Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2000
05/24/2000EP1003026A2 Scanning depletion microscopy for carrier profiling
05/24/2000EP1002844A2 Electroconductive, thermoplastic and heat-activatable adhesive film
05/24/2000EP1002830A2 Nanoporous polymers films
05/24/2000EP1002626A2 A linear CMP tool design using in-situ slurry distribution and concurrent pad conditionning
05/24/2000EP1002625A1 Cleaning device for surface plate correcting dresser
05/24/2000EP1002611A1 Solder ball connections and assembly process
05/24/2000EP1002610A1 Solder ball connections and assembly process
05/24/2000EP1002452A1 Contact arrangement linking two substrates and method for the production of said contact arrangement
05/24/2000EP1002339A1 Contact arrangement for a planar, integrable semiconductor arrangement and method for producing said contact arrangement
05/24/2000EP1002338A1 Wafer marking
05/24/2000EP1002336A4 N2o nitrided-oxide trench sidewalls to prevent boron outdiffusion and decrease stress
05/24/2000EP1002336A1 N2o nitrided-oxide trench sidewalls to prevent boron outdiffusion and decrease stress
05/24/2000EP1002335A4 Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor
05/24/2000EP1002335A1 Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor
05/24/2000EP1002334A1 Method for configuring semiconductors with high precision, good homogeneity and reproducibility
05/24/2000EP1002333A1 Two-piece slit valve door with molded-in-place seal for a vacuum processing system
05/24/2000EP1002332A1 Two-piece slit valve insert for vacuum processing system
05/24/2000EP1002331A1 Plasma vapor deposition with coil sputtering
05/24/2000EP1002330A1 Method for monitoring the performance of an ion implanter using reusable wafers
05/24/2000EP1002329A1 Semiconductor process compensation utilizing non-uniform ion implantation methodology
05/24/2000EP1002319A2 A ferroelectric data processing device
05/24/2000EP1002242A2 Stepper or scanner having two energy monitors for a laser
05/24/2000EP1002228A1 Method for applying or removing material
05/24/2000EP1002211A2 Method and apparatus for drying substrates
05/24/2000EP1002142A1 Method and apparatus for reducing deposition of contaminants
05/24/2000EP1001865A1 Method and apparatus for endpoint detection for chemical mechanical polishing
05/24/2000EP1001864A1 A carrier head with local pressure control for a chemical mechanical polishing apparatus
05/24/2000EP1001852A1 Polymerizable fluxing agents and fluxing adhesive compositions therefrom
05/24/2000EP0879303B1 Device and process for coating substrates
05/24/2000EP0832407A4 Passive gas substrate thermal conditioning apparatus and method
05/24/2000EP0742847B1 A method of depositing tungsten nitride using a source gas comprising silicon
05/24/2000EP0739499B1 Method of forming polyimide patterns on substrates
05/24/2000CN2379914Y Apparatus for assembling chip and having chip turning-over function
05/24/2000CN1254442A Silicon carbide field controlled bipolar switch
05/24/2000CN1254441A Method of planarizing upper surface of semiconductor wafer
05/24/2000CN1254440A Method for etching silicon wafer
05/24/2000CN1254188A Ferro-electric storage read-write memory
05/24/2000CN1254187A Semiconductor device
05/24/2000CN1254186A Electric fuse with close space length and its production method in semiconductor
05/24/2000CN1254185A Packaging device for small semiconductor
05/24/2000CN1254184A Dynamic random access memory capacitor manufacture method
05/24/2000CN1254183A Self-alignment process capable of making subcritical contact with wire
05/24/2000CN1254182A Method for making element by using reworkable gap packing sealant
05/24/2000CN1254181A Method for preparing electronic instrument component by simultaneously adopoting soldifying adhesive and sealant
05/24/2000CN1254180A Method for correcting photo-adjacency effect in course of production of semiconductor device
05/24/2000CN1254108A Method for making self-alignment component
05/24/2000CN1052817C Insulated-gate device (IG device) having narrowbandgap-source structure and method of manufacturing the same
05/24/2000CN1052815C 薄膜半导体集成电路 Thin-film semiconductor integrated circuit
05/24/2000CN1052814C Unit of semiconductor IC
05/23/2000US6067633 Design and methodology for manufacturing data processing systems having multiple processors
05/23/2000US6067507 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processd during their manufacture
05/23/2000US6067375 Correction method and correction apparatus of mask pattern
05/23/2000US6067253 Nonvolatile semiconductor memory device capable of suppressing a variation of the bit line potential
05/23/2000US6067251 Non-volatile semiconductor memory device
05/23/2000US6067249 Layout of flash memory and formation method of the same
05/23/2000US6067248 Nonvolatile semiconductor memory with single-bit and multi-bit modes of operation and method for performing programming and reading operations therein
05/23/2000US6067246 Method for writing data to and reading multiple bit data words from a DNA optical storage device
05/23/2000US6067245 High speed, high bandwidth, high density nonvolatile memory system
05/23/2000US6067222 Substrate support apparatus and method for fabricating same
05/23/2000US6067163 Automated substrate pattern recognition system
05/23/2000US6067153 Pattern defect inspecting apparatus
05/23/2000US6067146 Photolithographic apparatus
05/23/2000US6067145 Light exposing device for manufacturing semiconductor device which further removes asymmetrical aberration
05/23/2000US6067132 LCD having contact electrode coupling gate electrode of first pixel to region active layer of second pixel region
05/23/2000US6066957 Floating spring probe wireless test fixture
05/23/2000US6066956 Inspection method and wiring current observation method for semiconductor device
05/23/2000US6066952 Method for polysilicon crystalline line width measurement post etch in undoped-poly process
05/23/2000US6066896 Semiconductor integrated circuit device and its manufacturing method
05/23/2000US6066895 Interconnecting structure for semiconductor integrated circuits and method
05/23/2000US6066894 Semiconductor device and a method of manufacturing the same
05/23/2000US6066893 Contaminant resistant barriers to prevent outgassing
05/23/2000US6066892 Copper alloy seed layer for copper metallization in an integrated circuit
05/23/2000US6066891 Electrode for semiconductor device including an alloy wiring layer for reducing defects in an aluminum layer and method for manufacturing the same
05/23/2000US6066889 Methods of selectively filling apertures
05/23/2000US6066888 Tape carrier and tape carrier device using the same
05/23/2000US6066885 Subtrench conductor formed with large tilt angle implant
05/23/2000US6066881 Integrated circuit having a memory cell transistor with a gate oxide layer which is thicker than the gate oxide layer of a peripheral circuit transistor
05/23/2000US6066880 Semiconductor device
05/23/2000US6066877 Vertical power MOSFET having thick metal layer to reduce distributed resistance
05/23/2000US6066876 Integrated circuit arrangement having at least one MOS transistor manufactured by use of a planar transistor layout
05/23/2000US6066874 Flash memory cell with vertical channels, and source/drain bus lines
05/23/2000US6066873 Method and apparatus for preventing P1 punchthrough
05/23/2000US6066872 Semiconductor device and its fabricating method
05/23/2000US6066871 Semiconductor memory device having a memory cell capacitor and a fabrication process thereof
05/23/2000US6066869 Circuit and method for a folded bit line memory cell with vertical transistor and trench capacitor
05/23/2000US6066868 Ferroelectric based memory devices utilizing hydrogen barriers and getters
05/23/2000US6066867 Current control functional device
05/23/2000US6066865 Single layer integrated metal enhancement mode field-effect transistor apparatus
05/23/2000US6066854 Method of writing cross pattern in adjacent areas of layer sensitive to charged particle beam for improving stitching accuracy without sacrifice of throughput
05/23/2000US6066853 Electron-optical system exhibiting reduced aberration
05/23/2000US6066849 Scanning electron beam microscope
05/23/2000US6066609 Mixture containing crown compound
05/23/2000US6066581 Sol-gel precursor and method for formation of ferroelectric materials for integrated circuits
05/23/2000US6066579 Hydrogen heat treatment method of silicon wafers using a high-purity inert substitution gas
05/23/2000US6066578 Method and system for providing inorganic vapor surface treatment for photoresist adhesion promotion
05/23/2000US6066577 Prevent degradation of metal from exposure to fluorine
05/23/2000US6066576 Method for forming oxide using high pressure
05/23/2000US6066575 Semiconductor processing spray coating apparatus
05/23/2000US6066574 Hot plate cure process for BCB low k interlevel dielectric
05/23/2000US6066573 Method of producing dielectric film