Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2000
06/14/2000CN1256763A Active matrix substrate, electro-optic device, method of manufacturing active matrix substrate, and electronic device
06/14/2000CN1256723A Low defect density, ideal oxygen precipitating silicon
06/14/2000CN1256610A Manufacture of solid self-lubricating surface for movable microelectronic machine
06/14/2000CN1256521A Semiconductor device of SOI structure
06/14/2000CN1256520A Semiconductor device
06/14/2000CN1256519A Double-gate substrate danamic RAM cell array
06/14/2000CN1256518A Extension groove preventing stacked capacitor from interacting between parts
06/14/2000CN1256517A Semiconductor device with logic circuit and memory circuit
06/14/2000CN1256516A Circuit and method for reducing ghost double-pole effect during static discharge
06/14/2000CN1256513A Method for manufacture of semiconductor IC device
06/14/2000CN1256512A Semiconductor device and its manufacturing method
06/14/2000CN1256511A Method for manufacture of semiconductor capacitor
06/14/2000CN1256510A Method for manufacture of semiconductor device
06/14/2000CN1256509A Cutting device
06/14/2000CN1256508A Method for manufacture of semiconductor device
06/14/2000CN1256496A Semiconductor device with microprocessor and dynamic RAM being in the same chip
06/14/2000CN1256476A Matrix display unit and its making method, and hot-pressed key assembly
06/14/2000CN1256438A Prevention of photoresist poisoning caused by antireflection coating of medium in manufacture of semiconductor
06/14/2000CN1256288A Epoxy resin composition for packaging semiconductor and semiconductor device thereof
06/14/2000CN1256241A Method and system for distributing liquid chemicals
06/14/2000CN1256238A Modular integrated circuit for use in modular integrated circuit handling device and handling method of carrier thereof
06/14/2000CN1256185A Ultrasonic vibration welding method
06/14/2000CN1053551C Multilayer circuit board
06/14/2000CN1053537C Electrical charge transfer apparatus
06/13/2000USRE36735 Self-aligned low resistance buried contact process
06/13/2000US6075936 Logic circuit simulation apparatus having cycle-based simulator for simulating circuits including multi-cycle paths
06/13/2000US6075922 Process for preventing gas leaks in an atmospheric thermal processing chamber
06/13/2000US6075909 Optical monitoring system for III-V wafer processing
06/13/2000US6075880 Method for detection of defects in the inspection of structured surfaces
06/13/2000US6075738 Semiconductor memory device
06/13/2000US6075736 Semiconductor memory device with improved sense amplifier driver
06/13/2000US6075732 Semiconductor memory device with redundancy circuit
06/13/2000US6075720 Memory cell for DRAM embedded in logic
06/13/2000US6075712 Flip-chip having electrical contact pads on the backside of the chip
06/13/2000US6075711 System and method for routing connections of integrated circuits
06/13/2000US6075691 Thin film capacitors and process for making them
06/13/2000US6075606 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates
06/13/2000US6075428 Magnetic system for an electromagnetic relay
06/13/2000US6075427 MCM with high Q overlapping resonator
06/13/2000US6075404 Substrate biasing circuit and semiconductor integrated circuit device
06/13/2000US6075397 Semiconductor integrated circuit
06/13/2000US6075389 Operation speed measuring circuit and semiconductor device incorporating the same circuit
06/13/2000US6075375 Apparatus for wafer detection
06/13/2000US6075373 Inspection device for inspecting a semiconductor wafer
06/13/2000US6075358 Device in a semiconductor manufacturing installation in particular for integrated circuits
06/13/2000US6075334 Automatic calibration system for wafer transfer robot
06/13/2000US6075292 Semiconductor device and method of manufacturing the same in which degradation due to plasma can be prevented
06/13/2000US6075291 Structure for contact formation using a silicon-germanium alloy
06/13/2000US6075282 Leadframe for a semiconductor device and associated method
06/13/2000US6075280 Precision breaking of semiconductor wafer into chips by applying an etch process
06/13/2000US6075277 Power integrated circuit
06/13/2000US6075276 ESD protection device using Zener diodes
06/13/2000US6075274 Semiconductor devices having gate stack with improved sidewall integrity
06/13/2000US6075273 Integrated circuit device in which gate oxide thickness is selected to control plasma damage during device fabrication
06/13/2000US6075272 Structure for gated lateral bipolar transistors
06/13/2000US6075270 Field effect transistor
06/13/2000US6075269 Semiconductor device and process for manufacturing the same
06/13/2000US6075268 Ultra high density inverter using a stacked transistor arrangement
06/13/2000US6075267 Split-gate non-volatile semiconductor memory device
06/13/2000US6075266 Semiconductor device having MIS transistors and capacitor
06/13/2000US6075265 DRAM cell arrangement and method for its fabrication
06/13/2000US6075264 Structure of a ferroelectric memory cell and method of fabricating it
06/13/2000US6075263 Method of evaluating the surface state and the interface trap of a semiconductor
06/13/2000US6075262 Semiconductor device having T-shaped gate electrode
06/13/2000US6075261 Neutron detecting semiconductor device
06/13/2000US6075260 Semiconductor integrated circuit device and method of arranging functional cell
06/13/2000US6075259 Power semiconductor devices that utilize buried insulating regions to achieve higher than parallel-plane breakdown voltages
06/13/2000US6075258 Elevated transistor fabrication technique
06/13/2000US6075257 Thin film transistor substrate for a liquid crystal display having a silicide prevention insulating layer in the electrode structure
06/13/2000US6075256 Photoelectric converter, its driving method, and system including the photoelectric converter
06/13/2000US6075255 Contactor system for a ball grid array device
06/13/2000US6075216 Device transfer and reinspection method for IC handler
06/13/2000US6074962 Forming a silica based coating by hydrolysis of trialkloxy silane, drying, radiation, coating and drying
06/13/2000US6074961 Removing silk like spin-on-glass treating with hydrofluoric acid, cleaning silicon wafers with caro's dip
06/13/2000US6074960 Method and composition for selectively etching against cobalt silicide
06/13/2000US6074959 Method manifesting a wide process window and using hexafluoropropane or other hydrofluoropropanes to selectively etch oxide
06/13/2000US6074958 Semiconductor integrated circuit arrangement fabrication method
06/13/2000US6074957 Methods of forming openings and methods of controlling the degree of taper of openings
06/13/2000US6074956 Construction of semiconductor, barriers, dielectrics, stracks, polysilicon and layers of tungsten silicide
06/13/2000US6074955 Method of fabricating a node contact window of DRAM
06/13/2000US6074954 Process for control of the shape of the etch front in the etching of polysilicon
06/13/2000US6074953 Dual-source plasma etchers, dual-source plasma etching methods, and methods of forming planar coil dual-source plasma etchers
06/13/2000US6074952 Forming apertures in semiconductor wafers with etching
06/13/2000US6074951 Vapor phase etching of oxide masked by resist or masking material
06/13/2000US6074950 Alignment strategy for asymmetrical alignment marks
06/13/2000US6074949 Method of preventing copper dendrite formation and growth
06/13/2000US6074948 Method for manufacturing thin semiconductor device
06/13/2000US6074947 Process for improving uniform thickness of semiconductor substrates using plasma assisted chemical etching
06/13/2000US6074946 Semiconductors with etching holes and dielectric layers with masks
06/13/2000US6074945 Diene ruthenium carbon monoxide complex, vaporization and forming ruthenium metal film
06/13/2000US6074944 Methods for priming wafers employed in integrated circuit devices using dihydropyrane
06/13/2000US6074943 Sidewalls for guiding the via etch
06/13/2000US6074942 Method for forming a dual damascene contact and interconnect
06/13/2000US6074941 Method of forming a via with plasma treatment of SOG
06/13/2000US6074940 Fusion forming a semiconductors substrate, insulation films, etching, burying metal in etched region
06/13/2000US6074939 Multistage process of forming an underlying insulator, oxidation resistant metal layer on metallic wiring layer, removal of protective metal layer, forming silicon oxide layer and spin on glass silicon compound
06/13/2000US6074938 Method of forming a semiconductor device comprising a dummy polysilicon gate electrode short-circuited to a dummy element region in a substrate
06/13/2000US6074937 End-of-range damage suppression for ultra-shallow junction formation
06/13/2000US6074936 Method of fabricating a quantum device
06/13/2000US6074935 Inhibition of watermarks on semiconductor wafers with cationic surfactants