Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2000
06/08/2000WO2000033369A1 Plasma etching apparatus
06/08/2000WO2000033368A1 Spin-rinse-dry process with backside wafer etching
06/08/2000WO2000033367A1 Wet cleaning apparatus
06/08/2000WO2000033365A1 Fabrication of gallium nitride layers by lateral growth
06/08/2000WO2000033364A1 Epitaxial aluminium-gallium nitride semiconductor substrate
06/08/2000WO2000033363A1 Method for joining dissimilar semiconductor wafers
06/08/2000WO2000033361A1 Method of fabrication of a ferro-electric capacitor and method of growing a pzt layer on a substrate
06/08/2000WO2000033360A1 A method and apparatus for the transport and tracking of an electronic component
06/08/2000WO2000033359A2 Specimen holding robotic arm end effector
06/08/2000WO2000033358A1 Method of forming an assembly of stacked layers
06/08/2000WO2000033356A2 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
06/08/2000WO2000033355A2 Apparatus for storing and moving a cassette
06/08/2000WO2000033317A1 Semiconductor device comprising a non-volatile memory which is erasable by means of uv irradiation
06/08/2000WO2000033140A1 Composition and method for removing probing ink and negative photoresist from silicon wafers
06/08/2000WO2000033138A1 Large-apertured projection lens with minimal diaphragm error
06/08/2000WO2000033096A1 Probe card for probing wafers with raised contact elements
06/08/2000WO2000033089A2 Lithographic contact elements
06/08/2000WO2000033056A1 Method and apparatus for wafer inspection
06/08/2000WO2000033055A1 Method for checking a surface to be analysed and scanning surface-analyser
06/08/2000WO2000032841A1 Apparatus for forming thin film
06/08/2000WO2000032840A1 Method and system for producing semiconductor crystals using temperature management
06/08/2000WO2000032835A2 Electro-chemical deposition system
06/08/2000WO2000032713A1 Stabilized slurry compositions
06/08/2000WO2000032529A1 Quartz glass jig having large irregularities on the surface and method for producing the same
06/08/2000WO2000032516A1 Method of producing inorganic compound solid substance and method of manufacturing semiconductor device
06/08/2000WO2000032472A1 Passively activated valve for carrier purging
06/08/2000WO2000032356A1 Reverse linear polisher with loadable housing
06/08/2000WO2000032320A1 System and method for coating of substrates
06/08/2000WO2000016377A3 Method for forming a three-component nitride film containing metal and silicon
06/08/2000WO2000015881A3 Gas feeding system for chemical vapor deposition reactor and method of controlling the same
06/08/2000WO2000015429A8 Composite wire with noble metal cladding
06/08/2000WO2000010172A3 Storage cell array and corresponding production method
06/08/2000WO2000008670A3 Dose monitor for plasma-monitor ion implantation doping system
06/08/2000WO2000007221A3 Holographic, laser-induced fabrication of indium nitride quantum wires and quantum dots
06/08/2000WO1999067443A9 Methods for etching an aluminum-containing layer
06/08/2000DE19958227A1 Production of semiconductor wafers comprises turning the wheel of a grinding machine to remove the resin coating from the wafer exposing the wafer up to its bumps
06/08/2000DE19957792A1 Transport and active temperature control of IC circuits to be tested using rotary transporter with liquid heated or cooled temperature control stations
06/08/2000DE19957614A1 Method for manipulating IC modules for insertion in test equipment with simplified carrier system
06/08/2000DE19956550A1 Large scale integrated circuit has reference potential control circuit for controlling reference potential within each memory device of large scale integrated circuit
06/08/2000DE19956344A1 Halbleitervorrichtung mit geringer Störkapazität A semiconductor device with less parasitic capacitance
06/08/2000DE19952316A1 Verfahren zum Ausbilden einer Siliziumdioxidschicht und Verfahren zum Herstellen eines Dünnfilmtransistors dadurch A method of forming a silicon dioxide layer and method for manufacturing a thin film transistor characterized
06/08/2000DE19951055A1 Ätzmittel, elektronische Vorrichtung mit einem Substrat, sowie Verfahren zur Herstellung des Substrats unter Verwendung des Ätzmittels Etchant electronic device with a substrate and method of manufacturing the substrate using the etching agent
06/08/2000DE19856331A1 Verfahren zur Eingehäusung elektronischer Bauelemente Method for Eingehäusung electronic components
06/08/2000DE19856084A1 Verfahren zur Herstellung einer Metalloxidschicht bzw. einer strukturierten Metalloxidschicht A process for producing a metal oxide layer or a structured metal oxide
06/08/2000DE19855924A1 Connection is produced to a metal contact, e.g. a tungsten contact of a semiconductor device, by using an oxygen plasma containing water vapor for photolacquer layer ashing
06/08/2000DE19855629A1 Teilchenoptische Anordnung und Verfahren zur teilchenoptischen Erzeugung von Mikrostrukturen A particle-particle arrangement and method for producing microstructures
06/08/2000DE19854743A1 Vorrichtung zum Naßätzen einer Kante einer Halbleiterscheibe Device for wet-etching of an edge of a semiconductor wafer
06/08/2000DE19854418A1 Halbleiterbauelement mit zumindest einem Kondensator sowie Verfahren zu dessen Herstellung A semiconductor device comprising at least a capacitor, and methods for its preparation
06/08/2000CA2352160A1 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
06/08/2000CA2351607A1 Method of forming inorganic compound solid and method of manufacturing semiconductor device employing the same
06/07/2000EP1006761A1 Plasma processor
06/07/2000EP1006590A1 Ferroelectric memory and method for manufacturing same
06/07/2000EP1006589A2 MOS thin film transistor and method of fabricating same
06/07/2000EP1006584A2 Semiconductor device having SOI structure and manufacturing method thereof
06/07/2000EP1006583A1 Ferroelectric memory device and method for manufacturing same
06/07/2000EP1006582A2 Semiconductor memory device having a hydrogen barrier, and method for manufacturing the same
06/07/2000EP1006581A1 Ferroelectric memory device having a protective layer
06/07/2000EP1006580A2 Semiconductor memory device having a hydrogen barrier layer, and method for manufacturing the same
06/07/2000EP1006579A1 Device for compensating process and operating parameter variations in CMOS integrated circuits
06/07/2000EP1006577A2 Multilayer wiring board
06/07/2000EP1006576A1 Semiconductor device
06/07/2000EP1006575A2 Composition for resin sealing a semiconductor device, resin sealed semiconductor device and method of manufacturing the same
06/07/2000EP1006574A1 Semiconductor plastic package and method for producing printed wiring board
06/07/2000EP1006573A1 Method for manufacturing integrated BiCMOS circuits on a common CMOS substrate
06/07/2000EP1006572A1 Slotted damascene lines for low resistive wiring lines for integrated circuit
06/07/2000EP1006571A2 Process for fabricating semiconductor device improved in step coverage without sacrifice of reliability of lower aluminium line
06/07/2000EP1006570A1 Removal of post-rie polymer on Al/Cu metal line
06/07/2000EP1006569A2 Deposition of an insulating film
06/07/2000EP1006568A1 Enhancing protection of dielectrics from plasma induced damages
06/07/2000EP1006567A2 Method of manufacturing semiconductor wafer method of using and utilizing the same
06/07/2000EP1006566A2 Film forming equipment
06/07/2000EP1006565A2 Conveying device
06/07/2000EP1006564A1 Process of fabrication of semiconductor wafer boat and wafer boat
06/07/2000EP1006563A2 Sealing terminal
06/07/2000EP1006562A2 Two-piece clamp ring for holding semiconductor wafer or other workpiece
06/07/2000EP1006556A1 Particle-optical device and method for producing microstructures
06/07/2000EP1006553A1 Process for determination of blackening of a lamp
06/07/2000EP1006444A2 Method and apparatus for testing random access memory device
06/07/2000EP1006413A2 Alignment method and exposure apparatus using the same
06/07/2000EP1006411A2 Illumination system for vuv microlithography
06/07/2000EP1006409A2 Method for patterning a semiconductor wafer using a mask that has several regions with different scattering ability
06/07/2000EP1006389A2 Reduction objective for microlithography, apparatus and method for projection exposure
06/07/2000EP1006388A2 Reduction projection objective lens for microlithography
06/07/2000EP1006373A2 Objective with crystal lenses and projection exposure apparatus for microlithography
06/07/2000EP1006348A1 Measurement system and method for measuring critical dimensions using ellipsometry
06/07/2000EP1006212A1 Film forming method
06/07/2000EP1006166A1 Polishing composition and polishing method employing it
06/07/2000EP1005956A2 Grinding machine spindle flexibly attached to platform
06/07/2000EP1005955A2 Grinding machine spindle flexibly attached to platform
06/07/2000EP1005705A1 Integrated electric circuit with capacitor
06/07/2000EP1005703A1 Method for producing electrically conductive cross connections between two layers of wiring on a substrate
06/07/2000EP1005664A1 Lithographic apparatus comprising a dedicated mirror projection system
06/07/2000EP1005642A1 Method and device for determining a parameter for a metallization bath
06/07/2000EP1005626A1 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
06/07/2000EP1005581A1 Domed wafer reactor vessel window with reduced stress at atmospheric and above atmospheric pressures
06/07/2000CN1255890A Bonded joint
06/07/2000CN1255752A Dynamic DASD with overlapped capacitor and buried word line
06/07/2000CN1255751A Ferroelectric integrated circuit with oxygen doped protective layer
06/07/2000CN1255750A Semiconductor device and method of forming such semiconductor device
06/07/2000CN1255748A Method for making storage electrode of DRAM capacitor
1 ... 5526 5527 5528 5529 5530 5531 5532 5533 5534 5535 5536 5537 5538 5539 5540 5541 5542 5543 5544 5545 5546 ... 6590