Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2000
06/27/2000US6080624 Nonvolatile semiconductor memory and method for manufacturing the same
06/27/2000US6080623 Method of manufacturing capacitive element with a non-doped semiconductor film to minimize native oxide formation
06/27/2000US6080622 Method for fabricating a DRAM cell capacitor including forming a conductive storage node by depositing and etching an insulative layer, filling with conductive material, and removing the insulative layer
06/27/2000US6080621 Method of manufacturing dynamic random access memory
06/27/2000US6080620 Method for fabricating interconnection and capacitors of a DRAM using a simple geometry active area, self-aligned etching, and polysilicon plugs
06/27/2000US6080619 Method for manufacturing DRAM capacitor
06/27/2000US6080618 Controllability of a buried device layer
06/27/2000US6080617 Semiconductor device having capacitor and manufacturing method thereof
06/27/2000US6080616 Methods of fabricating memory cells with reduced area capacitor interconnect
06/27/2000US6080615 Method for forming a semiconductor device incorporating a dummy gate electrode
06/27/2000US6080614 Method of making a MOS-gated semiconductor device with a single diffusion
06/27/2000US6080613 Methods of forming integrated circuit memory devices having improved bit line and storage electrode contact regions therein
06/27/2000US6080612 Method of forming an ultra-thin SOI electrostatic discharge protection device
06/27/2000US6080611 Silicon thin film containing impurities
06/27/2000US6080610 Method a CMOS transistor and isolated back electrodes on an SOI substrate
06/27/2000US6080609 Method of making MOSFET structure
06/27/2000US6080607 Method for manufacturing a transistor having a low leakage current
06/27/2000US6080606 Electrophotographic patterning of thin film circuits
06/27/2000US6080605 Shearing a thixotropic composition; curing
06/27/2000US6080604 Semiconductor device having tab-leads and a fabrication method thereof
06/27/2000US6080603 Fixtures and methods for lead bonding and deformation
06/27/2000US6080602 Method of producing a semiconductor device using a reduced mounting area
06/27/2000US6080599 Semiconductor optoelectric device and method of manufacturing the same
06/27/2000US6080597 Test pattern structure for measuring misalignment in semiconductor device fabrication process and method for measuring misalignment
06/27/2000US6080596 Method for forming vertical interconnect process for silicon segments with dielectric isolation
06/27/2000US6080594 Forming dielectric; contact hole; plugging
06/27/2000US6080593 Multilayer; dielectric, ferroelectric layer and electrodes
06/27/2000US6080592 Computers
06/27/2000US6080531 Using mixture of carrier solvent, ozone, and (bi) carbonate compounds
06/27/2000US6080529 Patterning semiconductors
06/27/2000US6080526 Integration of low-k polymers into interlevel dielectrics using controlled electron-beam radiation
06/27/2000US6080524 Amplified photoresist
06/27/2000US6080514 Fabrication method of mask for semiconductor device
06/27/2000US6080512 Semiconductor exposure method and apparatus, and a reticle therefor
06/27/2000US6080499 Lead zirconium titanate
06/27/2000US6080492 Gold alloy thin wire for semiconductor devices
06/27/2000US6080446 Method of depositing titanium nitride thin film and CVD deposition apparatus
06/27/2000US6080444 Placing substrate on susceptor equipped with heating member and situated in chamber, forming film on substrate by heating substrate using heating member while controlling total rate of supplying gas, annealing
06/27/2000US6080443 Method for production of microcapsule type conductive filler
06/27/2000US6080354 Use for manufacturing a plastic-sealed semiconductor device
06/27/2000US6080292 Monitoring apparatus for plasma process
06/27/2000US6080287 Sputtered material is ionized in a processing space between the target and a substrate by generating a dense plasma in the space with energy coupled from a coil located outside of the vacuum chamber behind a dielectric window in the chamber wall
06/27/2000US6080285 Multiple step ionized metal plasma deposition process for conformal step coverage
06/27/2000US6080272 Method and apparatus for plasma etching a wafer
06/27/2000US6080271 Plasma source for generating inductively coupled, plate-shaped plasma, having magnetically permeable core
06/27/2000US6080270 Compact microwave downstream plasma system
06/27/2000US6080263 Method and apparatus for applying a protecting film to a semiconductor wafer
06/27/2000US6080239 Method of growing single semiconductor crystal and semiconductor device with single semiconductor crystal
06/27/2000US6080238 Single crystal pulling method
06/27/2000US6080237 Method for production of dislocation-free silicon single crystal
06/27/2000US6080236 Electronic device manufacture
06/27/2000US6080206 Method of laying out interconnections
06/27/2000US6080205 Semiconductor wafer serving as master-slice with built-in additional current drivers for semi-custom-made integrated circuit device
06/27/2000US6080200 Diffusion simulation method for impurities using mesh points and branches utilizing concentrations of electrically active impurities and effective impurity electric field mobility
06/27/2000US6080092 Industrial cleaning sponge
06/27/2000US6080050 Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
06/27/2000US6080049 Wafer polishing apparatus
06/27/2000US6080046 Underwater wafer storage and wafer picking for chemical mechanical polishing
06/27/2000US6080040 Wafer carrier head with inflatable bladder and attack angle control for polishing
06/27/2000US6079928 Dual plate gas assisted heater module
06/27/2000US6079927 Automated wafer buffer for use with wafer processing equipment
06/27/2000US6079874 Temperature probes for measuring substrate temperature
06/27/2000US6079610 Wire bonding method
06/27/2000US6079607 Method for high frequency bonding
06/27/2000US6079565 Clipless tray
06/27/2000US6079428 Apparatus for removing coated film from peripheral portion of substrate
06/27/2000US6079426 Method and apparatus for determining the endpoint in a plasma cleaning process
06/27/2000US6079357 Plasma processing apparatus
06/27/2000US6079354 Thermal post-deposition treatment of halogen-doped films to improve film stability and reduce halogen migration to interconnect layers
06/27/2000US6079353 Chamber for reducing contamination during chemical vapor deposition
06/27/2000US6079256 Overlay alignment measurement of wafers
06/27/2000US6079073 Washing installation including plural washers
06/22/2000WO2000036892A1 Device for increasing heat transfer
06/22/2000WO2000036877A1 Method and apparatus for temperature control of heater
06/22/2000WO2000036666A1 Method for printing of transistor arrays on plastic substrates
06/22/2000WO2000036655A1 Lateral thin-film silicon-on-insulator (soi) jfet device
06/22/2000WO2000036653A1 Bipolar transistor and method for producing same
06/22/2000WO2000036652A2 Method of manufacturing a gate electrode
06/22/2000WO2000036651A1 Integrated circuit with capacitative elements
06/22/2000WO2000036650A1 Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them
06/22/2000WO2000036647A1 Diamond heat sink and method of manufacture thereof
06/22/2000WO2000036644A1 Device for processing wafer
06/22/2000WO2000036643A1 Method and apparatus for removing one or more covers of an electronic module
06/22/2000WO2000036642A1 Method of forming a non-volatile memory device
06/22/2000WO2000036641A1 Wiring, thin-film transistor substrate with the wiring, method of manufacture thereof, and liquid crystal display device
06/22/2000WO2000036640A1 Method of forming thin film
06/22/2000WO2000036639A1 Silicon oxynitride film
06/22/2000WO2000036638A1 Methods for running a high density plasma etcher to achieve reduced transistor device damage
06/22/2000WO2000036637A1 Method of processing semiconductor wafers to build in back surface damage
06/22/2000WO2000036636A2 Capacitor electrode
06/22/2000WO2000036635A1 Gas driven rotating susceptor for rapid thermal processing (rtp) system
06/22/2000WO2000036634A2 Amorphization of substrate to prevent silicide encroachment into channel region of field effect transistor
06/22/2000WO2000036631A1 Plasma processing apparatus
06/22/2000WO2000036525A2 Mechanisms for making and inspecting reticles
06/22/2000WO2000036471A1 Euv illumination system
06/22/2000WO2000036469A1 Electron beam resist
06/22/2000WO2000036468A1 Photomask with a mask edge provided with a ring-shaped esd protection area
06/22/2000WO2000036467A1 Photomask provided with an esd-precluding envelope
06/22/2000WO2000036406A1 Method and device for detecting spatial structure characteristics of a crystal
06/22/2000WO2000036385A1 Method of producing a micromechanical structure for a micro-electromechanical element
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