Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2000
10/17/2000US6132865 Adhesive tape for electronic parts
10/17/2000US6132853 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
10/17/2000US6132817 Method of manufacturing photoelectric transducer with improved ultrasonic and purification steps
10/17/2000US6132816 Effecting plasma assisted chemical vapor deposition with carbon source and hydrogen gas concentration of mixed gas at first level for depositing high-quality homoepitaxial diamond thin film; depositing with concentration at second level
10/17/2000US6132814 Placing or leaving spin-on-glass layer formed on substrate; irradiating spin-on-glass layer with large-area electron beam; continuing irradiating step to cure spin-on-glass layer
10/17/2000US6132811 Procedure for the drying of silicon
10/17/2000US6132806 Method of implementation of MOS transistor gates with a high content
10/17/2000US6132802 Methods for exhausting a wafer coating apparatus
10/17/2000US6132800 Production process of color liquid crystal display device
10/17/2000US6132798 Positioning semiconductor device component within target area; directing spray of adhesive perpendicular to first direction; providing negative pressure below target area; conveying spray of adhesive toward target area
10/17/2000US6132646 Electroconductive ink and curing adhesive with flux and metals
10/17/2000US6132637 Abrasives, surfactant, polymer viscosity modifier
10/17/2000US6132631 Flowing carbon tetrafluoride and argon gas mixture
10/17/2000US6132592 Method of etching non-doped polysilicon
10/17/2000US6132586 Electrochemical metal plating of integrated circuit wafers to form multilevel integrated circuit structures
10/17/2000US6132564 In-situ pre-metallization clean and metallization of semiconductor wafers
10/17/2000US6132553 Substrate processing apparatus
10/17/2000US6132552 Method and apparatus for controlling the temperature of a gas distribution plate in a process reactor
10/17/2000US6132522 Cleaning, stripping or etching semiconductor wafers without an intermediate rinse of deionized water by introducing into a reaction chamber containing the electronic component a reactive fluid and gradually displacing with another
10/17/2000US6132519 Vapor deposition apparatus and vapor deposition method
10/17/2000US6132517 Multiple substrate processing apparatus for enhanced throughput
10/17/2000US6132516 Vacuum deposition apparatus
10/17/2000US6132514 Catalytic breakdown of reactant gases in chemical vapor deposition
10/17/2000US6132507 Process and device for the production of a single crystal
10/17/2000US6132298 Carrier head with edge control for chemical mechanical polishing
10/17/2000US6132295 Apparatus and method for grinding a semiconductor wafer surface
10/17/2000US6132294 Method of enhancing semiconductor wafer release
10/17/2000US6132292 Chemical mechanical polishing method suitable for highly accurate planarization
10/17/2000US6132289 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
10/17/2000US6132280 System and process for fabricating an organic electroluminescent display device
10/17/2000US6132226 Structure and method for mounting an electronic part
10/17/2000US6132165 Single drive, dual plane robot
10/17/2000US6132161 Chip supplying apparatus performing stable blue-film-expansion operation
10/17/2000US6132160 Substrate transferring apparatus
10/17/2000US6132113 Developer cup
10/17/2000US6132091 X-Y stage with arcuate surface bearings
10/17/2000US6132081 Method for calibrating optical sensor used to measure the temperature of a substrate during rapid thermal process
10/17/2000US6131799 Method of making wire connections of predetermined shape
10/17/2000US6131795 Thermal compression bonding method of electronic part with solder bump
10/17/2000US6131739 Fracture-proof container for wafer discs
10/17/2000US6131725 Belt for conveying chip components, and method of manufacturing the same
10/17/2000US6131721 Lead frame transporting apparatus
10/17/2000US6131589 Accurate positioning of a wafer
10/17/2000US6131588 Apparatus for and method of cleaning object to be processed
10/17/2000US6131307 Method and device for controlling pressure and flow rate
10/17/2000US6131279 Integrated manufacturing packaging process
10/17/2000US6131278 Metal substrate having an IC chip and carrier mounting
10/17/2000US6131258 Sidewall capacitor with L-shaped dielectric
10/17/2000US6131255 Repairable wafer scale integration system
10/17/2000CA2200154C Lsi package and manufacturing method thereof
10/17/2000CA2014519C Process for making a choice using a thin layared film structure
10/17/2000CA2009518C Spin-on glass processing technique for the fabrication of semiconductor device
10/16/2000CA2305919A1 Wafer aligner system
10/12/2000WO2000060905A1 Organic electroluminescence device and its manufacturing method
10/12/2000WO2000060672A1 Semiconductor device comprising a non-volatile memory cell
10/12/2000WO2000060671A1 Semiconductor device and semiconductor substrate
10/12/2000WO2000060670A2 Integrated semiconductor device with one lateral power gate
10/12/2000WO2000060667A1 Memory cell arrangement and method for producing same
10/12/2000WO2000060666A1 Memory cell unit and method of producing same
10/12/2000WO2000060665A2 An eeprom cell on soi
10/12/2000WO2000060663A1 Integrated circuit with a protective layer of diamond-like amorphous carbon
10/12/2000WO2000060661A1 Method of manufacturing semiconductor device
10/12/2000WO2000060659A1 Improved trench isolation process to deposit a trench fill oxide prior to sidewall liner oxidation growth
10/12/2000WO2000060658A1 Electrode, wafer stage, plasma device, method of manufacturing electrode and wafer stage
10/12/2000WO2000060657A1 Endpoint detection in the fabrication of electronic devices
10/12/2000WO2000060656A1 Method for producing portable electronic devices having an integrated circuit which is protected by a pulverized film
10/12/2000WO2000060655A1 Methods for determining wavelength and pulse length of radiant energy used for annealing
10/12/2000WO2000060654A1 Power rectifier device
10/12/2000WO2000060653A1 Plasma treatment device, its maintenance method and its installation method
10/12/2000WO2000060652A1 Method for fabricating thin-film substrate and thin-film substrate fabricated by the method
10/12/2000WO2000060651A1 Method for etching doped polysilicon with high selectivity to undoped polysilicon
10/12/2000WO2000060649A1 Contact bump with support metallization and method of producing said support metallization
10/12/2000WO2000060648A1 Method of producing an electrical contact on a semiconductor diode and diode with such a contact
10/12/2000WO2000060646A1 Method of processing a monocrystalline semiconductor disk and partially processed semiconductor disk
10/12/2000WO2000060645A2 Dual cmp pad conditioner
10/12/2000WO2000060644A2 A method of manufacturing a trench gated vdmos
10/12/2000WO2000060632A2 Electrostatically focused addressable field emission arraychips (afea's) for high-speed maskless digital e-beam direct write lithography and scanning electron microscopy
10/12/2000WO2000060613A1 Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate
10/12/2000WO2000060604A1 Dynamic content addressable memory cell
10/12/2000WO2000060601A1 Device for weighting the cell resistances in a magnetoresistive memory
10/12/2000WO2000060416A1 Radiation-sensitive resin composition
10/12/2000WO2000060414A1 Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
10/12/2000WO2000060368A1 Improved apparatus and method for measuring minority carrier lifetimes in semiconductor materials
10/12/2000WO2000060146A1 A crystalline oxide-on-semiconductor structure and a generic process for preparing the structure
10/12/2000WO2000060143A1 Electrochemical etching installation and method for etching a body to be etched
10/12/2000WO2000059987A1 Silicone resin and photosensitive resin composition containing the same
10/12/2000WO2000059682A1 Method and apparatus for plating and polishing a semiconductor substrate
10/12/2000WO2000059681A1 Cmp pad conditioner arrangement and method therefor
10/12/2000WO2000035782A3 Distributed control system architecture and method for a material transport system
10/12/2000WO2000029894A3 Laser scanning system mirror
10/12/2000WO2000028601A3 Lateral thin-film silicon-on-insulator (soi) device having lateral depletion
10/12/2000WO2000028586A3 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
10/12/2000WO2000026443A3 Method and apparatus for electrochemical mechanical deposition
10/12/2000WO2000000999A9 Elastomer bonded parts for plasma processes and method for manufacture and use thereof
10/12/2000WO1999066565A9 Method and apparatus for producing group-iii nitrides
10/12/2000EP1044475A3 Lateral thin-film silicon-on-insulator (soi) device having lateral depletion
10/12/2000DE19951540A1 MOS device, having a metal-barrier metal-silicon gate structure, is produced by forming and processing a polysilicon gate electrode before forming a metal gate electrode
10/12/2000DE19922558A1 Semiconductor element contact terminal formation method
10/12/2000DE19916932C1 Einrichtung zur Handhabung eines Gegenstandes für die Be- und Entladung eines Reinstraumes Means for handling an object for loading and unloading of a clean room
10/12/2000DE19915078A1 Verfahren zur Prozessierung einer monokristallinen Halbleiterscheibe und teilweise prozessierte Halbleiterscheibe A method for processing a monocrystalline semiconductor wafer and partially processed wafer
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