Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2000
07/12/2000EP1018153A1 In situ plasma wafer bonding method
07/12/2000EP1018152A1 Borderless vias with cvd barrier layer
07/12/2000EP1018151A1 Process for fabricating layered superlattice materials and abo 3?, type metal oxides and making electronic devices including same without exposure to oxygen
07/12/2000EP1018150A1 Method and apparatus for in situ vapor generation
07/12/2000EP1018149A1 Method and apparatus for high-performance integrated circuit interconnect fabrication
07/12/2000EP1018148A1 Method for rapid thermal processing (rtp) of a silicon substrate
07/12/2000EP1018147A1 Method for producing a composite part and composite part
07/12/2000EP1018146A1 Improved transformer operations
07/12/2000EP1018145A2 Microbellows actuator
07/12/2000EP1018139A1 Adjustment of deposition uniformity in an inductively coupled plasma source
07/12/2000EP1018135A2 Vacuum plasma processor having coil with added conducting segments to its peripheral part
07/12/2000EP1018118A1 Mram with shared word and digit lines
07/12/2000EP1018088A1 System and method for monitoring and controlling gas plasma processes
07/12/2000EP1018054A1 Microscope stand for a wafer inspection microscope
07/12/2000EP1017877A1 Cvd chamber inner lining
07/12/2000EP1017876A1 Gas injection system for plasma processing apparatus
07/12/2000EP1017875A1 Remote plasma cleaning apparatus
07/12/2000EP1017873A1 Single body injector and deposition chamber
07/12/2000EP1017770A1 Aqueous rinsing composition
07/12/2000EP1017613A2 Bulk chemical delivery system
07/12/2000EP1017538A1 Wafer processing apparatus
07/12/2000EP1017266A1 System for delivering a substantially constant vapor flow to a chemical process reactor
07/12/2000EP0985154A4 Broadband impedance matching probe
07/12/2000EP0950082A4 Reducing void formation in curable adhesive formulations
07/12/2000EP0907963A4 Solder bump apparatus, electronic component and method for forming a solder bump
07/12/2000EP0880794B1 Ion beam shield for implantation systems
07/12/2000EP0809865B1 SEMICONDUCTOR FIELD EFFECT DEVICE COMPRISING A SiGe LAYER
07/12/2000EP0800705B1 Manufacture of a semiconductor device with selectively deposited semiconductor zone
07/12/2000EP0782483B1 Selective removal of material by irradiation
07/12/2000EP0739538B1 Method of forming a resistor
07/12/2000EP0694209B1 ENHANCED QUALITY THIN FILM Cu(In,Ga)Se 2 FOR SEMICONDUCTOR DEVICE APPLICATIONS BY VAPOR-PHASE RECRYSTALLIZATION
07/12/2000CN1260068A Latch-up free power mos-bipolar transistor
07/12/2000CN1260009A Method for producing coated workpieces, uses and installation for the method
07/12/2000CN1259925A Methods for treating semiconductor wafers
07/12/2000CN1259770A Integrated circuit contg. low diffusion capacitance network
07/12/2000CN1259769A Integrated circuit of inductance element
07/12/2000CN1259767A Wafer stage package and mfg. method therefor, and method for mfg. semiconductor device made up of same
07/12/2000CN1259765A Semiconductor integrated circuit and mfg. method therefor
07/12/2000CN1259764A Method for directly fixing heat radiator onto chip carrier by using flexible epoxy resin
07/12/2000CN1259763A Semiconductor elements and mfg. method therefor
07/12/2000CN1259762A Plasma treatment for improving adhesiveness between inorgnic material and copper
07/12/2000CN1259761A Method of making micro silicon component by utilizing liquid phase epitaxial technique
07/12/2000CN1259760A Method for mfg. semiconductor crystal plate by making several zone masks having various scatter abilites
07/12/2000CN1259759A Improved contaction and deep photolithographic processing
07/12/2000CN1259758A Method for mfg. semiconductor crystal plate, use and utilization method
07/12/2000CN1259417A Ultrasonic vibration welding apparatus
07/12/2000CN1054469C Method for forming semiconductor device
07/12/2000CN1054468C Polysilicon structure discharge technology for surface treatment
07/12/2000CN1054437C Method for mfg. parts of micro-machinery parts
07/11/2000USRE36777 Integration of high performance submicron CMOS and dual-poly non-volatile memory devices using a third polysilicon layer
07/11/2000USRE36773 Method for plating using nested plating buses and semiconductor device having the same
07/11/2000USRE36767 Wafer scrubbing device
07/11/2000US6088819 Dynamic semiconductor memory device and method of testing the same
07/11/2000US6088520 Method of producing highly precise charged beam drawing data divided into plurality of drawing fields
07/11/2000US6088379 Ultraviolet laser apparatus and semiconductor exposure apparatus
07/11/2000US6088377 Optical semiconductor device having a diffraction grating and fabrication process thereof
07/11/2000US6088287 Flash memory architecture employing three layer metal interconnect for word line decoding
07/11/2000US6088283 Semiconductor memory device capable of preventing noise from occurring in the bus lines
07/11/2000US6088276 Semiconductor device provided with a circuit performing fast data reading with a low power consumption
07/11/2000US6088267 Nonvolatile semiconductor memory device having row decoder
07/11/2000US6088265 Virtual ground type semiconductor storage device
07/11/2000US6088263 Non-volatile memory using substrate electrons
07/11/2000US6088260 Dynamic random access memory cell and method for fabricating the same
07/11/2000US6088258 Structures for reduced topography capacitors
07/11/2000US6088257 Ferroelectric random access memory device and method for operating the same
07/11/2000US6088253 Semiconductor memory device and method for forming same
07/11/2000US6088252 Semiconductor storage device with an improved arrangement of electrodes and peripheral circuits to improve operational speed and integration
07/11/2000US6088236 Semiconductor device having a bump having a rugged side
07/11/2000US6088233 Semiconductor device and assembly board having through-holes filled with filling core
07/11/2000US6088230 Procedure for producing a chip mounting board and chip-mounting board thus produced
07/11/2000US6088216 Lead silicate based capacitor structures
07/11/2000US6088213 Bipolar electrostatic chuck and method of making same
07/11/2000US6088212 Apparatus and method for minimizing electrostatic discharge damage to semiconductor objects
07/11/2000US6088171 Projection optical system
07/11/2000US6088096 End-point detector for plasma etcher
07/11/2000US6088082 Projection aligner and projection aligning method
07/11/2000US6088080 Exposure apparatus and device manufacturing method
07/11/2000US6088071 Auxiliary capacitor for a liquid crystal display device
07/11/2000US6087895 Semiconductor integrated circuit having power lines separately routed to input circuits and circuit unit using it
07/11/2000US6087893 Semiconductor integrated circuit having suppressed leakage currents
07/11/2000US6087889 Fuse circuit for a semiconductor device
07/11/2000US6087882 Ultra-low power magnetically coupled digital isolator using spin valve resistors
07/11/2000US6087877 Integrated circuit having surge protection circuit
07/11/2000US6087845 Universal wafer carrier for wafer level die burn-in
07/11/2000US6087842 Integrated or intrapackage capability for testing electrical continuity between an integrated circuit and other circuitry
07/11/2000US6087840 Probe card with vertical needle for enabling improved wafer testing and method of manufacturing the same
07/11/2000US6087838 Signal processing circuit for electro-optic probe
07/11/2000US6087813 Internal voltage generation circuit capable of stably generating internal voltage with low power consumption
07/11/2000US6087797 Exposure method, and method of making exposure apparatus having dynamically isolated reaction frame
07/11/2000US6087756 Surface acoustic wave
07/11/2000US6087733 Sacrificial erosion control features for chemical-mechanical polishing process
07/11/2000US6087731 Methods of forming flip chip bumps and related flip chip bump constructions
07/11/2000US6087730 Electronic devices and their manufacture
07/11/2000US6087729 Low dielectric constant composite film for integrated circuits of an inorganic aerogel and an organic filler grafted to the inorganic material
07/11/2000US6087728 Interconnect design with controlled inductance
07/11/2000US6087727 Misfet semiconductor device having different vertical levels
07/11/2000US6087726 Metal interconnect stack for integrated circuit structure
07/11/2000US6087724 HSQ with high plasma etching resistance surface for borderless vias
07/11/2000US6087721 Semiconductor device with a high-frequency bipolar transistor on an insulating substrate
07/11/2000US6087719 Chip for multi-chip semiconductor device and method of manufacturing the same