Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2000
05/18/2000WO2000028585A1 Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
05/18/2000WO2000028584A1 Method for producing a structured layer containing metal oxide
05/18/2000WO2000028583A1 Semiconductor wafer and production method therefor
05/18/2000WO2000028582A1 Ultra thin oxynitride and nitride/oxide stacked gate dielectrics fabricated by high pressure technology
05/18/2000WO2000028581A2 Processing chamber with rapid wafer exchange
05/18/2000WO2000028580A2 Method and apparatus for cleaning the edge of a thin disc
05/18/2000WO2000028579A2 Method and apparatus for cleaning the edge of a thin disc
05/18/2000WO2000028578A2 Improved megasonic cleaner
05/18/2000WO2000028577A1 An apparatus for integrated monitoring of wafers and for process control in the semiconductor manufacturing and a method for use thereof
05/18/2000WO2000028576A2 Semiconductor component having a wiring partly extending in the substrate and method for producing same
05/18/2000WO2000028399A1 Protection circuit for an integrated circuit
05/18/2000WO2000028384A1 Wafer chamber having a gas curtain for extreme-uv lithography
05/18/2000WO2000028383A1 Radiation-sensitive resin composition
05/18/2000WO2000028278A1 Electronics assembly apparatus with height sensing sensor
05/18/2000WO2000028116A1 Growth method for a crystalline structure
05/18/2000WO2000028107A1 Substituted phenylethylene precursor deposition method
05/18/2000WO2000027891A1 Preparation of partially cross-linked polymers and their use in pattern formation
05/18/2000WO2000027591A1 Chemical-mechanical-polishing system with continuous filtration
05/18/2000WO2000027585A1 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
05/18/2000WO2000027552A1 Continuous cleaning megasonic tank with reduced duty cycle transducers
05/18/2000WO2000027551A1 Improved tank design for sonic wafer cleaning
05/18/2000WO2000016404A8 Lateral bipolar transistor and method of making same.
05/18/2000WO2000010195A3 Preparation of metal-precipitates permeable insulator for soi substrate
05/18/2000WO2000008674A3 Mosfet having self-aligned gate and buried shield and method of making same
05/18/2000WO2000007222A3 Method for forming low-impedance high-density deposited-on-laminate structures having reduced stress
05/18/2000WO2000000664A9 Susceptor for barrel reactor
05/18/2000WO1999060014A3 Methods and compounds for modulating nuclear receptor coactivator binding
05/18/2000DE19955105A1 Semiconductor laminated conductor track structure (STACKED VIA) used high integration processes, e.g. LSI, VLSI
05/18/2000DE19954832A1 Robot arm mechanism for semiconductor manufacture has several arm connections and joint mechanisms
05/18/2000DE19953847A1 Wafer polishing device has a holder head for pressing the wafer against a rotating tensioning plate to polish the wafer
05/18/2000DE19953784A1 Variable load circuit for variable signal transmission circuit, responds to control signal resulting from switch-on by variably coupling signal line to signal node via meltable fuse and capacitor
05/18/2000DE19953299A1 Thin film resistor for an integrated circuit has a resistive layer containing silicon or germanium, carbon and chromium or nickel or containing silicon, germanium and chromium or nickel
05/18/2000DE19953166A1 Multiple stacker for handling device, with stacking frame, container stacking sector, test plate position checking guide and up and down movement device
05/18/2000DE19952177A1 Verfahren zum Ausbilden einer zweifachen Kobaltsilicidschicht mit unterschiedlichen Dicken während der Herstellung einer integrierten Schaltung und entsprechende IC-Struktur A method of forming a dual Kobaltsilicidschicht having different thicknesses during fabrication of an integrated circuit and corresponding IC structure
05/18/2000DE19950193A1 Mittel-Versorgungsreferenzspannungsgenerator Medium supply reference voltage generator
05/18/2000DE19945080A1 Component handling device for integrated circuit chip, has controller to drive pressure cylinder when waiting time, after interrupt signal generation, exceeds a predetermined value
05/18/2000DE19911149C1 IC structure, e.g. a DRAM cell array, has a buried conductive structure with two different conductivity portions separated by a diffusion barrier
05/18/2000DE19911148C1 DRAM cell array has single vertical transistor memory cells with buried bit lines and low space requirement
05/18/2000DE19906875A1 Semiconductor assembly, especially with microwave chips e.g. for a mobile telephone, has a thin heat radiating substrate formed by diffusion metallization of molten copper into a molybdenum pressing
05/18/2000DE19856573C1 Vertical integration of active circuit planes involves connecting two substrates so connection surfaces are electrically connected, reducing second substrate, freeing external connection surfaces
05/18/2000DE19852933A1 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs
05/18/2000DE19852852A1 Lithographic process used in emitter structuring of bipolar transistors comprises forming photo-lacquer layer on antireflection layer on substrate and etching
05/18/2000DE19851941A1 Verfahren und Vorrichtung zur Positionierung eines Gegenstandes Method and apparatus for positioning an object
05/18/2000DE19851599A1 Scanning apparatus for semiconductor disks
05/18/2000DE19851461A1 Schnelle Leistungsdiode Fast power diode
05/18/2000DE19851167A1 Planar capacitor for storing electrical charge has electrode with special geometric shape, made of specific material
05/18/2000DE19847101C1 CVD reactor used in the production of the semiconductor wafers has upper and lower reactor chambers provided with a gas feed line and gas removal line
05/17/2000EP1001469A2 Forming contacts on semiconductor substrates for radiation detectors and imaging devices
05/17/2000EP1001468A1 Rare earth oxide layer on a GaAs- or GaN-based semiconductor body
05/17/2000EP1001467A2 Semiconductor device and method of manufacturing the same
05/17/2000EP1001466A1 High-voltage transistor structure for handling high-voltages in CMOS integrated circuits
05/17/2000EP1001463A2 Aluminum interconnects for integrated circuits comprising titanium under and overlayers
05/17/2000EP1001461A1 High speed power diode having an amorphous carbon passivation layer and corresponding method
05/17/2000EP1001460A1 Method and apparatus for detecting, monitoring and characterizing edge defects on semiconductor wafers
05/17/2000EP1001459A2 Integrated circuit comprising a capacitor and method
05/17/2000EP1001458A1 Isotropic etching of silicon using hydrogen chloride
05/17/2000EP1001455A1 Apparatus for protecting a substrate support surface and method of fabricating same
05/17/2000EP1001454A2 Surface treatment method and surface treatment apparatus
05/17/2000EP1001449A1 Deposited film forming system and process
05/17/2000EP1001448A2 Thin film DC plasma processing system
05/17/2000EP1001431A1 Capacitor loaded memory cell
05/17/2000EP1001325A1 Method and device for positioning an object
05/17/2000EP1001314A2 Durable optical system for projection exposure apparatus and method of manufacturing the same
05/17/2000EP1001295A1 Objective with polarisation effects compensation
05/17/2000EP1001273A2 Integrated semiconductor chip with preset input output configuration over bond pads
05/17/2000EP1001208A2 Water-distribution piping of gas-dissolved cleaning water
05/17/2000EP1001006A1 Aqueous composition, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluid
05/17/2000EP1000995A1 Abrasive composition for the electronics industry
05/17/2000EP1000949A1 Organosilicon nanocluster and process for producing the same
05/17/2000EP1000948A2 Copper containing substituted phenylethylene precursor and synthesis method
05/17/2000EP1000947A2 Metal containing substituted ethylene precursor and synthesis method
05/17/2000EP1000706A2 Grinding machine spindle flexibly attached to platform
05/17/2000EP1000704A2 Flattening polishing device and flattening polishing method
05/17/2000EP1000703A2 Edge polisher and edge polishing method
05/17/2000EP1000673A2 Wafer cleaning system with progressive megasonic wave
05/17/2000EP1000442A4 Vialess integrated inductive elements for electromagnetic applications
05/17/2000EP1000442A1 Vialess integrated inductive elements for electromagnetic applications
05/17/2000EP1000441A1 A capacitor array arrangment for improving capacitor array matching
05/17/2000EP1000440A1 Ultra high-speed chip interconnect using free-space dielectrics
05/17/2000EP1000439A1 Method of forming side dielectrically isolated semiconductor devices and mos semiconductor devices fabricated by this method
05/17/2000EP1000425A2 Method for nano-structuring amorphous carbon layers
05/17/2000EP1000363A1 Spreading resistance profiling system
05/17/2000EP1000346A1 System for detecting anomalies and/or features of a surface
05/17/2000EP1000291A1 Fluid storage and dispensing system
05/17/2000EP0999918A1 Polishing semiconductor wafers
05/17/2000EP0980301A4 Coaxial drive loader arm
05/17/2000EP0958542A4 Method and system for configuring an array of logic devices
05/17/2000EP0880754B1 Method and device for bonding a wire conductor
05/17/2000EP0750530B1 Low-temperature oxidation at surfaces using ozone decomposition products formed by microwave discharge
05/17/2000EP0727086B1 Ultra high density, non-volatile ferromagnetic random access memory
05/17/2000CN1253668A Device for liming AC, especially during short circuits
05/17/2000CN1253665A Semiconductor element, especially solar cell and method for production thereof
05/17/2000CN1253662A Board for mounting semiconductor element, method for manufacturing same, and semiconductor device
05/17/2000CN1253661A Capacitors in integrated circuits
05/17/2000CN1253639A Antireflective coating compositions for photoresist compositions and use thereof
05/17/2000CN1253638A Light absorbing polymers
05/17/2000CN1253468A Control of thermal distortion of chip mount
05/17/2000CN1253450A Central power supply reference generator
05/17/2000CN1253380A Semi-conductor device
05/17/2000CN1253378A Ball grid array type semiconductor device packaging
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