 Thermally curable adhesive comprising acid having two or more double bonds as fluxing agent, double bond containing diluent capable of crosslinking fluxing agent, optionally free radical initiator, resin
11/16/1999US5985041 Placing wafer in chamber in rinse/dry apparatus, directing rinse liquid over wafer, lowering moveable side wall to remove rinse liquid
11/16/1999US5985039 Apparatus and method for washing both surfaces of a substrate
11/16/1999US5985035 Method of holding substrate and substrate holding system
11/16/1999US5985034 Opening filling apparatus for manufacturing a semiconductor device
11/16/1999US5985033 Apparatus and method for delivering a gas
11/16/1999US5985032 Semiconductor manufacturing apparatus
11/16/1999US5985025 Semiconductor growth method
11/16/1999US5985023 Method for growth of a nitrogen-doped gallium phosphide epitaxial layer
11/16/1999US5984775 Grating and shutter apparatus for controlling air flow
11/16/1999US5984769 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
11/16/1999US5984699 Method of fabricating a semiconductor device
11/16/1999US5984619 End effector for unloading disks at a grinding station
11/16/1999US5984610 Pod loader interface
11/16/1999US5984608 Automated chamfering apparatus and method
11/16/1999US5984607 Transfer apparatus, transfer method, treatment apparatus and treatment method
11/16/1999US5984541 Resist processing system
11/16/1999US5984524 Apparatus and method for testing product heat-resistance
11/16/1999US5984522 Apparatus for inspecting bump junction of flip chips and method of inspecting the same
11/16/1999US5984505 Block exposure of semiconductor wafer
11/16/1999US5984501 Super-precision positioning system
11/16/1999US5984391 Microfeature wafer handling apparatus and methods
11/16/1999US5984255 Method of using support tray for product assembly
11/16/1999US5984190 Method and apparatus for identifying integrated circuits
11/16/1999US5984165 Method of bonding a chip part to a substrate using solder bumps
11/16/1999US5984164 Method of using an electrically conductive elevation shaping tool
11/16/1999US5984162 Room temperature ball bonding
11/16/1999US5984116 Substrate support apparatus for a substrate housing
11/16/1999US5983909 Cleaning method and apparatus for the same
11/16/1999US5983907 Method of drying semiconductor wafers using hot deionized water and infrared drying
11/16/1999US5983906 Substrate processing apparatus with gas delivery, heaters, plasma system, vacuum and controllling
11/16/1999US5983829 Microwave plasma etching apparatus
11/16/1999US5983704 Method of measuring and analyzing contamination particles generated during the manufacture of semiconductor devices
11/16/1999US5983644 Integrated bake and chill plate
11/16/1999US5983513 Staging apparatus and method, and method for manufacturing the staging apparatus, and exposing apparatus using the staging apparatus
11/16/1999US5983493 Method of temporarily, then permanently, connecting to a semiconductor device
11/16/1999US5983490 Conductive ball mounting apparatus
11/16/1999US5983479 Apparatus and method of automatically removing a wafer carrier from a container
11/16/1999CA2061264C Etching solution for etching porous silicon, etching method using the etching solution and method of preparing semiconductor member using the etching solution
11/11/1999WO1999057940A2 Smif pod including independently supported wafer cassette
11/11/1999WO1999057807A1 Planar resist structure, especially an encapsulation for electric components and a thermomechanical method for the production thereof
11/11/1999WO1999057766A1 Single poly memory cell and array
11/11/1999WO1999057764A1 Laminated integrated circuit package
11/11/1999WO1999057762A1 Flip chip assembly with via interconnection
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