Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2000
05/16/2000US6062239 Fan blades on the rotor blow air over the wafers, to move any remaining fluid droplets away from the wafer centers, to allow centrifugal force to fling the fluid droplets off of the wafers.
05/16/2000US6062237 Polymer removal from top surfaces and sidewalls of a semiconductor wafer
05/16/2000US6062163 Plasma initiating assembly
05/16/2000US6062119 Method for handling and manipulating microelectronic components
05/16/2000US6062099 Robot for handling
05/16/2000US6061889 Device and method for removing heatspreader from an integrated circuit package
05/16/2000CA2201737C Heterojunction energy gradient structure
05/16/2000CA2139187C Semiconductor substrate and process for producing same
05/16/2000CA2129288C Phosphonooxymethyl esters of taxane derivatives
05/16/2000CA2118147C Method for lowering the phase transformation temperature of a metal silicide
05/16/2000CA2057490C Laminated diamond substrate
05/11/2000WO2000026974A2 Semiconductor processing chamber calibration tool
05/11/2000WO2000026970A1 Mos capacitor, liquid crystal display, integrated circuit and method of manufacture thereof
05/11/2000WO2000026969A1 Ferroelectric transistor and method for the production thereof
05/11/2000WO2000026963A1 Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same
05/11/2000WO2000026962A1 Method for semiconductor manufacturing
05/11/2000WO2000026961A1 Wafer support device in semiconductor manufacturing device
05/11/2000WO2000026960A1 Vacuum processor apparatus
05/11/2000WO2000026959A1 Semiconductor device, method of manufacture thereof, circuit board and electronic device
05/11/2000WO2000026958A1 System for assembling substrates to bonding zones provided with cavities
05/11/2000WO2000026957A1 Method of manufacturing a multi-layered ceramic substrate
05/11/2000WO2000026956A1 A method and apparatus for etching a substrate
05/11/2000WO2000026955A1 Fabrication of a transistor having an ultra-thin gate dielectric
05/11/2000WO2000026954A1 Method of reducing stop layer loss in a photoresist stripping process using hydrogen as a fluorine scavenger
05/11/2000WO2000026953A1 Thin film forming method, and semiconductor light emitting device manufacturing method
05/11/2000WO2000026952A1 Method for in-situ, post deposition surface passivation of a chemical vapor deposited film
05/11/2000WO2000026950A1 Method and device for ion implanting
05/11/2000WO2000026949A1 Semiconductor wafer and its manufacturing method
05/11/2000WO2000026948A1 Semiconductor wafer and vapor growth apparatus
05/11/2000WO2000026947A1 Method and system to control the concentration of dissolved gas in a liquid
05/11/2000WO2000026946A1 Dual surface reflector
05/11/2000WO2000026944A1 Method and apparatus for hf-hf cleaning
05/11/2000WO2000026943A1 Vacuum processing apparatus with low particle generating wafer holder
05/11/2000WO2000026941A2 Word line driver for semiconductor memories
05/11/2000WO2000026938A1 Apparatus for ion implantation
05/11/2000WO2000026850A1 Electronics assembly apparatus with stereo vision linescan sensor
05/11/2000WO2000026724A1 Organic-solvent-based photosensitive resist composition and method of forming resist pattern
05/11/2000WO2000026646A1 Method and apparatus for improved defect detection
05/11/2000WO2000026640A1 Electronics assembly apparatus with improved imaging system
05/11/2000WO2000026613A1 Optical monitoring of radial ranges in chemical mechanical polishing a metal layer on a substrate
05/11/2000WO2000026609A2 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
05/11/2000WO2000026592A1 Pfc type gas recovery method and device
05/11/2000WO2000026444A1 Copper metallization structure and method of construction
05/11/2000WO2000026443A2 Method and apparatus for electrochemical mechanical deposition
05/11/2000WO2000026430A1 Sputtering apparatus
05/11/2000WO2000026311A1 Solution for forming silica coating film, process for producing the same, and silica coating film and process for producing the same
05/11/2000WO2000026000A1 Method and device for separating into two slices a wafer of material, in particular semiconductor material
05/11/2000WO2000025984A1 Chemical mechanical polishing a substrate having a filler layer and a stop layer
05/11/2000WO2000025983A1 Use of zeta potential during chemical mechanical polishing for end point detection
05/11/2000WO2000025981A1 Unpolished work holding board and production method thereof and work polishing method and device
05/11/2000WO2000025980A1 Method and apparatus for grinding wafer
05/11/2000WO2000025978A1 Monitoring system for dicing saws
05/11/2000WO2000025625A2 Method and apparatus for insertion and retainment of pomade within a dispenser
05/11/2000WO2000019535B1 Semiconductor structure for semiconductor components
05/11/2000WO2000013190A8 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part
05/11/2000WO2000008671A3 Device for coating panel-shaped substrates
05/11/2000WO2000008225A3 Organocopper precursors for chemical vapor deposition
05/11/2000WO2000000992A3 Focus ring arrangement for substantially eliminating unconfined plasma in a plasma processing chamber
05/11/2000DE19953620A1 Low voltage MOS gate controlled semiconductor component, useful for a direct voltage/direct voltage converter, employs planar strip technology and has a minimal power index
05/11/2000DE19952273A1 Copper connection film, e.g. for an ultra large scale integration, is produced by high pressure grain growth heat treatment of a deposited film while suppressing pore formation
05/11/2000DE19951993A1 Halbleiter-Isolator-Struktur mit reduzierter Störkapazität und ein Verfahren zu deren Herstellung Semiconductor-insulator structure with reduced parasitic capacitance and a method for their preparation
05/11/2000DE19929606A1 Production of a printed circuit comprises using a protective layer made of plastic to encapsulate the printed circuit unit and a section of the lead frame
05/11/2000DE19900980C1 Verification method for integrated circuit layout especially LSI circuits
05/11/2000DE19851873A1 Verfahren zum Aufwachsen einer kristallinen Struktur A method of growing a crystalline structure
05/11/2000DE19851749A1 Polarisationsoptisch kompensiertes Objektiv Optical polarization compensated lens
05/11/2000DE19851280A1 Structured metal oxide layer useful as capacitor dielectric in semiconductor memories is produced by structuring an amorphous metal oxide layer, and then heat treating to the polycrystalline state
05/11/2000DE19850873A1 Verfahren zum Bearbeiten eines Erzeugnisses der Halbleitertechnik A method for processing a product of semiconductor technology
05/11/2000DE19850852A1 Ferroelektrischer Transistor und Verfahren zu dessen Herstellung Ferroelectric transistor and method of producing the
05/11/2000DE19850144A1 Optical surface analysis method for semiconductor wafers
05/11/2000DE19849586C1 Three-dimensional IC production comprises opening of filled trenches before cutting a three-dimensional circuit structure into individual circuits
05/11/2000DE19849542A1 Verfahren zur Herstellung eines Kondensators A method for manufacturing a capacitor
05/11/2000DE19848999A1 Speicherzellenanordnung und Implantationsmaske zum Herstellen von dieser Memory cell array and implantation mask for making this
05/11/2000DE19847848C1 Vorrichtung und Erzeugung angeregter/ionisierter Teilchen in einem Plasma Device and generating excited / ionized particles in a plasma
05/11/2000CA2349559A1 Method for semiconductor manufacturing
05/10/2000WO2000059022A1 Process for the formation of silicon oxide films
05/10/2000EP0999729A2 Process for laser soldering and for temperature monitoring of semi-conductor chips, and chip cards manufactured according to this process
05/10/2000EP0999597A1 Ferroelectric nonvolatile transistor and method of making same
05/10/2000EP0999595A2 Semiconductor device and manufacturing method therefor
05/10/2000EP0999594A1 Integrated circuit having MOS field-effect transistors comprising regions doped with nitrogen and method of making the same
05/10/2000EP0999592A1 Fuse layout for improved fuse blow process window
05/10/2000EP0999589A2 Silicon nitride circuit board
05/10/2000EP0999588A2 Semiconductor device and method for assembling the same
05/10/2000EP0999587A2 Production of semiconductor device
05/10/2000EP0999586A2 Semiconductor device and method of producing same
05/10/2000EP0999585A1 DRAM memory and MOS transistor fabrication
05/10/2000EP0999584A2 Method for manufacturing semiconductor device
05/10/2000EP0999583A2 Increasing stability of a substrate by a supporting element
05/10/2000EP0999582A2 N Type impurity doping using implantation of P2+ions or As2+ions
05/10/2000EP0999581A2 Simulation method executable with less time
05/10/2000EP0999580A2 Simplified high q inductor substrate
05/10/2000EP0999579A2 An inductor or low loss interconnect in an integrated circuit
05/10/2000EP0999578A2 Sample processing system
05/10/2000EP0999577A2 Sample processing system
05/10/2000EP0999576A2 Sample processing system
05/10/2000EP0999575A2 Sample separating apparatus and method, and substrate manufacturing method
05/10/2000EP0999572A2 Electrostatic deflector for electron beam exposure apparatus
05/10/2000EP0999475A2 Position detecting system and exposure apparatus using the same
05/10/2000EP0999474A1 Compounds for photoresist and resin composition for photoresist
05/10/2000EP0999472A2 Method and apparatus for dry-etching half-tone phase-shift films, half-tone phase-shift photomasks and method for the preparation thereof, and semiconductor circuits and method for the fabrication thereof
05/10/2000EP0999451A2 Connecting apparatus, method of fabricating wiring film with holder, inspection system and method of fabricating semiconductor element