Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2000
05/30/2000US6068089 Releasable semiconductor wafer lifter basket
05/30/2000US6068088 Releasable semiconductor wafer lifter basket
05/30/2000US6068016 Modular fluid flow system with integrated pump-purge
05/30/2000US6068002 Cleaning and drying apparatus, wafer processing system and wafer processing method
05/30/2000US6068000 Substrate treatment method
05/30/2000US6067931 Thermal processor for semiconductor wafers
05/30/2000US6067930 Coaxial plasma processing apparatus
05/30/2000US6067728 Supercritical phase wafer drying/cleaning system
05/30/2000US6067727 Apparatus and method for drying substrates
05/30/2000US6067709 Applying encapsulating material to substrates
05/30/2000US6067680 Semiconductor processing method of forming a conductively doped semiconductive material plug within a contact opening
05/25/2000WO2000030183A1 Transistor and semiconductor device
05/25/2000WO2000030181A2 Field effect-controlled transistor and method for producing the same
05/25/2000WO2000030180A1 METHOD AND SYSTEM FOR EMITTER PARTITIONING FOR SiGe RF POWER TRANSISTORS
05/25/2000WO2000030176A1 A polysilicon resistor and a method of producing it
05/25/2000WO2000030175A1 Interlayer between titanium nitride and high density plasma oxide
05/25/2000WO2000030174A1 A method and device for improved salicide resistance on polysilicon gates
05/25/2000WO2000030173A1 Conveyor system
05/25/2000WO2000030172A2 System for receiving and retaining a substrate
05/25/2000WO2000030171A1 Low alpha emissive solder bumps
05/25/2000WO2000030169A1 Field effect transistor structure with abrupt source/drain junctions
05/25/2000WO2000030168A1 Process for etching oxide using hexafluorobutadiene or related hydroflourocarbons and manifesting a wide process window
05/25/2000WO2000030166A1 Method for producing nanostructures in thin films
05/25/2000WO2000030165A1 Method and device for removing photoresist film
05/25/2000WO2000030164A1 Photoresist film removing method and device therefor
05/25/2000WO2000030162A1 Novel detergent and cleaning method using it
05/25/2000WO2000030161A1 Inert gas recovery annealing of hydrogen-damaged ferroelectric films
05/25/2000WO2000030160A1 Automatic wafer mapping in a wet environment on a wafer cleaner
05/25/2000WO2000030159A1 Method to decrease dishing rate during cmp in metal semiconductor structures
05/25/2000WO2000030158A1 Gas distribution system for a cvd processing chamber
05/25/2000WO2000030157A1 Equipment for uv wafer heating and photochemical processing
05/25/2000WO2000030156A1 Vacuum processing system
05/25/2000WO2000030155A1 Buffer chamber and method for integrating physical and chemical vapor deposition chambers together in a processing system
05/25/2000WO2000030154A2 Method to control film removal rates for improved polishing in metal cmp
05/25/2000WO2000030149A1 Apparatus for providing rf return current path control in a semiconductor wafer processing system
05/25/2000WO2000030148A1 Integrated power modules for plasma processing systems
05/25/2000WO2000030147A1 Method and apparatus for ionized physical vapor deposition
05/25/2000WO2000030146A1 Method and device for exposing a substrate to light
05/25/2000WO2000030119A1 Ic test software system for mapping logical functional test data of logic integrated circuits to physical representation
05/25/2000WO2000029919A1 Rapid on chip voltage generation for low power integrated circuits
05/25/2000WO2000029906A2 Antireflective composition for a deep ultraviolet photoresist
05/25/2000WO2000029894A2 Laser scanning system mirror
05/25/2000WO2000029835A1 Non-contact topographical analysis apparatus and method thereof
05/25/2000WO2000029799A1 Apparatus and method for thermal processing of semiconductor substrates
05/25/2000WO2000029642A1 Removing oxides or other reducible contaminants from a substrate by plasma treatment
05/25/2000WO2000029640A1 Method for residue-free anisotropic etching of aluminum and its alloys
05/25/2000WO2000029637A1 Diffusion barrier materials with improved step coverage
05/25/2000WO2000029636A2 High purity tantalum targets for sputtering
05/25/2000WO2000029176A1 Conveyor system
05/25/2000WO2000029135A1 Bath system for semiconductor wafers with obliquely mounted sonic transducers
05/25/2000WO2000029128A1 Method of forming paste
05/25/2000WO2000019519B1 Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors
05/25/2000WO2000019495A3 Chamber liner for semiconductor process chambers
05/25/2000WO2000019441A3 Magnetoresistive memory having improved interference immunity
05/25/2000WO2000019440A3 Magnetoresistive memory with low current density
05/25/2000WO2000019272B1 Methods of reducing proximity effects in lithographic processes
05/25/2000WO2000017914A3 Method for forming silicide regions on an integrated device
05/25/2000WO2000017913A3 Method for forming a silicide region on a silicon body
05/25/2000WO2000014775A3 Multi-lamp cone reflector for semiconductor wafer heating
05/25/2000WO2000003301A9 Exposure device having a planar motor
05/25/2000WO1999067683A8 Optical system, especially a projection light facility for microlithography
05/25/2000WO1999063590A9 A method for treating a deposited film for resistivity reduction
05/25/2000DE19952742A1 Semiconductor memory device, e.g. a CMOS-SRAM, has a memory cell section with twin wells which are deeper than an isolation structure used to isolate elements in the wells
05/25/2000DE19951752A1 Electrical device, e.g. a thyristor, IGBT or large capacitor diode, has an intermediate contact of two different diameter electrically and thermally conductive components between a heat emitting element and an electrode
05/25/2000DE19941376A1 Stellungsänderungsvorrichtung für elektronische Chipbauteile Position changing device for electronic chip components
05/25/2000DE19855008A1 High quality integrated inductor, for an h.f. circuit, is produced by forming bimetallic strip lead portions which bend, on cooling, to raise a deposited coil from a substrate
05/25/2000DE19853805A1 Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie Electrically conductive, thermoplastic and heat-activatable adhesive film
05/25/2000DE19853703A1 Chip production, especially for a chip card, comprises applying metallization onto a thinned finished chip wafer, bonded to a handling wafer, for connection by vias to the chip metallization and/or circuit structure
05/25/2000DE19853684A1 Forming load resistors for static random access memory cells by depositing a refractory oxide onto an insulator and converting to a resistance element using a two-step hydrogen process
05/25/2000DE19853617A1 Connection production process, especially for producing metal connections to tungsten contacts in semiconductor devices, comprises forming a protective layer on an exposed part of the metal contact
05/25/2000DE19853447A1 Magnetischer Speicher Magnetic memory
05/25/2000DE19852832A1 Production of e.g. multilayer metal plastic laminate forming lead frame, includes stamping processes raising contact surfaces and adhesive dams, advancing miniaturization by replacement of ball grid arrays
05/25/2000DE19852763A1 Trench capacitor, for a DRAM cell, is produced by forming a sacrificial material plug within the trench prior to height reduction etching of an annular dielectric layer on the trench upper side wall region
05/25/2000DE19852543A1 Nanostructure, especially for a nanoelectronic component such as a single-electron tunnel contact or tunnel diode, is produced by external field alignment and adsorption of organized bio-molecules on a thin film prior to etching
05/25/2000DE19852430A1 Circuit arrangement with temperature dependent semiconductor test and repair logic
05/25/2000DE19852072A1 Halbleiterbauelement mit einer stückweise im Substrat verlaufenden Verdrahtung und Verfahren zu dessen Herstellung Semiconductor component with a piecewise extending wiring in the substrate and process for its production
05/25/2000DE19852071A1 Integrierter Halbleiterchip mit über Bondpads voreingestellter Dateneingabe-/Datenausgabe-Organisationsform Integrated semiconductor chip bond pads on preset data input / output organizational form
05/25/2000DE19841430A1 Verfahren zur Herstellung kristalliner Halbleiterschichten A process for manufacture of crystalline semiconductor layers
05/25/2000CA2350656A1 A polysilicon resistor and a method of producing it
05/25/2000CA2290306A1 Method of forming wiring pattern
05/24/2000EP1003282A2 Integrated circuit for processing audio signal
05/24/2000EP1003224A1 Analogue MISFET with threshold voltage adjuster
05/24/2000EP1003223A2 Method of fabricating a TFT
05/24/2000EP1003222A1 Improved field-effect transistor and corresponding manufacturing method
05/24/2000EP1003219A2 DRAM with stacked capacitor and buried word line
05/24/2000EP1003217A2 Regulating resistor network, semiconductor device including the resistor network, and method for fabricating the device
05/24/2000EP1003216A2 Multilayered ceramic structure
05/24/2000EP1003214A2 Semiconductor device and method of producing the same
05/24/2000EP1003213A2 Method of fabricating resin-sealed semiconductor devices
05/24/2000EP1003212A2 Method of and apparatus for bonding light-emitting element
05/24/2000EP1003211A2 Multilayer ceramic structure
05/24/2000EP1003210A2 A method of forming coatings
05/24/2000EP1003209A1 Process for manufacturing semiconductor device
05/24/2000EP1003208A2 Integrated circuit having self-aligned hydrogen barrier layer and method for fabricating same
05/24/2000EP1003207A2 Laser irradiation apparatus, laser irradiation method, beam homogenizer, semiconductor device, and method of manufacturing the semiconductor device
05/24/2000EP1003206A2 Rutile dielectric material for semiconductor devices
05/24/2000EP1003201A2 Electron beam exposure apparatus and exposure method
05/24/2000EP1003178A1 Conductive fluorocarbon polymer and method of making same
05/24/2000EP1003176A2 Magnetic memory
05/24/2000EP1003150A1 Transistor circuit, display panel and electronic apparatus
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