Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2001
03/29/2001WO2001022486A1 Semiconductor device and method for fabricating the same
03/29/2001WO2001022485A1 Control method and system for use when growing thin-films on semiconductor-based materials
03/29/2001WO2001022484A1 Method of manufacturing semiconductor wafer
03/29/2001WO2001022483A1 Semiconductor manufacturing device, and method of heating wafer in semiconductor manufacturing device
03/29/2001WO2001022482A1 Method of producing relaxed silicon germanium layers
03/29/2001WO2001022481A1 Method for producing a mask layer having openings with reduced widths
03/29/2001WO2001022479A1 Gas distribution apparatus for semiconductor processing
03/29/2001WO2001022478A1 Semiconductor processing equipment having radiant heated ceramic liner
03/29/2001WO2001022477A1 Device for loading and unloading substrates
03/29/2001WO2001022476A2 Backside chemical etching and polishing
03/29/2001WO2001022475A2 Method for dicing mesa-diodes
03/29/2001WO2001022474A2 Method for producing a semiconductor device consisting of silicon-carbide and comprising a schottky contact
03/29/2001WO2001022471A1 Semiconductor processing equipment having tiled ceramic liner
03/29/2001WO2001022469A1 Electron-optical lens arrangement with an axis that can be largely displaced
03/29/2001WO2001022449A1 Electronic device of ceramic
03/29/2001WO2001022301A1 Method for circuit design on a spherical semiconductor having critical dimensions
03/29/2001WO2001022183A1 Method of improved estimation of critical dimensions in microelectronic fabrication
03/29/2001WO2001022171A1 A photolithography mask having a subresolution alignment mark window
03/29/2001WO2001022170A1 Method for forming resist pattern having improved dry-etching resistance
03/29/2001WO2001022169A1 System to reduce heat-induced distortion of photomasks during lithography
03/29/2001WO2001022163A2 Radiation sensitive copolymers, photoresist compositions thereof and deep uv bilayer systems thereof
03/29/2001WO2001022105A1 Method and arrangement for dielectric integrity testing
03/29/2001WO2001022097A1 Measuring probe for measuring high frequencies and a method for producing the same
03/29/2001WO2001022016A1 Supercritical fluid drying system
03/29/2001WO2001021979A1 Stage device
03/29/2001WO2001021865A1 Method for producing czochralski silicon free of agglomerated self-interstitial defects
03/29/2001WO2001021724A1 Slurry solution for polishing copper or tungsten
03/29/2001WO2001006268A8 Electron density measurement and control system using plasma-induced changes in the frequency of a microwave oscillator
03/29/2001WO2000074896A8 Method of modifying a surface of a structured wafer
03/29/2001WO2000067322A3 Self-aligned source and drain extensions fabricated in a damascene contact and gate process
03/29/2001WO2000067316A3 Method for producing a portable electronic device with an integrated circuit protected by a photosensitive resin
03/29/2001WO2000067299A3 Method for generating defects in a grid support of a semiconductor material
03/29/2001WO2000065658A3 Method of structuring a metal or metal-silicide layer and a capacitor produced according to said method
03/29/2001WO2000036652A3 Method of manufacturing a gate electrode
03/29/2001WO2000033388A9 METHOD OF PRODUCING DEVICE QUALITY (Al)InGaP ALLOYS ON LATTICE-MISMATCHED SUBSTRATES
03/29/2001WO2000030181A3 Field effect-controlled transistor and method for producing the same
03/29/2001US20010000079 Fixing by selectively heating and press-contacting a dicing tape of separated integrated circuit chips to an oppositely facing substrate with a wire attached to one of the chips on the tape; thinness; cards; nonbreaking; noncracking; strength
03/29/2001US20010000074 Thin film transistor and method of manufacturing the same
03/29/2001DE19945855A1 High inductance micro-coil constructed on substrate, useful at higher currents is formed using additive- or doping technology with diamond or diamond-like material in insulator
03/29/2001DE10047963A1 Making multilayer thin film component, assembles component units, each carrying component layers on supportive substrates
03/29/2001DE10046052A1 Zuführung von flüssigen Vorläufern zu Halbleiterbearbeitungsreaktoren Introduction of liquid precursors to semiconductor processing reactors
03/29/2001DE10037741A1 Semiconductor chip manufacturing method involves peeling protection tape from wafer surface by removing peeling tape fixed on protection tape, after irradiation of ultraviolet rays on diced wafer
03/29/2001DE10033519A1 Integrated circuit has address converter that generates address of selected memory device, and data generator that generates data signal that is sent to selected memory device, based on clock signal
03/29/2001DE10027176A1 Quarzglas-Schmelztiegel und Verfahren zu seiner Herstellung Quartz glass crucible and a process for its preparation
03/29/2001DE10004067A1 Making bipolar element e.g. transistor operating in high gigahertz region, involves forming base layer, masking layer and second base semiconductor layer carrying ohmic electrode in metallic material
03/29/2001CA2388586A1 Device for loading and unloading substrates
03/28/2001EP1087444A2 El display device and electronic device
03/28/2001EP1087443A2 Self-aligned non-volatile random access memory cell and process to make the same
03/28/2001EP1087442A2 Floating gate memory array and self-aligned method of fabrication therefor
03/28/2001EP1087441A2 Stacked mosfet protection circuit
03/28/2001EP1087438A2 Semiconductor device and method of manufacturing therof
03/28/2001EP1087437A2 A multistep chamber cleaning process using a remote plasma that also enhances film gap fill
03/28/2001EP1087436A2 Adhesive material and electronic circuit connection method
03/28/2001EP1087435A1 Electro-optic device and method for manufacturing the same
03/28/2001EP1087434A2 Semiconductor device of the flip-chip type and method for manufacturing same
03/28/2001EP1087433A1 Process for the formation of silicon oxide films
03/28/2001EP1087432A1 A method for improving the quality of a metal layer deposited from a plating bath
03/28/2001EP1087431A2 Method and apparatus for forming a sputtered doped seed layer
03/28/2001EP1087430A2 A method and apparatus for integrating a metal nitride film in a semiconductor device
03/28/2001EP1087429A1 Method and apparatus for laser heat treatment, and semiconductor device
03/28/2001EP1087428A1 Method for forming a silicon film and ink composition for ink jet
03/28/2001EP1087427A2 Selective growth process for group III-nitride-based semiconductors
03/28/2001EP1087426A2 Integrated method and apparatus for forming an enhanced capacitor
03/28/2001EP1087424A1 Method for fabricating a self-aligned vertical bipolar transistor
03/28/2001EP1087423A2 Method for etching films on substrates, for cleaning etch chambers, and apparatus therefore
03/28/2001EP1087421A2 Method and apparatus for providing a stable plasma
03/28/2001EP1087366A2 Electroluminescent display device and driving method thereof
03/28/2001EP1087264A1 Method of adjusting projection optical apparatus
03/28/2001EP1087263A2 Photosensitive resin composition, pattering method, and electronic components
03/28/2001EP1087260A1 Photosensitive resin composition
03/28/2001EP1087042A1 Silicon wafer
03/28/2001EP1087041A1 Production method for silicon wafer and silicon wafer
03/28/2001EP1087039A1 Plating jig of wafer
03/28/2001EP1087036A1 Method and apparatus for observing porous amorphous film, and method and apparatus for forming the same
03/28/2001EP1087035A1 Method and apparatus for formation of thin film
03/28/2001EP1087033A1 Extended life sputter targets
03/28/2001EP1086777A1 Ultrasonic bonding apparatus with a sensor for regulating the bonding force
03/28/2001EP1086524A1 Chuck apparatus for clamping a planar substrate in an electrostatic coating method
03/28/2001EP1086520A1 Protective circuit for electronic modules, especially driver modules
03/28/2001EP1086496A2 Nitride based transistors on semi-insulating silicon carbide substrates
03/28/2001EP1086495A1 High-voltage semiconductor component, method for the production and use thereof
03/28/2001EP1086492A1 Method for making a micromodule and a storage medium comprising such a micromodule
03/28/2001EP1086491A1 Self-aligned methods of fabricating silicon carbide power devices by implantation and lateral diffusions
03/28/2001EP1086490A1 Thin film transistors and their manufacture
03/28/2001EP1086489A1 Chemical vapor deposition fabrication of hybrid electrodes for ferroelectric device structures
03/28/2001EP1086488A2 Method for producing semiconductor elements
03/28/2001EP1086487A2 Methods of fabricating silicon carbide power devices by controlled annealing
03/28/2001EP1086486A1 In-situ substrate transfer shuttle
03/28/2001EP1086485A2 Process and manufacturing tool architecture for use in the manufacture of one or more metallization levels on a workpiece
03/28/2001EP1086484A1 Slurry for chemical-mechanical polishing metal surfaces
03/28/2001EP1086481A1 Chamber having improved process monitoring window
03/28/2001EP1086355A1 Ellipsometric method and control device for making a thin-layered component
03/28/2001EP1086353A1 Method and apparatus for determining processing chamber cleaning or wafer etching endpoint
03/28/2001EP1086260A1 Oxygen-argon gas mixture for precleaning in vacuum processing system
03/28/2001EP1086259A1 A method and apparatus for forming a ti doped ta2o5 layer
03/28/2001EP1086258A1 Substrate support and lift apparatus and method
03/28/2001EP1086191A1 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
03/28/2001EP1086030A2 Smif pod including independently supported wafer cassette
03/28/2001EP1085948A1 Micro-environment reactor for processing a microelectronic workpiece
03/28/2001EP0983612A4 A thermal conducting trench in a semiconductor structure and method for forming the same