Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2000
06/22/2000WO2000036329A1 System for conveying liquids without pulsing
06/22/2000WO2000036037A1 Compositions and methods for polishing semiconductor wafers
06/22/2000WO2000035782A2 Distributed control system architecture and method for a material transport system
06/22/2000WO2000035627A2 Multi-step chemical mechanical polishing
06/22/2000WO2000035623A1 Laser processing
06/22/2000WO2000035573A1 Apparatus and method for point-of-use treatment of effluent gas streams
06/22/2000WO2000017724A9 High-speed precision positioning apparatus
06/22/2000WO2000017423A3 Method for producing an amorphous or polycrystalline layer on an insulating region
06/22/2000WO2000013222A8 Silane-based nanoporous silica thin films
06/22/2000WO2000007236A3 Method and apparatus for forming improved metal interconnects
06/22/2000WO2000003574A3 Heat sink with transverse ribs
06/22/2000WO1999045572A3 Ultra-small capacitor array
06/22/2000CA2355144A1 Method and device for detecting spatial structure characteristics of a crystal
06/22/2000CA2354624A1 Distributed control system architecture and method for a material transport system
06/22/2000CA2352062A1 Method for printing of transistor arrays on plastic substrates
06/22/2000CA2293060A1 Process for producing epitactic-silicon germanium layers
06/21/2000EP1011149A2 Semiconductor memory device and method for producing the same
06/21/2000EP1011147A2 Transistors having a quantum-wave interference layer
06/21/2000EP1011146A1 Integrated edge structure for high voltage semiconductor devices and related manufacturing process
06/21/2000EP1011144A1 Semiconductor device and manufacturing method thereof
06/21/2000EP1011143A1 Semiconductor device with BiCMOS type substrate having noise decoupling
06/21/2000EP1011142A1 Semiconductor device comprising a substrate on insulator with noise decoupling
06/21/2000EP1011141A2 Semiconductor device and process for producing it
06/21/2000EP1011138A2 Quantum conductive recrystallization barrier layers for semiconductor devices
06/21/2000EP1011137A1 Method for integrating resistors and ESD self-protected transistors with memory matrix
06/21/2000EP1011136A1 Fabrication of a resistor within an integrated circuit and integrated device comprising a static memory with four transistors and two resistors
06/21/2000EP1011135A2 Semiconductor interconnect structure employing a pecvd inorganic dielectric layer and process for making same
06/21/2000EP1011134A1 Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactor
06/21/2000EP1011133A1 Encapsulated microelectronic SMD component, especially for an active implantable medical device and method for its manufacture
06/21/2000EP1011132A2 Ultrasonic bumping of electronic components
06/21/2000EP1011131A1 Methods for enhancing the metal removal rate during the chemical-mechanical polishing process of a semiconductor
06/21/2000EP1011130A1 Method of anodizing silicon substrate and method of producing acceleration sensor of surface type
06/21/2000EP1011129A2 Method for manufacturing semiconductor device
06/21/2000EP1011127A2 Chip junction nozzle
06/21/2000EP1011081A1 Information processing equipment
06/21/2000EP1011029A2 Radiation-sensitive resin composition
06/21/2000EP1011028A2 A method for fabrication of multi-step structures using embedded etch stop layers
06/21/2000EP1010781A1 Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
06/21/2000EP1010492A2 Ultrasonic vibration bonding method
06/21/2000EP1010245A1 System for compensating for temperature induced delay variation in an integrated circuit
06/21/2000EP1010223A1 Method for treating substrates
06/21/2000EP1010203A1 Method for etching a conductive layer
06/21/2000EP1010202A1 Method for minimising corner effect by densifying the insulating layer
06/21/2000EP1010201A1 Component with protective layer and method for producing a protective layer for a component
06/21/2000EP1010200A1 Nitrogen liner beneath transistor source/drain regions to retard dopant diffusion
06/21/2000EP1010199A1 Method of forming a barrier layer in a contact structure
06/21/2000EP1010198A1 Method for making a thin film of solid material
06/21/2000EP1010182A2 Two bit non-volatile electrically erasable and programmable semiconductor memory cell utilizing asymmetrical charge trapping
06/21/2000EP1010151A1 Radio frequency data communications device
06/21/2000EP1010111A1 Reusable modules for complex integrated circuit devices
06/21/2000EP1010108A1 Method and apparatus for channel-routing of an electronic device
06/21/2000EP1010107A1 Routing method removing cycles in vertical constraint graph
06/21/2000EP1010053A1 Interface circuit for full-custom and semi-custom timing domains
06/21/2000EP1010040A1 Laser-illuminated stepper or scanner with energy sensor feedback
06/21/2000EP1010031A1 Illumination design for scanning microlithography systems
06/21/2000EP1010012A2 Apparatus for measuring minority carrier lifetimes in semiconductor materials
06/21/2000EP1009589A1 Chemicals supply system and its use
06/21/2000EP1009588A1 Polishing pad and method for making polishing pad with elongated microcolumns
06/21/2000EP0852812A4 Semiconductor memory circuitry
06/21/2000DE19960503A1 Metall-Verbindungs-Kontakt-Struktur mit einem kleinen Kontaktwiderstand und einem geringen Übergangsverlust sowie Verfahren zur Herstellung derselben Metal connection contact structure with a small contact resistance and a low loss transition as well as methods for producing the same
06/21/2000DE19960368A1 Microlithographic method e.g. for manufacture of photomask for semiconductors, display panel, integrated optical device or electronic connection structure, uses feedback position correction for incident light fleck
06/21/2000DE19958873A1 Pallet circulation method for IC module handling device uses transfer device for moving palette into pivot position for reception by lowering device delivering palette to loading or unloading lifting plate
06/21/2000DE19956621A1 Elektrooptische Abtastsonde und Messverfahren unter Verwendung derselben Electro-optical scanning probe and measuring method using the same
06/21/2000DE19938786A1 High precision cleaning of a glass substrate, including crystallized glass, e.g. substrate for magnetic, optical or optomagnetic disk, semiconductor or liquid crystal uses ionically activated water produced by electrolysis
06/21/2000DE19923262C1 Memory cell array, especially dynamic random access memory cell array, production comprises insulation removal from only one side wall of a recess by non-masked etching to allow adjacent cell transistor formation
06/21/2000DE19917155C1 Semiconductor protection against electrostatic discharge achieves higher snap back voltage for continued circuit operation using structure offering more compact arrangement
06/21/2000DE19901014C1 Metallic impurity depth profile, in a semiconductor wafer, is determined by repeated etching solution wetting of the entire surface of a horizontal wafer and etching solution analysis
06/21/2000DE19857142A1 Semiconductor wafer or disc transport device uses spaced jets for directing gas onto underside of transported wafers or discs with broken sections received in spaces between transport jets
06/21/2000DE19857064A1 Passivation of surface of semiconductor material, with or without natural oxide film, e.g. for solar cell, involves coating with solution containing polyfluorinated hydrocarbon with acid side groups and drying
06/21/2000DE19857039A1 Mikroelektronische Struktur Microelectronic structure
06/21/2000DE19853588A1 Halteeinrichtung für ein Substrat Holding means for a substrate
06/21/2000CN1257611A Method and device for reducing electric field concentrations in soi semiconductor components
06/21/2000CN1257610A Integration of low-K polymers into interlevel dielectrics using controlled electron-beam radiation
06/21/2000CN1257609A Method for producing planar trenches
06/21/2000CN1257608A Trench isolation
06/21/2000CN1257607A Method for making a patterned array of solder bumps
06/21/2000CN1257599A Electronic module for chip card
06/21/2000CN1257556A Low defect density ideal oxygen precipitating silicon
06/21/2000CN1257529A Alkoxysilane/organic polymer composition for thin insulating film prodution and use thereof
06/21/2000CN1257311A Semiconductor memory and making method thereof
06/21/2000CN1257310A Semiconductor storage device
06/21/2000CN1257309A Low resistance silicide filler for channel capacitor
06/21/2000CN1257308A DRAM based on deep channel and making method thereof
06/21/2000CN1257307A Method for making semiconductor device
06/21/2000CN1257306A Combined preannel/oxidation process using quick heat treatment
06/21/2000CN1257305A Method enhancing metal removing rate in semiconductive chemical-mechanical polishing
06/21/2000CN1257304A Thin film transistor array panel for liquid crystal display and making method thereof
06/21/2000CN1257303A Method for making crystal semiconductor
06/21/2000CN1257254A Selectively processing system for work piece and control method thereof
06/21/2000CN1257209A Small interval contactor
06/21/2000CN1257034A Base plate unloading apparatus and method thereof
06/21/2000CN1256992A Compositions and method for reducing hollow of patterned matel in chemical-mechanical polishing
06/21/2000CN1053766C Method for making bit lines on capacitor array of memory unit
06/21/2000CN1053765C Method for producing connecting wire of conductor
06/21/2000CN1053764C Beam caused electrographic technology
06/20/2000US6078845 Apparatus for carrying semiconductor devices
06/20/2000US6078737 Design rule check method
06/20/2000US6078727 Optical disc, recording apparatus, and computer-readable recording medium
06/20/2000US6078641 X-ray lithography system and x-ray lithography method
06/20/2000US6078640 X-ray exposure apparatus
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