Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2000
10/24/2000US6135270 Guide rail mechanism for a bonding apparatus
10/24/2000US6135168 Standard mechanical interface wafer pod gas filling system
10/24/2000US6135128 Method for in-process cleaning of an ion source
10/24/2000US6135102 Wafer collecting apparatus
10/24/2000US6135054 Semiconductor wafer holder with CVD silicon carbide film coating
10/24/2000US6135052 Method and apparatus for temperature control of the semiconductor
10/24/2000US6134975 Testing element
10/24/2000US6134807 Drying processing method and apparatus using same
10/24/2000US6134783 Heat sink and process of manufacture
10/24/2000US6134777 Bonding method
10/24/2000US6134776 Heatsink and package structure for wirebond chip rework and replacement
10/24/2000US6134742 Apparatus for particle reduction in semiconductor processing equipment
10/24/2000CA2182442C Semiconductor substrate and fabrication method for the same
10/24/2000CA2179246C Polysilicon defined diffused resistor
10/19/2000WO2000062395A1 Protective circuit for electronic modules, especially driver modules
10/19/2000WO2000062349A1 Heterostructure spherical shaped semiconductor device
10/19/2000WO2000062345A1 High-voltage semiconductor device
10/19/2000WO2000062343A1 Soi wafer and method for producing soi wafer
10/19/2000WO2000062342A1 Thin film capacitor element
10/19/2000WO2000062338A1 Semiconductor chip resin-sealing method and adhesive tape for pasting lead frames or the like
10/19/2000WO2000062336A1 Method and device for treating thin layers of amorphous silicon
10/19/2000WO2000062335A1 Multi-layer wafer fabrication
10/19/2000WO2000062334A1 Handling thin workpieces
10/19/2000WO2000062333A1 Integrated heating and cooling device in a reactor for thermal treatment of a substrate
10/19/2000WO2000062332A1 ARRANGEMENT FOR STORING OBJECTS, PARTICULARLY FOR STORING DISKLIKE OBJECTS SUCH AS WAFERS, FLAT PANELS OR CDs
10/19/2000WO2000062331A2 Semiconductor heterostructures with crystalline silicon carbide alloyed with germanium
10/19/2000WO2000062329A1 Method and apparatus for radio frequency isolation of liquid heat transfer medium supply and discharge lines
10/19/2000WO2000062328A1 Method and apparatus for stabilising a plasma
10/19/2000WO2000062326A1 Method and apparatus for ion implantation
10/19/2000WO2000062325A1 Method and apparatus for ion implantation
10/19/2000WO2000062324A2 System and method to correct for distortion caused by bulk heating in a substrate
10/19/2000WO2000062207A1 Interconnect delay driven placement and routing of an integrated circuit design
10/19/2000WO2000062012A1 Measuring positions or coplanarity of contact elements of an electronic component with a flat illumination and two cameras
10/19/2000WO2000061841A1 Slicing of single-crystal films using ion implantation
10/19/2000WO2000061834A1 Low dielectric mano-porous material obtainable from polymer decomposition
10/19/2000WO2000061833A1 Sequential chemical vapor deposition
10/19/2000WO2000061474A1 Device for contactlessly gripping and positioning components
10/19/2000WO2000061473A1 Device for the non-contact vertical transport of components
10/19/2000WO2000061471A1 Device for manipulating an object for loading and unloading a clean room
10/19/2000WO2000061467A1 Device for the non-contact storage of components
10/19/2000WO2000061384A1 Remote plasma generator
10/19/2000WO2000061333A1 Vacuum system for securing a semiconductor wafer
10/19/2000WO2000061324A2 Rocking apparatus and method for slicing a work piece utilizing a diamond impregnated wire
10/19/2000WO2000061306A1 Method and device for cleaning substrates
10/19/2000WO2000041456A3 Optical detector with a filter layer made of porous silicon and method for the production thereof
10/19/2000WO2000036525A3 Mechanisms for making and inspecting reticles
10/19/2000WO2000025980A9 Method and apparatus for grinding wafer
10/19/2000WO2000021119A8 An apparatus for holding a semiconductor wafer
10/19/2000DE19922186C1 IC chip with alternate wiring modes
10/19/2000DE19917438A1 Circuit arrangement for e.g. image sensor comprises carrier plate with contacts connected to image sensor via flip-chip mounting
10/19/2000DE19916959A1 Thin film transistor matrix formation for LCD screen, by photolithographically structuring semiconductor layer to generate semiconductor channel
10/19/2000DE19916666A1 Vacuum chamber, especially a lock chamber for a flat glass coating unit, has substrate transport rollers additionally supported by middle bearings mounted on rams
10/19/2000DE19916321A1 Schutzschaltung für elektronische Bausteine, insbesondere Treiberbausteine Protection circuit for electronic components, in particular driver blocks
10/19/2000DE19913918C1 Anlage zur Fertigung von Halbleiterprodukten, insbesondere zur Bearbeitung von Wafern Plant for the manufacture of semiconductor products, especially for processing wafers
10/19/2000DE10015871A1 Semiconductor wafer tester has many power supply control devices forming a matrix, and signal holder for retaining control signal
10/19/2000DE10007018A1 Halbleiterbauelemente mit Kondensator und Herstellungsverfahren hierfür Semiconductor devices with a capacitor and manufacturing method thereof
10/19/2000DE10006693A1 Clock tree synthesis distribution wiring apparatus performs clock buffer wiring based on optimum maximum capacity detected using information stored in files and that input by input unit
10/19/2000DE10004599A1 Design apparatus of semiconductor integrated circuit, controls evaluation unit, so that total wiring capacity of each wiring does not exceed predetermined wiring capacity
10/19/2000DE10003282A1 Probe contact assembly for probe card in semiconductor chip inspection system, has inclined contact pin assembly with conductive layer formed on substrate, which when contacts pad spring power is generated
10/19/2000CA2365992A1 Slicing of single-crystal films using ion implantation
10/19/2000CA2334388A1 System and method to correct for distortion caused by bulk heating in a substrate
10/18/2000EP1045451A2 Semiconductor device and method for fabricating the same
10/18/2000EP1045448A1 Method of producing soi wafer by hydrogen ion implanting separation method and soi wafer produced by the method
10/18/2000EP1045447A2 Electro-optical device and electronic equipment
10/18/2000EP1045444A1 Electrostatic discharge protection
10/18/2000EP1045443A2 Semiconductor device and manufacturing method thereof
10/18/2000EP1045442A2 Semiconductor integrated circuit
10/18/2000EP1045441A2 Slotted contacts for minimizing the voltage required to electrically blow fuses
10/18/2000EP1045440A1 Process of manufacture of a non volatile memory with electric continuity of the common source lines
10/18/2000EP1045439A1 Device for processing wafer
10/18/2000EP1045438A2 Probe card for testing semiconductor device, and semiconductor device test method
10/18/2000EP1045437A2 Mounting structure for electronic component, method of producing the same, and electrically conductive adhesive used therein
10/18/2000EP1045435A2 Chemical vapor deposition of Pb5Ge3O11 thin film for ferroelectric applications
10/18/2000EP1045434A1 Method for realizing integrated electronic devices on semiconductor substrates having gettering centres
10/18/2000EP1045433A1 Fluorocarbon film and method for forming the same
10/18/2000EP1045432A2 Method of removing a carbon-contaminated layer from a silicon substrate surface for subsequent selective silicon epitaxial growth thereon
10/18/2000EP1045431A1 Method for producing a group III nitride compound semiconductor substrate
10/18/2000EP1045430A2 Wafer aligner system
10/18/2000EP1045427A2 Target locking system for electron beam lithography
10/18/2000EP1045424A2 Particle beam system with dynamic focusing
10/18/2000EP1045422A2 Method and apparatus for removing carbon contamination in a sub-atmospheric charged particle beam lithography system
10/18/2000EP1045408A1 Overpressure explosion-preventing capacitor provided with double quick-coupling elastic contacts
10/18/2000EP1045403A2 Magnetoresistance device
10/18/2000EP1045291A2 Method of improving the etch resistance of photoresists
10/18/2000EP1045290A2 Composition for resist underlayer film and method for producing the same
10/18/2000EP1045289A2 A lithographic process having sub-wavelength resolution
10/18/2000EP1045288A2 Mask structure and method of manufacturing the same
10/18/2000EP1045253A2 Prober for electrical measurements and method of measuring electrical characteristics with said prober
10/18/2000EP1045252A2 Deriving statistical device models from worst-case files
10/18/2000EP1044765A2 Double side polishing device
10/18/2000EP1044494A1 Method and apparatus for clamping a substrate
10/18/2000EP1044475A2 Lateral thin-film silicon-on-insulator (soi) device having lateral depletion
10/18/2000EP1044474A1 Trench-gate semiconductor device
10/18/2000EP1044471A2 Polygon representation in an integrated circuit layout
10/18/2000EP1044470A1 Method for making asymmetrical gate oxide thicknesses
10/18/2000EP1044469A1 Apparatus and method for rapid photo-thermal surface treatment
10/18/2000EP1044468A1 In situ wafer cleaning process
10/18/2000EP1044467A1 Post-lapping cleaning process for silicon wafers
10/18/2000EP1044465A1 Wet processing methods for the manufacture of electronic components
10/18/2000EP1044458A1 Dual face shower head electrode for a magnetron plasma generating apparatus
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