Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2000
06/06/2000US6071822 Etching process for producing substantially undercut free silicon on insulator structures
06/06/2000US6071821 Dry etching method of thin film
06/06/2000US6071820 Method for patterning integrated circuit conductors
06/06/2000US6071819 Flexible skin incorporating mems technology
06/06/2000US6071818 Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material
06/06/2000US6071817 Isolation method utilizing a high pressure oxidation
06/06/2000US6071816 Method of chemical mechanical planarization using a water rinse to prevent particle contamination
06/06/2000US6071815 Method of patterning sidewalls of a trench in integrated circuit manufacturing
06/06/2000US6071814 Selective electroplating of copper for damascene process
06/06/2000US6071813 Method and system for electrical coupling to copper interconnects
06/06/2000US6071812 Method of forming a modified metal contact opening to decrease its aspect ratio for deep sub-micron processes
06/06/2000US6071811 Deposition of titanium nitride films having improved uniformity
06/06/2000US6071810 Method of filling contact holes and wiring grooves of a semiconductor device
06/06/2000US6071809 Methods for forming high-performing dual-damascene interconnect structures
06/06/2000US6071808 Method of passivating copper interconnects in a semiconductor
06/06/2000US6071807 Fabrication method of semiconductor device including insulation film with decomposed organic content
06/06/2000US6071806 Method for preventing poisoned vias and trenches
06/06/2000US6071805 Air gap formation for high speed IC processing
06/06/2000US6071804 Method of fabricating bit lines by damascene
06/06/2000US6071803 Electrical contact to buried SOI structures
06/06/2000US6071802 Method for manufacturing semiconductor device having self-aligned contact
06/06/2000US6071801 Method and apparatus for the attachment of particles to a substrate
06/06/2000US6071799 Method of forming a contact of a semiconductor device
06/06/2000US6071798 Method for fabricating buried contacts
06/06/2000US6071797 Method for forming amorphous carbon thin film by plasma chemical vapor deposition
06/06/2000US6071796 Method of controlling oxygen incorporation during crystallization of silicon film by excimer laser anneal in air ambient
06/06/2000US6071795 Separation of thin films from transparent substrates by selective optical processing
06/06/2000US6071794 Method to prevent the formation of a thinner portion of insulating layer at the junction between the side walls and the bottom insulator
06/06/2000US6071793 Locos mask for suppression of narrow space field oxide thinning and oxide punch through effect
06/06/2000US6071792 Methods of forming shallow trench isolation regions using plasma deposition techniques
06/06/2000US6071791 Radiation-hardening of microelectronic devices by ion implantation into the oxide and annealing
06/06/2000US6071790 Method of crown capacitor rounding by oxidant dipping process
06/06/2000US6071789 Method for simultaneously fabricating a DRAM capacitor and metal interconnections
06/06/2000US6071788 Method of manufacturing a semiconductor device with a conductor film having a polycrystalline structure
06/06/2000US6071787 Method of forming a capacitor including forming a first and second conductive layers and etching layers to form alloyed conductive sidewall spacers
06/06/2000US6071786 Method of manufacturing a bipolar transistor and its emitter contact
06/06/2000US6071785 Low resistance ground wiring in a semiconductor device
06/06/2000US6071784 Annealing of silicon oxynitride and silicon nitride films to eliminate high temperature charge loss
06/06/2000US6071783 Pseudo silicon on insulator MOSFET device
06/06/2000US6071782 Partial silicidation method to form shallow source/drain junctions
06/06/2000US6071781 Method of fabricating lateral MOS transistor
06/06/2000US6071780 Compound semiconductor apparatus and method for manufacturing the apparatus
06/06/2000US6071779 Source line fabrication process for flash memory
06/06/2000US6071778 Memory device with a memory cell array in triple well, and related manufacturing process
06/06/2000US6071777 Method for a self-aligned select gate for a split-gate flash memory structure
06/06/2000US6071776 Flash memory structure and method of manufacture
06/06/2000US6071775 Methods for forming peripheral circuits including high voltage transistors with LDD structures
06/06/2000US6071774 Method for forming a capacitor with a multiple pillar structure
06/06/2000US6071773 Process for fabricating a DRAM metal capacitor structure for use in an integrated circuit
06/06/2000US6071772 Method of fabricating a semiconductor memory device having a tree-type capacitor
06/06/2000US6071771 Semiconductor processing method of forming a capacitor and capacitor constructions
06/06/2000US6071770 Semiconductor memory device and method for fabricating the same
06/06/2000US6071769 Method for forming a resistor load of a static random access memory
06/06/2000US6071768 Method of making an efficient NPN turn-on in a high voltage DENMOS transistor for ESD protection
06/06/2000US6071767 High performance/high density BICMOS process
06/06/2000US6071766 Method for fabricating semiconductor thin film
06/06/2000US6071765 Method of forming polycrystalline silicon layer on substrate and surface treatment apparatus thereof
06/06/2000US6071764 Semiconductor device and process for fabricating the same
06/06/2000US6071763 Method of fabricating layered integrated circuit
06/06/2000US6071762 Process to manufacture LDD TFT
06/06/2000US6071761 Method for encapsulated integrated circuits
06/06/2000US6071760 Solid-state image sensing device
06/06/2000US6071759 Method for manufacturing semiconductor apparatus
06/06/2000US6071758 Process for manufacturing a chip card micromodule with protection barriers
06/06/2000US6071757 Condensed memory matrix
06/06/2000US6071755 Method of manufacturing semiconductor device
06/06/2000US6071754 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
06/06/2000US6071751 Deuterium sintering with rapid quenching
06/06/2000US6071749 Process for forming a semiconductor device with controlled relative thicknesses of the active region and gate electrode
06/06/2000US6071676 Integrated circuit formed by exposing to radiation or particle beam through mask an organometallic fluoride compound coated onto substrate, removing residue and unexposed compound to leave submicron patterned deposit
06/06/2000US6071673 Method for the formation of resist pattern
06/06/2000US6071658 Forming a pattern on the mask, dividing the mask into patches and calculating the light intensity then exposure to electron beams
06/06/2000US6071630 Electrostatic chuck
06/06/2000US6071600 A substrate with integrated circuits and dielectrics for insulation
06/06/2000US6071597 Flexible circuits and carriers and process for manufacture
06/06/2000US6071572 Forming tin thin films using remote activated specie generation
06/06/2000US6071555 Ferroelectric thin film composites made by metalorganic decomposition
06/06/2000US6071552 Insitu formation of TiSi2 /TiN bi-layer structures using self-aligned nitridation treatment on underlying CVD-TiSi2 layer
06/06/2000US6071390 Sputtering apparatus
06/06/2000US6071388 Electroplating workpiece fixture having liquid gap spacer
06/06/2000US6071376 Method and apparatus for cleaning photomask
06/06/2000US6071374 Apparatus for etching glass substrate
06/06/2000US6071373 Chemical bath having a uniform etchant overflow
06/06/2000US6071372 RF plasma etch reactor with internal inductive coil antenna and electrically conductive chamber walls
06/06/2000US6071371 Method of simultaneously attaching surface-mount and chip-on-board dies to a circuit board
06/06/2000US6071350 Semiconductor device manufacturing apparatus employing vacuum system
06/06/2000US6071349 Gas supplying apparatus and vapor-phase growth plant
06/06/2000US6071341 Apparatus for fabricating single-crystal silicon
06/06/2000US6071315 Two-dimensional to three-dimensional VLSI design
06/06/2000US6071107 Apparatus for encapsulating products
06/06/2000US6071094 Photoresist dispense pump
06/06/2000US6071059 Loading and unloading station for semiconductor processing installations
06/06/2000US6071056 Shipping tray backside location
06/06/2000US6071055 Front end vacuum processing environment
06/06/2000US6070968 Ink jet cartridge and apparatus having a substrate with grooves which contain heat generating elements
06/06/2000US6070788 Method of soldering terminal faces, as well as a method of manufacturing a solder alloy
06/06/2000US6070783 Conductive ball attaching apparatus and method
06/06/2000US6070780 Bonding apparatus
06/06/2000US6070778 Wire bonding apparatus and control method thereof
06/06/2000US6070735 Sputtering apparatus simulation method
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