| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/20/2001 | US6204109 Method for forming a cylindrical capacitor |
| 03/20/2001 | US6204108 Method of fabricating a dynamic random access memory capacitor |
| 03/20/2001 | US6204107 Method for forming multi-layered liner on sidewall of node contact opening |
| 03/20/2001 | US6204106 Method of fabricating a DRAM access transistor with dual gate oxide technique |
| 03/20/2001 | US6204105 Method for fabricating a polycide semiconductor device |
| 03/20/2001 | US6204104 Semiconductor device and manufacturing method thereof |
| 03/20/2001 | US6204103 Process to make complementary silicide metal gates for CMOS technology |
| 03/20/2001 | US6204102 Method of fabricating compound semiconductor devices using lift-off of insulating film |
| 03/20/2001 | US6204101 Method of manufacturing semiconductor device |
| 03/20/2001 | US6204100 CMOS device and method for fabricating the same |
| 03/20/2001 | US6204099 Method for producing insulated gate thin film semiconductor device |
| 03/20/2001 | US6204098 Method of formation in a silicon wafer of an insulated well |
| 03/20/2001 | US6204097 Semiconductor device and method of manufacture |
| 03/20/2001 | US6204096 Method for reducing critical dimension of dual damascene process using spin-on-glass process |
| 03/20/2001 | US6204095 Method of forming overmolded chip scale package and resulting product |
| 03/20/2001 | US6204094 Method and apparatus for populating an adhesive sheet with particles |
| 03/20/2001 | US6204093 Method and apparatus for applying viscous materials to a lead frame |
| 03/20/2001 | US6204092 Apparatus and method for transferring semiconductor die to a carrier |
| 03/20/2001 | US6204091 Method of assembling a semiconductor chip package |
| 03/20/2001 | US6204090 Method for attaching a die to a carrier utilizing an electrically nonconductive layer |
| 03/20/2001 | US6204089 Method for forming flip chip package utilizing cone shaped bumps |
| 03/20/2001 | US6204084 Nitride system semiconductor device and method for manufacturing the same |
| 03/20/2001 | US6204081 Method for manufacturing a substrate of a liquid crystal display device |
| 03/20/2001 | US6204079 Selective transfer of elements from one support to another support |
| 03/20/2001 | US6204076 Semiconductor device with unbreakable testing elements for evaluating components and process of fabrication thereof |
| 03/20/2001 | US6204075 Method of detecting defects in a wiring process |
| 03/20/2001 | US6204073 Shallow trench isolation with conductive hard mask for in-line moat/trench width electrical measurements |
| 03/20/2001 | US6204070 Method for manufacturing ferroelectric capacitor |
| 03/20/2001 | US6204069 Lightly donor doped electrodes for high-dielectric-constant materials |
| 03/20/2001 | US6203969 Resist processing apparatus which measures temperature of heat-sensing substrate and measuring method therein |
| 03/20/2001 | US6203967 Method for controlling stress in thin film layers deposited over a high density interconnect common circuit base |
| 03/20/2001 | US6203965 Photoresist comprising blends of photoacid generators |
| 03/20/2001 | US6203926 Corrosion resistant multilayer metal structure with cushionsand diffusion barriers then gold layer and encapsulation |
| 03/20/2001 | US6203891 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias |
| 03/20/2001 | US6203863 Method of gap filling |
| 03/20/2001 | US6203684 Pulse reverse electrodeposition for metallization and planarization of a semiconductor substrates |
| 03/20/2001 | US6203677 Sputtering device for coating an essentially flat disk-shaped substrate |
| 03/20/2001 | US6203674 Sputtering titanium film onto substrate; introducing nitrogen; controlling flow rate of nitrogen; pressurization to sputter titanium nitride; depressurization |
| 03/20/2001 | US6203661 Brim and gas escape for non-contact wafer holder |
| 03/20/2001 | US6203659 Method and apparatus for controlling the quality of a photoresist stripper bath |
| 03/20/2001 | US6203658 Processing system and method for making spherical shaped semiconductor integrated circuits |
| 03/20/2001 | US6203657 Inductively coupled plasma downstream strip module |
| 03/20/2001 | US6203627 Cleaning method |
| 03/20/2001 | US6203625 Rotating wafer in enclosure filled with nitrogen; sprinkling wafer with water while rotating; introducing gaseous hydrofluoric acid while maintaining sprinkling and rotating; rinsing wafer by sprinkling to remove hydrofluoric acid |
| 03/20/2001 | US6203622 Wafer support system |
| 03/20/2001 | US6203619 Multiple station apparatus for liquid source fabrication of thin films |
| 03/20/2001 | US6203618 Exhaust system and vacuum processing apparatus |
| 03/20/2001 | US6203617 Conveying unit and substrate processing unit |
| 03/20/2001 | US6203613 Introducing metal nitrate-containing precursor into reactor containing substrate to form metal containing film |
| 03/20/2001 | US6203608 Ferroelectric thin films and solutions: compositions |
| 03/20/2001 | US6203582 Interchangable modules |
| 03/20/2001 | US6203406 Aerosol surface processing |
| 03/20/2001 | US6203404 Chemical mechanical polishing methods |
| 03/20/2001 | US6203268 Positioning apparatus for substrates to be processed |
| 03/20/2001 | US6203250 Article feeding apparatus |
| 03/20/2001 | US6203249 Particulate objects conveying apparatus for conveying particles of a predetermined size |
| 03/20/2001 | US6203143 Hydroxyalkylated high performance curable polymers |
| 03/20/2001 | US6202915 Ultrasonic vibration bonding method |
| 03/20/2001 | US6202883 Tray for semiconductor integrated circuit devices |
| 03/20/2001 | US6202658 Method and apparatus for cleaning the edge of a thin disc |
| 03/20/2001 | US6202656 Uniform heat trace and secondary containment for delivery lines for processing system |
| 03/20/2001 | US6202655 Anodizing apparatus and apparatus and method associated with the same |
| 03/20/2001 | US6202653 Processing solution supplying apparatus, processing apparatus and processing method |
| 03/20/2001 | US6202592 Substrate holder |
| 03/20/2001 | US6202590 Plasma apparatus for fabricating semiconductor devices |
| 03/20/2001 | US6202492 Anti-vibration apparatus and exposure apparatus |
| 03/20/2001 | US6202482 Method and apparatus for testing of sheet material |
| 03/20/2001 | US6202423 Non-damage transport system by ice condensation |
| 03/20/2001 | US6202318 System for processing wafers and cleaning wafer-handling implements |
| 03/20/2001 | US6202303 Method for producing high efficiency heat sinks |
| 03/20/2001 | US6202299 Semiconductor chip connection components with adhesives and methods of making same |
| 03/20/2001 | US6202298 Microelectronic connections with liquid conductive elements |
| 03/20/2001 | US6202292 Apparatus for removing carrier film from a semiconductor die |
| 03/20/2001 | CA2195836C Semiconductor memory having main word line and subword lines provided correspondingly to the main word line |
| 03/20/2001 | CA2165334C High-frequency wireless communication system on a single ultrathin silicon on sapphire chip |
| 03/20/2001 | CA2054722C Substitutional carbon in silicon |
| 03/16/2001 | CA2319867A1 Semiconductor laser device |
| 03/15/2001 | WO2001019149A1 Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| 03/15/2001 | WO2001019148A1 Printed wiring board and method of producing the same |
| 03/15/2001 | WO2001018944A1 Displacement device |
| 03/15/2001 | WO2001018879A1 Semiconductor component and method for the production thereof |
| 03/15/2001 | WO2001018878A1 Semiconductor memory and method of manufacture thereof |
| 03/15/2001 | WO2001018877A1 Semiconductor device and method of manufacture thereof |
| 03/15/2001 | WO2001018876A1 Bipolar mosfet device |
| 03/15/2001 | WO2001018875A1 Thyristors and their manufacture |
| 03/15/2001 | WO2001018873A1 Mos transistor and method for producing the same |
| 03/15/2001 | WO2001018872A1 SiC WAFER, SiC SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD OF SiC WAFER |
| 03/15/2001 | WO2001018871A1 Method for producing an edge termination, which is capable of handling high voltages, in a base material wafer prefabricated according to the principle of lateral charge compensation |
| 03/15/2001 | WO2001018870A2 Charge compensating semiconductor device and method for the production thereof |
| 03/15/2001 | WO2001018869A2 Semiconductor element for high blocking voltages during a simultaneously low closing resistance and method for the production thereof |
| 03/15/2001 | WO2001018866A1 Strongly textured atomic ridges and dots |
| 03/15/2001 | WO2001018864A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 03/15/2001 | WO2001018862A1 Electronic micromodule and method for making and incorporating same to produce portable devices |
| 03/15/2001 | WO2001018861A1 Low dielectric-constant etch stop layer in dual damascene process |
| 03/15/2001 | WO2001018860A2 Improved apparatus and methods for integrated circuit planarization |
| 03/15/2001 | WO2001018858A1 Magnetron plasma processing apparatus |
| 03/15/2001 | WO2001018856A1 Wafer holder |
| 03/15/2001 | WO2001018855A1 Systems and methods using sequential lateral solidification for producing single or polycrystalline silicon thin films at low temperatures |
| 03/15/2001 | WO2001018854A1 Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidification |
| 03/15/2001 | WO2001018853A1 Method for electrically conductive bonding between two semiconductor elements |