Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2000
06/13/2000US6074933 Integrated circuit fabrication
06/13/2000US6074932 Method for forming a stress-free shallow trench isolation
06/13/2000US6074931 Process for recess-free planarization of shallow trench isolation
06/13/2000US6074930 Method for forming a trench isolation structure comprising an interface treatment for trench liner and a subsequent annealing process
06/13/2000US6074929 Implanting silicon substrate layer, masking, etching and dopes and oxygen ions and heat treatment
06/13/2000US6074928 Method of fabricating SOI substrate
06/13/2000US6074927 Shallow trench isolation formation with trench wall spacer
06/13/2000US6074926 Method of increasing capacitance by surface roughening in semiconductor wafer processing
06/13/2000US6074925 Method for fabricating semiconductor device with polycide structure for electrode or interconnect
06/13/2000US6074924 Method of forming CMOS integrated circuitry
06/13/2000US6074923 Method of fabricating metal-oxide-semiconductor transistor
06/13/2000US6074922 Enhanced structure for salicide MOSFET
06/13/2000US6074921 Self-aligned processing of semiconductor device features
06/13/2000US6074920 Self-aligned implant under transistor gate
06/13/2000US6074919 Method of forming an ultrathin gate dielectric
06/13/2000US6074918 Methods of fabrication DRAM transistor cells with a self-aligned storage electrode contact
06/13/2000US6074917 LPCVD oxide and RTA for top oxide of ONO film to improve reliability for flash memory devices
06/13/2000US6074916 FLASH-EPROM with embedded EEPROM
06/13/2000US6074915 Method of making embedded flash memory with salicide and sac structure
06/13/2000US6074914 Integration method for sidewall split gate flash transistor
06/13/2000US6074913 Method for forming a DRAM capacitor
06/13/2000US6074912 Method for forming different area vias of dynamic random access memory
06/13/2000US6074911 Method of fabricating dual cylindrical capacitor
06/13/2000US6074910 Self-aligned storage node definition in a DRAM that exceeds the photolithography limit
06/13/2000US6074909 Apparatus and method for forming controlled deep trench top isolation layers
06/13/2000US6074908 Process for making merged integrated circuits having salicide FETS and embedded DRAM circuits
06/13/2000US6074907 Method of manufacturing capacitor for analog function
06/13/2000US6074906 Complementary metal-oxide semiconductor device having source/drain regions formed using multiple spacers
06/13/2000US6074905 Forming polysilicon lines for integrated circuits with gate oxide layer on silicon substrate, depositing polysilicon layer and sion antireflection coating, photoresists, etching, oxidation and removal of sion layer
06/13/2000US6074904 Method and structure for isolating semiconductor devices after transistor formation
06/13/2000US6074903 Method for forming electrical isolation for semiconductor devices
06/13/2000US6074902 Method of forming complementary type conductive regions on a substrate
06/13/2000US6074901 Forming semiconductors, oxidation and transferring a substrate
06/13/2000US6074900 Method for producing semiconductor device
06/13/2000US6074897 Integrated circuit bonding method and apparatus
06/13/2000US6074896 Method of processing semiconductor material wafers and method of forming flip chips and semiconductor chips
06/13/2000US6074895 Applying a plasma on a board passivation layer for integrated circuits, joining to chip carriers with solder bumps electrically connecting, applying under fill encapsulant
06/13/2000US6074894 Mounting method of semiconductor device
06/13/2000US6074893 Multilayer elements for photoresists layers with grooves and filling, drying and developing
06/13/2000US6074886 Electrical characterization of an insulating layer covering a conducting or semiconducting substrate
06/13/2000US6074885 Lead titanate isolation layers for use in fabricating PZT-based capacitors and similar structures
06/13/2000US6074801 Negative type photoresist composition used for light beam with short wavelength and method of forming pattern using the same
06/13/2000US6074787 Method of making mask pattern utilizing auxiliary pattern forbidden region
06/13/2000US6074696 Forming a thin film on the surface of a semiconductor wafer, etching the thin film formed on the surface of the substrate and etching the surface of the substrate.
06/13/2000US6074695 Composition and process for forming electrically insulating thin films
06/13/2000US6074569 Stripping method for photoresist used as mask in Ch4 /H2 based reactive ion etching (RIE) of compound semiconductors
06/13/2000US6074568 Plasma etching used for manufacturing semiconductor devices.
06/13/2000US6074567 Method for producing a semiconductor package
06/13/2000US6074561 Apparatus and method for recovering photoresist developers and strippers
06/13/2000US6074546 Method for photoelectrochemical polishing of silicon wafers
06/13/2000US6074519 Plasma etching apparatus having a sealing member coupling an upper electrode to an etching chamber
06/13/2000US6074517 Method and apparatus for detecting an endpoint polishing layer by transmitting infrared light signals through a semiconductor wafer
06/13/2000US6074516 High sputter, etch resistant window for plasma processing chambers
06/13/2000US6074515 Apparatus for processing substrates
06/13/2000US6074514 High selectivity etch using an external plasma discharge
06/13/2000US6074513 Etching apparatus and method for manufacturing optical devices
06/13/2000US6074512 Inductively coupled RF plasma reactor having an overhead solenoidal antenna and modular confinement magnet liners
06/13/2000US6074488 Plasma chamber support having an electrically coupled collar ring
06/13/2000US6074486 Apparatus and method for manufacturing a semiconductor device having hemispherical grains
06/13/2000US6074485 Crystal growth observing apparatus using a scanning tunneling microscope
06/13/2000US6074479 Silicon single crystal wafer annealing method and equipment, and silicon single crystal wafer and manufacturing method related thereto
06/13/2000US6074478 Flat selective silicon epitaxial thin film in which facet formation and loading effect are suppressed, dichlorosilane, hydrogen chloride and hydrogen gas are introduced into a reaction chamber.
06/13/2000US6074463 Fan filter unit having a monitoring device for use in a semiconductor device manufacturing clean room
06/13/2000US6074443 Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot
06/13/2000US6074442 Method of separating slice base mounting member from wafer and jig adapted therefor
06/13/2000US6074429 Optimizing combinational circuit layout through iterative restructuring
06/13/2000US6074289 Apparatus for holding substrate to be polished
06/13/2000US6074276 Polishing apparatus
06/13/2000US6074202 Apparatus for manufacturing a semiconductor material
06/13/2000US6074158 IC transporting apparatus, IC posture altering apparatus and IC take-out apparatus
06/13/2000US6074154 Substrate treatment system, substrate transfer system, and substrate transfer method
06/13/2000US6073829 Method and arrangement for attaching a component
06/13/2000US6073828 End effector for substrate handling and method for making the same
06/13/2000US6073827 Wire bonding capillary with a conical surface
06/13/2000US6073681 Workpiece chuck
06/13/2000US6073636 Dry etcher apparatus and method of preventing residual reaction gas from condensing on wafers after etching
06/13/2000US6073577 Electrode for plasma processes and method for manufacture and use thereof
06/13/2000US6073501 Apparatus and method for semiconductor wafer processing which facilitate determination of a source of contaminants or defects
06/13/2000US6073464 Laser surface treatment device and method
06/13/2000US6073369 Substrate drying apparatus and method
06/13/2000US6073366 Substrate cooling system and method
06/13/2000US6073361 Apparatus for externally monitoring RPM of spin rinse dryer
06/13/2000CA2159243C Method of manufacturing chip-size package-type semiconductor device
06/10/2000CA2291296A1 Ultrasonic vibration bonding method
06/08/2000WO2000033622A2 Improved heat sink and process of manufacture
06/08/2000WO2000033388A1 METHOD OF PRODUCING DEVICE QUALITY (Al)InGaP ALLOYS ON LATTICE-MISMATCHED SUBSTRATES
06/08/2000WO2000033386A2 Trench-gate semiconductor devices and their manufacture
06/08/2000WO2000033384A1 Eeprom cell with tunneling across entire separated channels
06/08/2000WO2000033383A1 Dram cell arrangement and method for the production thereof
06/08/2000WO2000033382A1 Integrated circuit and method for the production thereof
06/08/2000WO2000033381A1 Semiconductor device having shared gate electrode and fabrication thereof
06/08/2000WO2000033379A1 Semiconductor device, method of manufacture thereof, and electronic device
06/08/2000WO2000033377A1 Wafer transfer device
06/08/2000WO2000033376A1 Container
06/08/2000WO2000033375A1 Anisotropic conductor film, semiconductor chip, and method of packaging
06/08/2000WO2000033374A1 Anisotropic conductor film, semiconductor chip, and method of packaging
06/08/2000WO2000033373A2 Method of manufacturing a semiconductor device comprising a bipolar transistor
06/08/2000WO2000033372A1 Plasma etching of polysilicon using fluorinated gas mixtures
06/08/2000WO2000033371A1 Composition for removing sidewall and method of removing sidewall
06/08/2000WO2000033370A1 Dry etching
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