| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/22/2001 | WO2001020669A2 Use of additional bonding finger rows to improve wire bond density |
| 03/22/2001 | WO2001020667A1 Integrated circuit and method of manufacture thereof |
| 03/22/2001 | WO2001020666A1 Integrated circuit |
| 03/22/2001 | WO2001020665A1 Method for producing a copper connection |
| 03/22/2001 | WO2001020664A1 A self-aligned method for forming deep trenches in shallow trenches for isolation of semiconductor devices |
| 03/22/2001 | WO2001020663A1 Vacuum processing device |
| 03/22/2001 | WO2001020662A1 Device for mapping composition ratio of specific element which compound semiconductor wafer contains |
| 03/22/2001 | WO2001020661A1 Semiconductor wafer with anisotropic conductor film, and method of manufacture thereof |
| 03/22/2001 | WO2001020660A1 Method of mounting optical and electrical devices, and mounting structure |
| 03/22/2001 | WO2001020659A1 Method for transferring integrated circuit microchips and implementing device |
| 03/22/2001 | WO2001020658A1 Wafer coating method for flip chips |
| 03/22/2001 | WO2001020657A1 Heat sink manufacturing device and manufacturing method |
| 03/22/2001 | WO2001020656A2 Dmos transistor having a trench gate electrode and method of making the same |
| 03/22/2001 | WO2001020655A1 Method of plasma etching thin films of difficult to dry etch materials |
| 03/22/2001 | WO2001020654A1 Process for improving the thickness uniformity of a thin oxide layer in semiconductor wafer fabrication |
| 03/22/2001 | WO2001020653A1 Arrangement and method for detecting the end of life of an aqueous bath utilized in semiconductor processing |
| 03/22/2001 | WO2001020652A1 Method and apparatus for cleaning film deposition device |
| 03/22/2001 | WO2001020649A1 Reducing the coupling between the semiconductor substrate and a coil integrated thereon |
| 03/22/2001 | WO2001020647A2 Novel chip interconnect and packaging deposition methods and structures |
| 03/22/2001 | WO2001020646A2 Fill strategies in the optical kerf |
| 03/22/2001 | WO2001020644A2 Method and apparatus for encapsulating semiconductor chips |
| 03/22/2001 | WO2001020643A2 Method for producing a memory, comprising a memory cell and a trench isolation |
| 03/22/2001 | WO2001020419A1 Semiconductor device |
| 03/22/2001 | WO2001020402A1 Fabrication of finely featured devices by liquid embossing |
| 03/22/2001 | WO2001020400A1 Halftone phase shift photomask and blanks for halftone phase shift photomask for producing it |
| 03/22/2001 | WO2001020399A1 Shielding against external excitations while measuring oscillatory semiconductor membranes |
| 03/22/2001 | WO2001020356A1 Magnetoresistive sensor or memory elements with decreased magnetic switch field |
| 03/22/2001 | WO2001020347A1 Nano-drive for high resolution positioning and for positioning of a multi-point probe |
| 03/22/2001 | WO2001020304A2 Self-clearing optical measurement apparatus and methods of use |
| 03/22/2001 | WO2001020254A1 Spatial averaging technique for ellipsometry and reflectometry |
| 03/22/2001 | WO2001020252A1 Method and apparatus for performing optical measurements of layers and surface properties |
| 03/22/2001 | WO2001019935A1 Slurry for forming insoluble silicate during chemical-mechanical polishing |
| 03/22/2001 | WO2001019746A1 Quartz glass article having sand blast-treated surface and method for cleaning the same |
| 03/22/2001 | WO2001019723A1 Three-dimensional suspended integrated microstructure and method for making same |
| 03/22/2001 | WO2001019567A1 Method and system for chemical mechanical polishing with a cylindrical polishing pad |
| 03/22/2001 | WO2000063964B1 Cmos process |
| 03/22/2001 | WO2000046847A8 Process for lift off and transfer of semiconductor devices onto an alien substrate |
| 03/22/2001 | WO2000013236A9 Layered dielectric on silicon carbide semiconductor structures |
| 03/22/2001 | WO1999066545A8 Process for removing oxide using hydrogen fluoride vapor |
| 03/22/2001 | US20010000057 Semiconductor mounting apparatus with a chip gripper traveling back and forth |
| 03/22/2001 | US20010000048 Vacuum processing apparatus and operating method therefor |
| 03/22/2001 | DE19945008A1 Substrate for a light emitting diode is made of sapphire has a first gallium nitride layer on the upper surface and side of the substrate and a second gallium nitride layer on the base surface and/or lower side of the substrate |
| 03/22/2001 | DE19944857A1 Elektronenoptische Linsenanordnung mit weit verschiebbarer Achse Electron-optical lens array with wide sliding axis |
| 03/22/2001 | DE19944551A1 Workpiece chuck for chemical-mechanical polishing of semiconductor disc has fluid film between seating and surface of semiconductor disc held in seating |
| 03/22/2001 | DE19944012A1 Grabenkondensator mit Kondensatorelektroden und entsprechendes Herstellungsverfahren Grave capacitor capacitor electrode and method of manufacture |
| 03/22/2001 | DE19944011A1 Speicher mit Isolationsgraben und Verfahren zu seiner Herstellung Memory with isolation trench and process for its preparation |
| 03/22/2001 | DE19943143A1 Halbleiterbauelement für hohe Sperrspannungen bei gleichzeitig niedrigem Einschaltwiderstand und Verfahren zu dessen Herstellung A semiconductor device for high blocking voltages with a low on-resistance and process for its preparation |
| 03/22/2001 | DE19942677A1 Compensating component used in metal oxide semiconductor transistor (MOST) comprises an n-conducting drift zone provided in a silicon semiconductor body |
| 03/22/2001 | DE19942119A1 Surface treatment process for a metallizing semiconductor substrates comprises forming a barrier layer on the metal layer followed by an oxide layer and an antireflection layer |
| 03/22/2001 | DE19941147A1 Production of epitaxial layer for dynamic random access memory comprises preparing substrate having single crystalline and insulated regions, growing epitaxial layer on single crystalline region and partially removing epitaxial layer |
| 03/22/2001 | DE19938890A1 Integrierter Schaltkreis und Schaltungsanordnung zur Stromversorgung eines integrierten Schaltkreises The integrated circuit and the circuit arrangement for the power supply of an integrated circuit |
| 03/22/2001 | DE19937513A1 Injection pipe for introducing a gas into a process reactor for treating semiconductor substrates has a channel with several lateral gas outlet openings having a uniform small diameter along the channel |
| 03/22/2001 | DE10046668A1 Electric load control circuit uses n-channel MOSFET protected by Zener diode connected across its switched current path and diode between its gate and earth |
| 03/22/2001 | DE10046652A1 Defocusing calculation method for lithographic process e.g. for semiconductor manufacture, uses evaluation of Gauss function for line width and roughness of patterns obtained by double exposure operations |
| 03/22/2001 | DE10042951A1 Layer thickness reduction arrangement for disk-shaped carrier element, especially silicon wafer, cutting carrier element to depth equal to desired layer thickness after grinding and etching |
| 03/22/2001 | DE10042388A1 Ferroelectric random-access memory has equalising device for equalising adjacent bit lines, pre-loading setting device for bit line pre-loading level and reference level generation device for read amplifier |
| 03/22/2001 | DE10036891A1 Schottky diode production method involves setting up semiconductor substrate, mounting epitaxial layer followed by doping material on substrate, and depositing metal layer on doping material |
| 03/22/2001 | DE10015698C1 Semiconductor device has additional marking detected for increasing overly alignment of photomask employed during exposure step of semiconductor manufacture |
| 03/22/2001 | DE10014083A1 Production of a semiconductor device comprises forming a first resist layer on a semiconductor base layer, forming a resist pattern, forming a second resist layer, forming a crosslinked layer |
| 03/22/2001 | CA2385031A1 A self-aligned method for forming deep trenches in shallow trenches for isolation of semiconductor devices |
| 03/22/2001 | CA2384784A1 Protective layer for a semiconductor device |
| 03/22/2001 | CA2381803A1 Nano-drive for high resolution positioning and for positioning of a multi-point probe |
| 03/22/2001 | CA2350199A1 Heat sink manufacturing device and manufacturing method |
| 03/21/2001 | EP1085790A1 Connecting material |
| 03/21/2001 | EP1085586A2 Magnetoresistive element and magnetic memory device |
| 03/21/2001 | EP1085578A1 Method of manufacturing thin-film transistor |
| 03/21/2001 | EP1085577A2 Power field-effect transistor having a trench gate electrode and method of making the same |
| 03/21/2001 | EP1085574A2 Semiconductor device and method of producing the same |
| 03/21/2001 | EP1085573A1 Method of decreasing the mutual inductance between bond wires in a high frequency amplifying circuit |
| 03/21/2001 | EP1085570A2 Chip scale surface mount package for semiconductor device and process of fabricating the same |
| 03/21/2001 | EP1085569A2 Chip scale surface mount packages for semiconductor device and process of fabricating the same |
| 03/21/2001 | EP1085568A1 Method for the electrical and mechanical interconnection of microelectronic components |
| 03/21/2001 | EP1085567A1 COG Assembly and connecting material to be used therein |
| 03/21/2001 | EP1085566A1 Method and apparatus for partially encapsulating semiconductor chips |
| 03/21/2001 | EP1085565A2 Semiconductor device having sealing film formed on the surface having columnar electrodes thereon and method of manufacturing the same |
| 03/21/2001 | EP1085564A1 Method for packaging semiconductor device having bump electrodes |
| 03/21/2001 | EP1085563A2 Process for etching an insulating layer and forming a semiconductor device |
| 03/21/2001 | EP1085562A2 Apparatus and method for surface finishing a silicon film |
| 03/21/2001 | EP1085561A1 Chip scale surface mount package for semiconductor device and process of fabricating the same |
| 03/21/2001 | EP1085560A1 Method for forming silicon film |
| 03/21/2001 | EP1085558A2 Multiple sided robot blade for semiconductor processing equipment |
| 03/21/2001 | EP1085557A2 Method and apparatus for heating and cooling substrates |
| 03/21/2001 | EP1085519A1 Semiconductor integrated device |
| 03/21/2001 | EP1085434A2 Clock circuit and method of designing the same |
| 03/21/2001 | EP1085378A1 Radiation-sensitive resin composition |
| 03/21/2001 | EP1085377A1 Resist compositions and patterning process |
| 03/21/2001 | EP1085333A1 A method of testing an integrated circuit |
| 03/21/2001 | EP1085332A2 Semiconductor integrated circuit, liquid crystal apparatus, electronic apparatus and method for testing semiconductor integrated circuit |
| 03/21/2001 | EP1085327A1 Multi-point probe |
| 03/21/2001 | EP1085326A2 Multilayer wiring board, manufacturing method thereof, and wafer block contact board |
| 03/21/2001 | EP1085320A1 A device for detecting an analyte in a sample based on organic materials |
| 03/21/2001 | EP1085319A1 A device for detecting an analyte in a sample based on organic materials |
| 03/21/2001 | EP1085106A1 A method and an apparatus for gasifying a liquid material |
| 03/21/2001 | EP1085067A1 Polishing composition and polishing process |
| 03/21/2001 | EP1084995A1 Optical member of silica glass for transmitting fluorine excimer laser radiation and method for producing the same |
| 03/21/2001 | EP1084514A1 GaP-SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING THE SAME |
| 03/21/2001 | EP1084513A1 A method for treating a deposited film for resistivity reduction |
| 03/21/2001 | EP1084512A1 Plasma treatment for ex-situ contact fill |
| 03/21/2001 | EP1084511A1 Substrate and method for manufacturing the same |
| 03/21/2001 | EP1084510A1 Post-etching alkaline treatment process |