| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/10/2001 | WO2000041459A3 Semiconductor element with a tungsten oxide layer and method for its production |
| 05/10/2001 | WO2000011705A3 Continuous, non-metallic, media sensors for corrosive environments |
| 05/10/2001 | US20010001082 Two-step process comprising chemical mechanical polishing using first polishing slurry selective to polysilicon, second step comprises chemical-mechanical polishing using polishing slurry which polishes both polysilicon and silicon oxide |
| 05/10/2001 | US20010001081 Preparing boundary layer on substrate, depositing conductive layer on boundary layer, wherein depositing step comprises substeps of applying first control parameter until condition subsequently occurs, applying second control parameter |
| 05/10/2001 | US20010001080 Interconnect assemblies and methods |
| 05/10/2001 | US20010001079 Electrode structure and method for fabricating the same |
| 05/10/2001 | US20010001078 Wafer sheet comprising an expandable resin sheet with thermosetting adhesive layers formed on both sides thereof, whereon a semiconductor wafer is attached on the back side thereof before dicing |
| 05/10/2001 | US20010001076 Semiconductor device with no step between well regions |
| 05/10/2001 | US20010001075 Process for fabricating semiconductor memory device with high data retention including silicon nitride etch stop layer formed at high temperature with low hydrogen ion concentration |
| 05/10/2001 | US20010001074 Controllable oxidation technique for high quality ultra-thin gate oxide |
| 05/10/2001 | US20010001073 Semiconductor device and method for forming the same |
| 05/10/2001 | US20010001072 Body-potential drawing region can draw and fix a body potential |
| 05/10/2001 | US20010001071 Mold structure used in method of molding circuitry |
| 05/10/2001 | US20010001069 Metal stud array packaging |
| 05/10/2001 | US20010001068 Structures formed using excess oxygen containing material |
| 05/10/2001 | US20010001056 Mask pattern is transferred onto a wafer by exposure with a mask stage and a wafer stage being moved synchronously |
| 05/10/2001 | US20010001045 Substrate for high frequency integrated circuits |
| 05/10/2001 | US20010001015 Inspection data analyzing system |
| 05/10/2001 | US20010000993 Semiconductor memory device capable of realizing a chip with high operation reliability and high yield |
| 05/10/2001 | US20010000991 Semiconductor memory device |
| 05/10/2001 | US20010000990 Semiconductor memory device |
| 05/10/2001 | US20010000977 Sample inspection system |
| 05/10/2001 | US20010000947 Test socket |
| 05/10/2001 | US20010000943 Organic electroluminescence device and method of manufacturing same |
| 05/10/2001 | US20010000929 Flip chip with integrated flux and underfill |
| 05/10/2001 | US20010000927 Semiconductor and flip chip packages and method having a back-side connection |
| 05/10/2001 | US20010000926 Method and materials for through-mask electroplating and selective base removal |
| 05/10/2001 | US20010000925 Method of forming BGA interconnections having mixed solder profiles |
| 05/10/2001 | US20010000923 Thin film capacitor having an improved bottom electrode and method of forming the same |
| 05/10/2001 | US20010000922 Semiconductor device having semiconductor regions of different conductivity types isolated by field oxide, and method of manufacturing the same |
| 05/10/2001 | US20010000921 Method for elimination of parasitic bipolar action in silicon on insulator (SOI) dynamic logic circuits |
| 05/10/2001 | US20010000920 Self-aligned gate and method |
| 05/10/2001 | US20010000919 MOS-gated power device having extended trench and doping zone and process for forming same |
| 05/10/2001 | US20010000918 Circuit and method for an open bit line memory cell with a vertical transistor and trench plate trench capacitor |
| 05/10/2001 | US20010000914 Semiconductor device and method for fabricating the same |
| 05/10/2001 | US20010000905 Method and apparatus for soldering ball grid array modules to substrates |
| 05/10/2001 | US20010000904 Solder bump measuring method and apparatus |
| 05/10/2001 | US20010000891 Method of plating semiconductor wafer and plated semiconductor wafer |
| 05/10/2001 | US20010000866 Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition |
| 05/10/2001 | DE19962564C1 Polishing cloth for semiconductor substrate discs has upper and lower layers provided with segments spaced via separation channels and intermediate porous layer for uniform distribution of polishing medium |
| 05/10/2001 | DE19961790C1 Semiconductor chip separation device |
| 05/10/2001 | DE19954838C1 Process for the epitaxial production of semiconductor nanostructures comprises adding halogens during layer growth and/or during interruptions of the layer growth of the nanostructure and/or the covering layer over |
| 05/10/2001 | DE19952705A1 Production of a semiconductor wafer with an epitaxial layer comprises placing a wafer on a susceptor and mechanically removing from the susceptor after the epitaxial layer has been deposited |
| 05/10/2001 | DE19951991A1 Process for charging a substrate wafer onto a heated susceptor or a susceptor segment of a deposition reactor with comprises holding the wafer and susceptor or susceptor segment away from each other before contacting them |
| 05/10/2001 | DE19951774A1 Mfg. semiconductor disc with reflection degree exceeding 98 per cent by concatenation of process steps |
| 05/10/2001 | DE19951200A1 Transportvorrichtung Transport device |
| 05/10/2001 | DE19950565A1 Schichterzeugungsverfahren bei der Herstellung eines Halbleiterbauelements und Halbleiterbauelement Layer forming process in the manufacture of a semiconductor device and semiconductor device |
| 05/10/2001 | DE19949578A1 Checking surface processing of semiconductor wafer, using diffused light testing and comparing angle-dependent signals |
| 05/10/2001 | DE19949008A1 Vorrichtung und Verfahren zum Laden von Substraten verschiedener Größe in Substrathalter Apparatus and method for loading substrates of various sizes in the substrate holder |
| 05/10/2001 | DE19949005A1 Einrichtung und Verfahren zum Einbringen verschiedener transparenter Substrate in ein hochgenaues Messgerät Apparatus and method for introducing various transparent substrates in a highly accurate measuring device |
| 05/10/2001 | DE19948797A1 Substrathalter und Verwendung des Substrathalters in einem hochgenauen Messgerät Substrate holder and use of the substrate holder in a highly accurate measuring device |
| 05/10/2001 | DE19943405A1 Verfahren zur Herstellung eines lateral monolithisch integrierten Lichtemissions-Halbleiterbauelements A process for preparing a laterally monolithically integrated light emitting semiconductor component |
| 05/10/2001 | DE19939589A1 Graben mit vergrabener Platte und Verfahren zu seiner Herstellung Trench with a buried plate and method for its manufacture |
| 05/10/2001 | DE10055450A1 Capacitor for semiconductor memory such as DRAM has silicon nitride film formed between lower electrode and tantalum oxide film on which upper electrode is formed |
| 05/10/2001 | DE10054115A1 Forming barrier layer in elongated recess in dielectric layer on semiconductor disc |
| 05/10/2001 | DE10050200A1 Ionenimplantationsanlage und Strahlblende dafür Ion implantation system and beam stop it |
| 05/10/2001 | DE10046910A1 Semiconductor device comprises a lower layer with a main surface and a capacitor formed on the main surface of the lower layer |
| 05/10/2001 | DE10046891A1 Photoresist composition for forming semiconductor element, comprises photoresist resin, photoacid generator, photobase generator and organic solvent |
| 05/10/2001 | DE10046021A1 Capacitor production on a substrate by forming a lower electrode on the substrate, forming a dielectric layer on the electrode, oxygen radical or plasma heat treating the dielectric layer and forming the upper electrode |
| 05/10/2001 | DE10042909A1 Multilayered ceramic substrate comprises substrate ceramic layers each containing a ceramic material that sinters at a low temperature, a shrinkage-preventing layer containing an inorganic material in the non-sintered state and wiring cable |
| 05/10/2001 | DE10042881A1 CVD apparatus comprises a reaction chamber, a material gas introduction path, an inert gas introduction path, an introduction path for a gas having a high heat conductivity, a moisture measuring device and a vacuum pump |
| 05/10/2001 | DE10042626A1 Electron beam photolithography device for IC manufacture uses block mask provided with matrix of rectangular aperture patterns and setting aperture pattern used for setting beam deflector |
| 05/10/2001 | DE10041565A1 Metallic intermediate connection used in the production of integrated circuits comprises a barrier layer formed on the insulating film, an adhesion layer containing zirconium and an intermediate connection material containing copper |
| 05/10/2001 | DE10019805A1 Dynamische Halbleiterspeichervorrichtung mit reduziertem Stromverbrauch im Lesebetrieb Dynamic semiconductor memory device with reduced power consumption in the reading operation |
| 05/10/2001 | DE10019708A1 Semiconductor device comprises a region of a first conducting type formed on the surface of a semiconductor substrate, an element-forming region, a semiconductor element, an insulation film and a contact hole |
| 05/10/2001 | CA2387341A1 Method and apparatus for supercritical processing of multiple workpieces |
| 05/10/2001 | CA2387334A1 Removal of photoresist and residue from substrate using supercritical carbon dioxide process |
| 05/09/2001 | EP1098403A1 Device for processing a plurality of laser beams |
| 05/09/2001 | EP1098372A2 Method of preventing boron diffusion in a semiconductor structure by creating nitrogen barriers and the corresponding structure |
| 05/09/2001 | EP1098371A2 A semiconductor device with good reverse recovery withstand and the method of manufacturing the same |
| 05/09/2001 | EP1098370A2 DRAM cell array and method of making the same |
| 05/09/2001 | EP1098366A1 Semiconductor connection structure and method |
| 05/09/2001 | EP1098365A2 Method for manufacturing semiconductor chips |
| 05/09/2001 | EP1098364A1 Fabrication method for vertical power components |
| 05/09/2001 | EP1098363A2 Testing integrated circuits |
| 05/09/2001 | EP1098362A1 Method and device for forming bump |
| 05/09/2001 | EP1098361A2 Particle material, anisotropic conductive connection and anisotropic conductive connection material |
| 05/09/2001 | EP1098358A2 Method for making field effect devices and capacitors with thin film dielectrics and resulting devices |
| 05/09/2001 | EP1098357A1 Bond head for a wire bonder |
| 05/09/2001 | EP1098356A1 Bonding head for a wire bonder |
| 05/09/2001 | EP1098354A2 Apparatus for controlling temperature in a semiconductor processing system |
| 05/09/2001 | EP1098353A2 Substrate processing system |
| 05/09/2001 | EP1098352A2 Apparatus for detecting plasma etch endpoint and method |
| 05/09/2001 | EP1098351A2 Apparatus detecting misalignment of processing semiconductor wafers in a cassette and associated methods |
| 05/09/2001 | EP1098324A2 Ferroelectric non-volatile latch circuits |
| 05/09/2001 | EP1098290A2 Electroluminescent display device |
| 05/09/2001 | EP1098259A2 Rate equation method and apparatus for simulation of current in a mos device |
| 05/09/2001 | EP1098215A1 Catadioptric objective comprising two intermediate images |
| 05/09/2001 | EP1098200A2 Adjusting device for the planarization of probe sets of a probe card |
| 05/09/2001 | EP1098189A2 Method for detecting an end point for an oxygen free plasma process |
| 05/09/2001 | EP1098181A2 Method for making diaphragm-based sensors and apparatus constructed therewith |
| 05/09/2001 | EP1098015A1 Evaporator for a CVD apparatus |
| 05/09/2001 | EP1097617A1 Interconnect assembly for printed circuit boards and method of fabrication |
| 05/09/2001 | EP1097482A1 J-fet semiconductor device |
| 05/09/2001 | EP1097475A1 Mould, encapsulating device and method of encapsulation |
| 05/09/2001 | EP1097474A1 Methods and apparatus for electropolishing metal interconnections on semiconductor devices |
| 05/09/2001 | EP1097473A1 Plasma process to deposit silicon nitride with high film quality and low hydrogen content |
| 05/09/2001 | EP1097472A1 Vapor deposition routes to nanoporous silica |
| 05/09/2001 | EP1097471A1 Integrated circuit with at least one transistor and a capacitor and corresponding production method |
| 05/09/2001 | EP1097470A1 Infra-red transparent thermal reactor cover member |