Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2000
10/10/2000US6130127 Method for making dynamic random access memory cells having cactus-shaped stacked capacitors with increased capacitance
10/10/2000US6130126 Self-planarizing DRAM chip avoids edge flaking
10/10/2000US6130125 Method of fabricating capacitor with a ring trench
10/10/2000US6130124 Methods of forming capacitor electrodes having reduced susceptibility to oxidation
10/10/2000US6130123 Method for making a complementary metal gate electrode technology
10/10/2000US6130122 Method for forming a BiCMOS integrated circuit with Nwell compensation implant and method
10/10/2000US6130121 Method for fabricating a transistor
10/10/2000US6130120 Method and structure for crystallizing a film
10/10/2000US6130119 Conductive film-attached substrate and method of manufacturing the same
10/10/2000US6130118 Plasma reaction apparatus and plasma reaction
10/10/2000US6130116 Method of encapsulating a microelectronic assembly utilizing a barrier
10/10/2000US6130114 Semiconductor device
10/10/2000US6130112 Semiconductor device
10/10/2000US6130111 Packaged semiconductor device and method of manufacturing the same
10/10/2000US6130107 Corrosion protection in the fabrication of optoelectronic assemblies
10/10/2000US6130103 Method for fabricating ferroelectric integrated circuits
10/10/2000US6130102 Method for forming semiconductor device including a dual inlaid structure
10/10/2000US6130027 Process for producing lead frames
10/10/2000US6130015 Method for using fiducial schemes to increase nominal registration during manufacture of laminated circuit
10/10/2000US6130010 A silicon composite with minimizing the size of corner-undercut portions for detecting an amount of acceleration, pressure in an air bag system
10/10/2000US6129950 Chemical vapor deposition of a doped polysilicon layer; purging reactant gas with inert gas; adding oxidizing gas to form a thin oxide layer on silicon; purging oxidizing gas with inert gas; repeating until desired thickness reached
10/10/2000US6129845 Photo-oxidation device of a water treatment system photo-oxidizes organic material such as aromatic organic material, in the water to facilitate its removal from the water
10/10/2000US6129819 Method for depositing high density plasma chemical vapor deposition oxide in high aspect ratio gaps
10/10/2000US6129811 Method of adhering a wafer to a wafer tape
10/10/2000US6129808 Low contamination high density plasma etch chambers and methods for making the same
10/10/2000US6129807 Apparatus for monitoring processing of a substrate
10/10/2000US6129787 Semiconductor silicon wafer, semiconductor silicon wafer fabrication method and annealing equipment
10/10/2000US6129609 Method for achieving a wear performance which is as linear as possible and tool having a wear performance which is as linear as possible
10/10/2000US6129546 Heat process apparatus and heat process method
10/10/2000US6129496 Semiconductor wafer cassette transportation apparatus and stocker used therein
10/10/2000US6129255 Wire bonding apparatus
10/10/2000US6129203 IC discarding apparatus for flip chip mounting facility
10/10/2000US6129100 Wafer cleaning apparatus and structure for holding and transferring wafer used in wafer cleaning apparatus
10/10/2000US6129098 Apparatus for injecting constant quantitative chemicals and a method thereof
10/10/2000US6129091 Method for cleaning silicon wafers with deep trenches
10/10/2000US6129048 Susceptor for barrel reactor
10/10/2000US6129047 Susceptor for vapor-phase growth apparatus
10/10/2000US6129046 Substrate processing apparatus
10/10/2000US6129040 Semi-conductor mounting apparatus for applying adhesive to a substrate
10/10/2000US6129039 Apparatus for applying atomized adhesive to a leadframe for chip bonding
10/10/2000US6128830 Apparatus and method for drying solid articles
10/10/2000US6128829 Method for drying substrates
10/10/2000CA2177465C Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
10/10/2000CA2138218C Process for delaminating organic resin from board and process for manufacturing organic resin multi-layer wiring board
10/06/2000CA2303034A1 Thin-plate accommodating/transporting container
10/05/2000WO2000059266A1 System and method for controlling process temperatures for a semi-conductor wafer
10/05/2000WO2000059093A1 Switch circuit and semiconductor switch, for battery-powered equipment
10/05/2000WO2000059050A1 Method of manufacturing semiconductor device, semicondutor device, narrow pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head, ink jet printer, micromachine, liquid crystal panel, and electronic device
10/05/2000WO2000059045A2 Multilayer semiconductor structure with phosphide-passivated germanium substrate
10/05/2000WO2000059041A1 Method of manufacturing thin-film transistor
10/05/2000WO2000059040A1 Method of manufacturing thin-film transistor
10/05/2000WO2000059039A1 Semiconductor device
10/05/2000WO2000059038A1 Boron doped silicon capacitor plate
10/05/2000WO2000059037A1 Avalanche injection eeprom memory cell with p-type control gate
10/05/2000WO2000059036A1 Semiconductor module and method of mounting
10/05/2000WO2000059033A1 Wiring board, connection board, semiconductor device, method of manufacture thereof, circuit board, and electronic device
10/05/2000WO2000059032A1 Nonvolatile memory
10/05/2000WO2000059031A1 Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers
10/05/2000WO2000059030A1 Method for creating connection lines and underlying contact points in a dielectric substrate
10/05/2000WO2000059029A2 Method and apparatus for enabling conventional wire bonding to copper-based bond pad features
10/05/2000WO2000059028A1 Method and apparatus for forming solder bumps
10/05/2000WO2000059027A1 Thin film transistors and their manufacture
10/05/2000WO2000059026A1 Method and pressure jetting machine for processing a semiconductor wafer
10/05/2000WO2000059025A1 Methods of preventing post-etch corrosion of an aluminum neodymium-containing layer
10/05/2000WO2000059024A1 Improved techniques for etching an aluminum neodymium-containing layer
10/05/2000WO2000059023A1 Method for fabricating high permitivity dielectric stacks having low buffer oxide
10/05/2000WO2000059021A1 Enhancement of silicon oxide etch rate and substrate selectivity with xenon addition
10/05/2000WO2000059019A1 Plasma processing system
10/05/2000WO2000059018A1 Plasma processing system
10/05/2000WO2000059017A1 Apparatus for manufacturing semiconductor wafer
10/05/2000WO2000059016A2 Method for producing thin, uniform oxide layers on silicon surfaces
10/05/2000WO2000059015A1 Method for forming silicon film
10/05/2000WO2000059014A1 Method for forming a silicon film and ink composition for ink jet
10/05/2000WO2000059013A1 Exposure apparatus, semiconductor device, and photomask
10/05/2000WO2000059011A2 Memory cell capacitor plate
10/05/2000WO2000059010A1 Sealing techniques suitable for different geometries and constrained spaces
10/05/2000WO2000059009A2 Processing chamber with optical window cleaned using process gas
10/05/2000WO2000059008A2 Method and apparatus for forming an electrical contact with a semiconductor substrate
10/05/2000WO2000059007A1 Perimeter wafer lifting
10/05/2000WO2000059006A1 Semiconductor wafer cleaning apparatus and method
10/05/2000WO2000059005A1 Method and apparatus for insulating a high power rf electrode through which plasma discharge gases are injected into a processing chamber
10/05/2000WO2000059004A1 Multi-stage single-drive foup door opening system
10/05/2000WO2000059003A2 Device for manufacturing semiconductor products
10/05/2000WO2000059002A2 Device for manufacturing semiconductor products
10/05/2000WO2000059001A2 Device for treating wafers
10/05/2000WO2000058999A2 Semiconductor structures having a strain compensated layer and method of fabrication
10/05/2000WO2000058995A2 Apparatus for improving plasma distribution and performance in an inductively coupled plasma
10/05/2000WO2000058994A1 Method and apparatus for compensating non-uniform wafer processing in plasma processing
10/05/2000WO2000058993A1 Plasma processor with coil having variable rf coupling
10/05/2000WO2000058992A1 Plasma processing method and apparatus with control of rf bias
10/05/2000WO2000058969A1 Device with embedded flash and eeprom memories
10/05/2000WO2000058953A2 Reactive ion beam etching method and a thin film head fabricated using the method
10/05/2000WO2000058806A2 Ferroelectric based memory devices utilizing hydrogen barriers and getters
10/05/2000WO2000058788A1 Photopolymerizable layered product with high resolution and semiconductor device made with the same
10/05/2000WO2000058761A1 Multilayer antireflection film, optical component, and reduction projection exposure system
10/05/2000WO2000058713A2 Device for rapidly measuring angle-dependent diffraction effects on finely structured surfaces
10/05/2000WO2000058654A1 Dual-sided slot valve and method for implementing the same
10/05/2000WO2000058533A1 Reaction chamber for an epitaxial reactor
10/05/2000WO2000058409A1 Coating composition
10/05/2000WO2000058208A2 Method for producing high-purity solutions using gaseous hydrogen fluoride
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