| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/06/2000 | WO2000038935A1 Local vectorial particle cleaning |
| 07/06/2000 | WO2000021715A3 Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
| 07/06/2000 | WO2000016378A3 Method of fabricating group-iii nitride-based semiconductor device |
| 07/06/2000 | WO2000008674A9 Mosfet having self-aligned gate and buried shield and method of making same |
| 07/06/2000 | WO2000002675A9 Automated semiconductor processing system |
| 07/06/2000 | WO2000002253A3 Silicon thin-film, integrated solar cell, module, and methods of manufacturing the same |
| 07/06/2000 | WO2000001615A8 Method and apparatus for the preparation of high purity phosphine or other gas |
| 07/06/2000 | WO1999067812A9 Chuck table for semiconductor wafer |
| 07/06/2000 | WO1999065065A9 Etching process for producing substantially undercut free silicon on insulator structures |
| 07/06/2000 | WO1999047722A3 Method for applying a dielectric cap film to a dielectric stack |
| 07/06/2000 | DE19963883A1 Power semiconductor casing for surface securing enclosing substrate top and bottom faces, with top face carrying power semiconductor chip |
| 07/06/2000 | DE19962703A1 Control of discharge of semiconductor component, arriving from production for testing, with time saving |
| 07/06/2000 | DE19962053A1 Semiconductor device with silicon-on-insulator structure has semiconductor regions in latter separated via separation regions with insulating upper part and semiconductor lower part |
| 07/06/2000 | DE19959565A1 Halbleiterbauelement und Entwurfsverfahren hierfür The semiconductor device design method therefor, and |
| 07/06/2000 | DE19958144A1 Programmierbare Zwischenverbindungszelle zum wahlweisen Verbinden von Schaltkreisknoten in einem integrierten Schaltkreis Programmable interconnect cell for selectively connecting circuit nodes in an integrated circuit |
| 07/06/2000 | DE19958143A1 Programmable connection for logic IC circuit nodes using switching FET with floating gate coupled to floating gate of read FET |
| 07/06/2000 | DE19957609A1 Making electrically conducting adhesive connection between module and electronic component e.g. for chip card, involves first introducing conducting body arranged in compressible fixing structure between them |
| 07/06/2000 | DE19956472A1 Flüssigkeits-Abgabesystem Liquid dispensing system |
| 07/06/2000 | DE19951930A1 Two-transistor type electrically erasable programmable read only memory has a selection transistor gate electrode with two selection gate electrodes separated by an interlevel insulation layer |
| 07/06/2000 | DE19947887A1 Static semiconductor memory (SRAM) for LV operation with CMOS memory cells, each with six transistors of specified conductivities |
| 07/06/2000 | DE19940320A1 Nicht reflektierende Beschichtungspolymere und Verfahren zu deren Herstellung Non-reflective coating polymers and methods for their preparation |
| 07/06/2000 | DE19934758A1 Semiconductor device, e.g. double diffused metal oxide semiconductor transistor has a control electrode extending above and between different depth interfaces between a first conductivity type region and two second conductivity type regions |
| 07/06/2000 | DE19929490A1 Etching device used e.g. in the production of piezoelectric components comprises a bell-shaped hood, a wafer deposition table, a gas concentrating element, and a gas feed connection |
| 07/06/2000 | DE19928781C1 DRAM cell array has deep word line trenches for increasing transistor channel length and has no fixed potential word lines separating adjacent memory cells |
| 07/06/2000 | DE19927747C1 Multi-chip module for leads-on-chip mounting, includes rectangular chips on single wafer |
| 07/06/2000 | DE19915651A1 Semiconductor component for semiconductor chip |
| 07/06/2000 | DE19915146C1 Production of highly pure copper wiring trace on semiconductor wafer for integrated circuit by applying metal base coat, plating and structurization uses dimensionally-stable insoluble counter-electrode in electroplating |
| 07/06/2000 | DE19914490C1 DRAM or FRAM cell array, with single transistor memory cells, has trench conductive structures and upper source-drain regions overlapping over a large area for low contact resistance between capacitors and transistors |
| 07/06/2000 | DE19860779A1 Method for monitoring Faraday cups in ion implantation includes loopback device and interlock signals |
| 07/06/2000 | DE19860701A1 Integrated circuit structure comprises a common substrate having different technology components, e.g. hetero bipolar transistors, with active regions consisting of the same vertical sequence of semiconductor layers |
| 07/06/2000 | DE19860587A1 Verfahren zur Verbindung zweier Oberflächen und Vorrichtung A method for joining two surfaces and apparatus |
| 07/06/2000 | DE19860581A1 Halbleiterelement und Verfahren zur Herstellung Semiconductor element and process for producing |
| 07/06/2000 | DE19860501A1 Capacitor for a dynamic random access memory is produced by applying a conductive support to a structured alternating conductive and sacrificial layer sequence prior to selective sacrificial layer removal |
| 07/06/2000 | DE19860084A1 Verfahren zum Strukturieren eines Substrats A method for patterning a substrate |
| 07/06/2000 | DE19860080A1 Microelectronic structure, especially the bottom electrode of a ferroelectric memory storage capacitor, has a sputtered oxygen-containing iridium layer between a silicon-containing layer and an oxygen barrier layer |
| 07/06/2000 | DE19860010A1 Surface cleaning method for low temperature microscopy and spectroscopy uses glow discharge of argon gas |
| 07/06/2000 | DE19859469A1 Vorrichtung und Verfahren zum Behandeln von Substraten Apparatus and method for processing substrates |
| 07/06/2000 | DE19859468A1 Vorrichtung zum Behandeln von Substraten Apparatus for processing substrates |
| 07/06/2000 | DE19859467A1 Substrathalter Substrate holder |
| 07/06/2000 | DE19859466A1 Vorrichtung und Verfahren zum Behandeln von Substraten Apparatus and method for processing substrates |
| 07/06/2000 | DE19858428A1 Verfahrbarer x/y-Koordinaten-Meßtisch Movable x / y coordinate measurement table |
| 07/06/2000 | CA2294553A1 Ultrasonic vibration bonding machine |
| 07/05/2000 | EP1017155A1 Positioning device, driving unit, and aligner equipped with the device |
| 07/05/2000 | EP1017127A2 Method for connecting two surfaces and device |
| 07/05/2000 | EP1017113A1 Nitride semiconductor device |
| 07/05/2000 | EP1017108A2 Semiconductor devices and methods of manufacturing the same |
| 07/05/2000 | EP1017104A2 Ferroelectric intergrated circuit with protective layer incorporating oxygen and method for fabricating same |
| 07/05/2000 | EP1017103A1 Power switch with DI/DT control |
| 07/05/2000 | EP1017102A1 Integrated circuit comprising inductive elements |
| 07/05/2000 | EP1017101A1 Integrated circuit comprising a capacitive network with low dispersion |
| 07/05/2000 | EP1017100A1 Three-dimensional device |
| 07/05/2000 | EP1017099A2 Improvements in or relating to semiconductor devices |
| 07/05/2000 | EP1017098A2 Integrated circuit having a bonding pad and manufacturing method thereof |
| 07/05/2000 | EP1017097A1 Manufacturing method of salicide contacts for non-volatile memory |
| 07/05/2000 | EP1017096A2 Method of fabricating semiconductor memory device |
| 07/05/2000 | EP1017095A2 DRAM trench capacitor cell |
| 07/05/2000 | EP1017094A2 Wafer-level package and a method of manufacturing thereof |
| 07/05/2000 | EP1017093A1 Power semiconductor device and process for manufacturing it |
| 07/05/2000 | EP1017092A1 Process for manufacturing a resistive structure used in semiconductor integrated circuit |
| 07/05/2000 | EP1017091A2 A processing method of silicon wafer and a processing apparatus |
| 07/05/2000 | EP1017090A1 Semiconductor wafer polishing device |
| 07/05/2000 | EP1017089A2 Method of manufacturing a gate electrode |
| 07/05/2000 | EP1017088A1 Selective salicization process for semiconductor devices |
| 07/05/2000 | EP1017087A1 Process for manufacturing a semiconductor substrate integrated MOS transistor |
| 07/05/2000 | EP1017086A1 Projection aligner, method of manufacturing the aligner, method of exposure using the aligner, and method of manufacturing circuit devices by using the aligner |
| 07/05/2000 | EP1017085A2 Semiconductor device manufacturing apparatus employing vacuum system |
| 07/05/2000 | EP1017010A2 Electrostatic discharge protection for sensors |
| 07/05/2000 | EP1017009A2 Apparatus and method for contacting a sensor conductive layer |
| 07/05/2000 | EP1016992A1 Performance driven multi-valued variable supply voltage scheme for low-power design of VLSI circuits and system |
| 07/05/2000 | EP1016930A1 Bottom antireflective layer operating in destructive interference and absorption modes |
| 07/05/2000 | EP1016738A2 Electroplaner |
| 07/05/2000 | EP1016621A2 Method for producing narrow pores and structure having the narrow pores, and narrow pores and structure produced by the method |
| 07/05/2000 | EP1016620A2 Method for producing co-planar surface structures |
| 07/05/2000 | EP1016465A1 Spin coating method and coating apparatus |
| 07/05/2000 | EP1016143A2 Electrode means, comprising polymer materials, with or without functional elements and an electrode device formed of said means |
| 07/05/2000 | EP1016140A1 Method for wiring semi-conductor components in order to prevent product piracy and manipulation, semi-conductor component made according to this method and use of said semi-conductor component in a chip card |
| 07/05/2000 | EP1016138A1 Plastic integrated circuit package and method and leadframe for making the package |
| 07/05/2000 | EP1016136A1 Microelectronics structure comprising a low voltage part provided with protection against a high voltage part and method for obtaining said protection |
| 07/05/2000 | EP1016135A1 Fusion-bond electrical feed-through |
| 07/05/2000 | EP1016134A1 Plasma reactor for passivating a substrate |
| 07/05/2000 | EP1016133A1 Method of planarizing the upper surface of a semiconductor wafer |
| 07/05/2000 | EP1016132A1 Capacitors in integrated circuits |
| 07/05/2000 | EP1016131A1 Process for the removal of copper and other metallic impurities from silicon |
| 07/05/2000 | EP1016130A1 Metal and metal silicide nitridization in a high density, low pressure plasma reactor |
| 07/05/2000 | EP1016129A1 CONTROLLING THREADING DISLOCATION DENSITIES IN Ge ON Si USING GRADED GeSi LAYERS AND PLANARIZATION |
| 07/05/2000 | EP1016128A1 Storage assembly for wafers |
| 07/05/2000 | EP1016127A1 A fluorometric method for increasing the efficiency of the rinsing and water recovery process in the manufacture of semiconductor chips |
| 07/05/2000 | EP1016126A2 Optical inspection module and method for detecting particles and defects on substrates in integrated process tools |
| 07/05/2000 | EP1016122A1 Continuous deposition of insulating material using multiple anodes alternated between positive and negative voltages |
| 07/05/2000 | EP1016120A1 Resistive heating of power coil to reduce transient heating/start up effects |
| 07/05/2000 | EP1016118A1 Apparatus and method for improved scanning efficiency in an ion implanter |
| 07/05/2000 | EP1016117A1 Device and method for ion beam etching |
| 07/05/2000 | EP1016116A2 Apparatus for improving etch uniformity and methods therefor |
| 07/05/2000 | EP1016092A1 Method and apparatus for producing extreme ultra-violet light for use in photolithography |
| 07/05/2000 | EP1016088A1 Ferroelectric memory cell with shunted ferroelectric capacitor and method of making same |
| 07/05/2000 | EP1016087A1 Memory location arrangement and its use as a magnetic ram and as an associative memory |
| 07/05/2000 | EP1016085A1 Flash memory array |
| 07/05/2000 | EP1015931A2 Optical system, especially a projection light facility for microlithography |
| 07/05/2000 | EP1015856A1 Temperature probe |
| 07/05/2000 | EP1015843A1 Lever arm for a scanning microscope |