| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/27/2001 | US6207501 Method of fabricating a flash memory |
| 03/27/2001 | US6207500 DRAM chip fabrication method |
| 03/27/2001 | US6207499 Semiconductor device, method of fabricating the same, and sputtering apparatus |
| 03/27/2001 | US6207498 Method of fabricating a coronary-type capacitor in an integrated circuit |
| 03/27/2001 | US6207497 Conformity of ultra-thin nitride deposition for DRAM capacitor |
| 03/27/2001 | US6207496 Method of forming capacitor of semiconductor device |
| 03/27/2001 | US6207495 Method of fabricating capacitors |
| 03/27/2001 | US6207494 Isolation collar nitride liner for DRAM process improvement |
| 03/27/2001 | US6207493 Formation of out-diffused bitline by laser anneal |
| 03/27/2001 | US6207492 Common gate and salicide word line process for low cost embedded DRAM devices |
| 03/27/2001 | US6207491 Method for preventing silicon substrate loss in fabricating semiconductor device |
| 03/27/2001 | US6207490 Semiconductor device and method for fabricating the same |
| 03/27/2001 | US6207489 Dielectric film includes a first dielectric layer deposited at a first temperature selected from a designated temperature range, and a second dielectric layer deposited at a second temperature different from the first temperature |
| 03/27/2001 | US6207488 Method for forming a tantalum oxide capacitor using two-step rapid thermal nitridation |
| 03/27/2001 | US6207487 Method for forming dielectric film of capacitor having different thicknesses partly |
| 03/27/2001 | US6207486 Semiconductor device and a method of manufacturing the same |
| 03/27/2001 | US6207485 Integration of high K spacers for dual gate oxide channel fabrication technique |
| 03/27/2001 | US6207484 Method for fabricating BiCDMOS device and BiCDMOS device fabricated by the same |
| 03/27/2001 | US6207483 Method for smoothing polysilicon gate structures in CMOS devices |
| 03/27/2001 | US6207482 Integration method for deep sub-micron dual gate transistor design |
| 03/27/2001 | US6207481 Thin film transistor having a crystallization seed layer and a method for manufacturing thereof |
| 03/27/2001 | US6207480 Method of manufacturing a thin film transistor array panel for a liquid crystal display |
| 03/27/2001 | US6207478 Method for manufacturing semiconductor package of center pad type device |
| 03/27/2001 | US6207477 Semiconductor device having a ball grid array and a fabrication process thereof |
| 03/27/2001 | US6207475 Method for dispensing underfill and devices formed |
| 03/27/2001 | US6207473 Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and IC card |
| 03/27/2001 | US6207472 Low temperature thin film transistor fabrication |
| 03/27/2001 | US6207469 Method for manufacturing a semiconductor device |
| 03/27/2001 | US6207468 Non-contact method for monitoring and controlling plasma charging damage in a semiconductor device |
| 03/27/2001 | US6207465 Method of fabricating ferroelectric integrated circuit using dry and wet etching |
| 03/27/2001 | US6207358 Method of stripping a photoresist from a semiconductor substrate using dimethylacetamide or a combination of monoethanolamine and dimethylsulfoxide |
| 03/27/2001 | US6207354 Method of making an organic chip carrier package |
| 03/27/2001 | US6207353 Resist formulation which minimizes blistering during etching |
| 03/27/2001 | US6207352 Resist developing process |
| 03/27/2001 | US6207342 Chemically amplified resist material and process for the formation of resist patterns |
| 03/27/2001 | US6207305 Corrosion-resistant members against a chlorine-based gas |
| 03/27/2001 | US6207304 Substrate with ammonia-free silicon oxynitride passivation film |
| 03/27/2001 | US6207231 Coating film forming method and coating apparatus |
| 03/27/2001 | US6207222 Depositing barrier layer on exposed surfaces of dielectric layer, chemical vapor depositing first conductive material on barrier layer, annealing first conductive material, plating second conductive material on annealed layer, planarizing |
| 03/27/2001 | US6207221 Applying copper foil using direct copper bonding process to one side of ceramic layer as first metal coating, forming second coating by applying conductor paste which contains metal of second metal coating, binder, glass, drying, firing |
| 03/27/2001 | US6207117 Suppressing a beam drift caused by the accumulated carbon compounds by using deflector electrodes of the beam column containing a granular or porous precious metal oxidation catalyst; drawing of high accuracy; lithography; wafers |
| 03/27/2001 | US6207082 Layer-structured oxide and process of producing the same |
| 03/27/2001 | US6207068 Silicon nitride etch bath system |
| 03/27/2001 | US6207034 Method of manufacture of polymer transistors with controllable gap |
| 03/27/2001 | US6207027 Flowing gas into process chamber at first flow rate or at two different flow rates during gas stabilization and then pumping down chamber following deposition |
| 03/27/2001 | US6207026 Cooling system coupled to process chamber comprising cooling cavity, rotating member disposed therein having upper and lower surfaces with two or more magnet pieces disposed between surfaces, motor coupled to rotating member, deflection member |
| 03/27/2001 | US6207008 Detecting intensity of light emission; calibration |
| 03/27/2001 | US6207007 Plasma processing system |
| 03/27/2001 | US6207006 Vacuum processing apparatus |
| 03/27/2001 | US6207005 Cluster tool apparatus using plasma immersion ion implantation |
| 03/27/2001 | US6206997 Method for bonding heat sinks to overmolds and device formed thereby |
| 03/27/2001 | US6206976 Deposition apparatus and related method with controllable edge exclusion |
| 03/27/2001 | US6206974 Substrate processing system, interface apparatus, and substrate transportation method |
| 03/27/2001 | US6206972 Method and apparatus for providing uniform gas delivery to substrates in CVD and PECVD processes |
| 03/27/2001 | US6206971 Integrated temperature controlled exhaust and cold trap assembly |
| 03/27/2001 | US6206969 Method and apparatus for fabricating semiconductor |
| 03/27/2001 | US6206967 Low resistivity W using B2H6 nucleation step |
| 03/27/2001 | US6206964 Multiple head dispensing system and method |
| 03/27/2001 | US6206962 Intermetallics |
| 03/27/2001 | US6206961 Method of determining oxygen precipitation behavior in a silicon monocrystal |
| 03/27/2001 | US6206769 Method and apparatus for stopping mechanical and chemical mechanical planarization of substrates at desired endpoints |
| 03/27/2001 | US6206768 Adjustable and extended guide rings |
| 03/27/2001 | US6206756 Using an acidic solution containing a tungsten oxidizing component, also contains a complexing agent to complex tungsten or oxidation product thereof. |
| 03/27/2001 | US6206441 Apparatus and method for transferring wafers by robot |
| 03/27/2001 | US6206275 Deep access, close proximity, fine pitch bonding of large wire |
| 03/27/2001 | US6206274 Lead penetrating clamping system |
| 03/27/2001 | US6206269 Soldering of a semiconductor chip to a substrate |
| 03/27/2001 | US6206266 Control method for wire bonding apparatus |
| 03/27/2001 | US6206197 Semiconductor wafer carrier with grooves |
| 03/27/2001 | US6206196 Door guide for a wafer container |
| 03/27/2001 | US6206176 Substrate transfer shuttle having a magnetic drive |
| 03/27/2001 | US6206066 Apparatus for mounting an electronic component |
| 03/27/2001 | US6206012 Method of avoiding wall particle contamination in depositing films |
| 03/27/2001 | US6205993 Method and apparatus for fabricating elongate crystalline members |
| 03/27/2001 | US6205948 Modulator for plasma-immersion ion implantation |
| 03/27/2001 | US6205881 Device for controlling the drive of mechanisms operating separately from one another |
| 03/27/2001 | US6205870 Automated substrate processing systems and methods |
| 03/27/2001 | US6205852 Method and apparatus for testing of sheet material |
| 03/27/2001 | US6205745 High speed flip-chip dispensing |
| 03/27/2001 | US6205676 Method and apparatus for removing particles from surface of article |
| 03/27/2001 | US6205662 Method of producing a built-up heat exchanger and product thereof |
| 03/27/2001 | US6205660 Method of making an electronic contact |
| 03/27/2001 | US6205658 Method for formation of metal wiring |
| 03/27/2001 | US6205652 Vacuum coupling system |
| 03/27/2001 | US6205636 Automatic assembly apparatus and automatic assembly method |
| 03/27/2001 | CA2225930C Method and apparatus for monolithic optoelectronic integrated circuit using selective epitaxy |
| 03/27/2001 | CA2126481C Non-contact photothermal method for measuring thermal diffusivity and electronic defect properties of solids |
| 03/22/2001 | WO2001020691A1 Conductive structure based on poly-3,4-alkenedioxythiophene (pedot) and polystyrenesulfonic acid (pss) |
| 03/22/2001 | WO2001020689A1 Method for producing a laterally integrated, monolithic light-emitting semiconductor component and a light-emitting semiconductor component |
| 03/22/2001 | WO2001020687A1 New methods of fabricating devices and semiconductor layers comprising cadmium mercury telluride, mercury telluride, and cadmium telluride |
| 03/22/2001 | WO2001020685A1 Thin-film transistor and method for producing the same |
| 03/22/2001 | WO2001020684A1 Trench dmos transistor having improved trench structure |
| 03/22/2001 | WO2001020683A1 Semiconductor device |
| 03/22/2001 | WO2001020682A1 Semiconductor device |
| 03/22/2001 | WO2001020681A1 Trench capacitor comprising capacitor electrodes and corresponding production method |
| 03/22/2001 | WO2001020680A1 Semiconductor device with esd protection |
| 03/22/2001 | WO2001020676A1 Flip chip having integral mask and underfill providing two-stage bump formation |
| 03/22/2001 | WO2001020673A1 A method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple |
| 03/22/2001 | WO2001020672A1 Protective layer for a semiconductor device |
| 03/22/2001 | WO2001020671A1 Semiconductor wafer level package |