Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2000
07/18/2000US6089027 Fluid storage and dispensing system
07/18/2000US6088917 Method for making heat sink device and a heat sink made thereby
07/18/2000US6088914 Method for planarizing an array of solder balls
07/18/2000CA2111527C Phosphonooxymethyl ethers of taxane derivatives
07/18/2000CA2067309C Process and apparatus for plasma cvd coating or plasma treating substrates
07/15/2000CA2294684A1 Dose correction for along scan linewidth variation
07/15/2000CA2294677A1 Dynamically adjustable high resolution adjustable slit
07/13/2000WO2000041446A1 Circuit board features with reduced parasitic capacitance and method therefor
07/13/2000WO2000041246A1 Semiconductor system with trenches for separating doped areas
07/13/2000WO2000041243A1 Field isolated integrated injection logic gate
07/13/2000WO2000041238A1 Electrically programmable memory cell arrangement and method for the production thereof
07/13/2000WO2000041237A1 Lead titanate isolation layers for use in fabricating pzt-based capacitors and similar structures
07/13/2000WO2000041236A1 Integrated circuit memory cell upon a dielectric base
07/13/2000WO2000041235A1 Method of depositing a copper seed layer which promotes improved feature surface coverage
07/13/2000WO2000041234A1 Method and device for encapsulating an electronic component, notably a semiconductor chip
07/13/2000WO2000041233A1 Semiconductor fabrication processes
07/13/2000WO2000041232A1 Method for improving the sidewall stoichiometry of thin film capacitors
07/13/2000WO2000041231A1 Dielectric films from organohydridosiloxane resins
07/13/2000WO2000041230A2 Electron beam treatment of siloxane resins
07/13/2000WO2000041229A1 Plasma apparatus and lower electrode thereof
07/13/2000WO2000041228A1 Method of plasma processing
07/13/2000WO2000041227A1 Method for thermally annealing silicon wafer and silicon wafer
07/13/2000WO2000041224A2 Lithographic method for creating damascene metallization layers
07/13/2000WO2000041223A1 Heating device for heating semiconductor wafers in thermal processing chambers
07/13/2000WO2000041222A1 Apparatus for processing wafers
07/13/2000WO2000041221A2 Method and device for shaping surfaces of semiconductors
07/13/2000WO2000041220A1 Transport device
07/13/2000WO2000041219A1 Method and device for processing components, notably semiconductor chips, arranged on a substrate
07/13/2000WO2000041218A2 Hand tool for the assembly of small, notably electronic, components
07/13/2000WO2000041217A2 Method and apparatus for preventing warp of clamp ring used for wafer coating apparatus
07/13/2000WO2000041212A1 Gas injection system for plasma processing
07/13/2000WO2000041211A1 Method and apparatus for etch rate stabilization
07/13/2000WO2000041210A1 Plasma etching installation
07/13/2000WO2000041209A1 Raster shaped beam, electron beam exposure strategy using a two dimensional multipixel flash field
07/13/2000WO2000041208A1 An apparatus and method for controlling a beam shape
07/13/2000WO2000041207A1 A method and apparatus that determines charged particle beam shape codes
07/13/2000WO2000041205A1 Apparatus and method for monitoring and tuning an ion beam in ion implantation apparatus
07/13/2000WO2000041192A1 Photodefined integral capacitor with self-aligned dielectric and electrodes and method therefor
07/13/2000WO2000041180A1 Vertically integrated magnetic memory
07/13/2000WO2000041048A1 Method and apparatus for synchronizing a substrate processing system
07/13/2000WO2000041037A1 Method of removing photoresist material with dimethyl sulfoxide
07/13/2000WO2000040975A1 Text probe interface assembly and manufacture method
07/13/2000WO2000040776A1 In situ chemical generator and method
07/13/2000WO2000040772A1 Processing chamber for atomic layer deposition processes
07/13/2000WO2000040771A1 Large area plasma source
07/13/2000WO2000040770A1 Diffusion bonded sputter target assembly and method of making same
07/13/2000WO2000040637A1 Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers
07/13/2000WO2000040588A1 Lewis base adducts of anhydrous mononuclear tris(beta-diketonate) bismuth compositions for deposition of bismuth-containing films, and method of making the same
07/13/2000WO2000040379A1 Substrate transport apparatus with multiple arms on a common axis of rotation
07/13/2000WO2000040347A1 Non-corrosive cleaning composition and method for removing plasma etching residues
07/13/2000WO2000020916A3 Nanoparticle-based electrical, chemical, and mechanical structures and methods of making same
07/13/2000WO2000020483A3 Impact-resistant epoxide resin compositions
07/13/2000WO2000019504A3 Methods for fabricating interpoly dielectrics in non-volatile stacked-gate memory structures
07/13/2000WO2000017906A3 Rf plasma etch reactor with internal inductive coil antenna and electrically conductive chamber walls
07/13/2000WO1999061350A3 Substrate transfer shuttle having a magnetic drive
07/13/2000DE19950987A1 Semiconductor wafer exposure device for photolithographic process in semiconductor component manufacture uses detection and analysis of light reflected from photoresist layer for controlling shutter in path of exposure beam
07/13/2000DE19900804A1 Conveyance system for transporting semiconductor wafers in clean rooms
07/13/2000DE19900461A1 Transportvorrichtung Transport device
07/13/2000DE19860828A1 Ion implantation equipment used for semiconductor manufacture, includes main controller which detects current level to generate control signal based on which ion implantation turbine pump operation is controlled
07/13/2000DE19853093A1 Verfahren und Anordnung zur Belichtung eines Substrates Method and apparatus for exposing a substrate
07/13/2000DE19840823C1 Magnetoresistives Element und dessen Verwendung als Speicherelement in einer Speicherzellenanordnung The magnetoresistive element and its use as memory element in a memory cell arrangement
07/13/2000DE10000754A1 Semiconductor device with a multiple vertical p-n junction layer, e.g. a vertical MOSFET, IGBT, bipolar transistor or diode, is produced by ion implantation and heat treatment to form vertical drift zones or separation zones
07/13/2000DE10000365A1 Methods for semiconductor testing using low voltage particle beam by locking up second surface locks and first surface and comparing registered image with reference in order to identify faults in checked substrate
07/13/2000DE10000364A1 Defect detection method for patterned substrates, intended for detection of defects in voltage contrast of semiconductor wafers obtained using electron microscopes
07/13/2000DE10000361A1 Means for detection of microstructure defects in semiconductor wafers around through contact holes using a charged particle beam scanning system which involves negatively charging the zone around the contact hole prior to scanning
07/13/2000DE10000019A1 Sputter deposition unit, useful for depositing titanium and titanium nitride coatings on semiconductor wafers, has a non-target material surface for receiving and re-sputtering target material onto a workpiece periphery
07/13/2000CA2358405A1 Text probe interface assembly and manufacture method
07/13/2000CA2358200A1 Vertically integrated magnetic memory
07/13/2000CA2322972A1 A method and apparatus that determines charged particle beam shape codes
07/13/2000CA2322966A1 Raster shaped beam, electron beam exposure strategy using a two dimensional multipixel flash field
07/13/2000CA2322778A1 An apparatus and method for controlling a beam shape
07/12/2000EP1018770A1 Compound semiconductor device based on gallium nitride
07/12/2000EP1018769A2 Semiconductor device with increased gate insulator lifetime
07/12/2000EP1018767A1 Extended trench for preventing interaction between components of stacked capacitors
07/12/2000EP1018766A1 Semiconductor integrated circuit and method of fabricating the same
07/12/2000EP1018765A2 Crack stop between neighbouring fuses for protection from fuse blow damage
07/12/2000EP1018763A2 An improved heatsink assembly
07/12/2000EP1018762A2 Semiconductor device and fabrication method thereof
07/12/2000EP1018761A1 Semiconductor device and method of fabricating the same
07/12/2000EP1018760A1 Method and apparatus for encapsulating an electronic device, especially a semiconductor chip
07/12/2000EP1018759A2 Chemical solution and method for reducing the metal contamination on the surface of a semiconductor substrate
07/12/2000EP1018758A1 Method for forming monocrystalline silicon layer, method for manufacturing semiconductor device, and semiconductor device
07/12/2000EP1018699A2 Topographical electrostatic protection grid for sensors
07/12/2000EP1018697A2 Apparatus and method for contacting a conductive layer
07/12/2000EP1018696A2 Static charge dissipation pads for sensors
07/12/2000EP1018527A2 Nano-porous copolymer films having low dielectric constants
07/12/2000EP1018477A1 Air stream transfer apparatus
07/12/2000EP1018400A2 Planarization apparatus and method
07/12/2000EP1018390A2 Ultrasonic vibration bonding machine
07/12/2000EP1018291A1 Flexible circuits and carriers and process for manufacture
07/12/2000EP1018290A1 A system and method for packaging integrated circuits
07/12/2000EP1018167A1 THE METHOD OF FABRICATION OF SEMICONDUCTING COMPOUNDS OF NITRIDES A 3?B 5? OF p- AND n-TYPE ELECTRIC CONDUCTIVITY
07/12/2000EP1018164A1 Silicon carbide static induction transistor structures
07/12/2000EP1018163A1 Semiconductor component with a drift zone
07/12/2000EP1018161A1 Method and device for reducing electric field concentrations in soi semiconductor components
07/12/2000EP1018160A1 Hydrogenated oxidized silicon carbon material
07/12/2000EP1018158A1 Moisture proofing for borate glass semiconductor passivation layers
07/12/2000EP1018156A1 Method for producing planar trenches
07/12/2000EP1018155A1 Trench isolation
07/12/2000EP1018154A1 Component hybridising system allowing for defective planarity