| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/17/2001 | WO2001035461A1 Semiconductor device and method of manufacturing the same |
| 05/17/2001 | WO2001035460A1 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device |
| 05/17/2001 | WO2001035459A1 Ceramic substrate |
| 05/17/2001 | WO2001035458A1 Method and apparatus for assembling ball grid array and chip scale array |
| 05/17/2001 | WO2001035457A1 Wafer level application of tack-free die-attach adhesive film |
| 05/17/2001 | WO2001035456A1 Dip formation of flip-chip solder bumps |
| 05/17/2001 | WO2001035455A1 Etch process that resists notching at electrode bottom |
| 05/17/2001 | WO2001035454A1 Reactor for processing a semiconductor wafer |
| 05/17/2001 | WO2001035453A1 Heat treatment device |
| 05/17/2001 | WO2001035452A1 Production method for silicon epitaxial wafer and silicon epitaxial wafer |
| 05/17/2001 | WO2001035450A1 Compound semiconductor wafer |
| 05/17/2001 | WO2001035449A1 Device for assembly of component supports for microsystems |
| 05/17/2001 | WO2001035448A2 Method for making a stack of capacitors, in particular for dynamic ram |
| 05/17/2001 | WO2001035440A1 Method and apparatus for electron beam column assembly with precise alignment using displaced semi-transparent membranes |
| 05/17/2001 | WO2001035167A1 Composition for antireflection coating |
| 05/17/2001 | WO2001035051A2 X-ray tomography bga (ball grid array) inspections |
| 05/17/2001 | WO2001035041A2 Method for rapid thermal processing of substrates |
| 05/17/2001 | WO2001035006A2 Metal-infiltrated ceramic seal |
| 05/17/2001 | WO2001034877A1 Alkaline etching solution and process for etching semiconductor wafers |
| 05/17/2001 | WO2001034868A1 Correction method and device for sputtering target/packing plate assembly |
| 05/17/2001 | WO2001034765A1 Methods and apparatus for the electronic, homogeneous assembly and fabrication of devices |
| 05/17/2001 | WO2001034668A1 Ultraviolet absorbing electrically conductive anisotropic adhesive |
| 05/17/2001 | WO2001034382A1 Aerogel substrate and method for preparing the same |
| 05/17/2001 | WO2001018848A3 Pre-metal dielectric rapid thermal processing for sub-micron technology |
| 05/17/2001 | WO2001011662A3 Vapor phase connection techniques |
| 05/17/2001 | WO2001006561A3 Ferroelectric memory capacitor |
| 05/17/2001 | WO2001006545A3 ENHANCED n TYPE SILICON MATERIAL FOR EPITAXIAL WAFER SUBSTRATE AND METHOD OF MAKING SAME |
| 05/17/2001 | WO2001003189A8 Multichip module and method for producing a multichip module |
| 05/17/2001 | WO2000075727A3 Coatings on reflective mask substrates |
| 05/17/2001 | WO2000037338A9 Integrated intra-bay transfer, storage and delivery system |
| 05/17/2001 | US20010001322 Method of manufacturing SRAM cell |
| 05/17/2001 | US20010001298 Integrated cobalt silicide process for semiconductor devices |
| 05/17/2001 | US20010001297 Forming a titanium film upon a substrate, forming an intermediate layer comprising silicon upon said titanium film, and forming a titanium nitride film upon said intermediate layer; barrier |
| 05/17/2001 | US20010001295 Nonvolatile semiconductor memory device and method for fabricating the same, and semiconductor integrated circuit device |
| 05/17/2001 | US20010001294 EEPROM memory cell and corresponding manufacturing method |
| 05/17/2001 | US20010001291 Burn-in apparatus for burning-in microwave transistors |
| 05/17/2001 | US20010001277 Dual arm linear hand-off wafer transfer assembly |
| 05/17/2001 | US20010001262 Semiconductor device |
| 05/17/2001 | US20010001257 Integrated capacitor bottom electrode for use with conformal dielectric |
| 05/17/2001 | US20010001248 Stage system with driving mechanism, and exposure apparatus having the same |
| 05/17/2001 | US20010001225 Method for manufacturing a field emission element |
| 05/17/2001 | US20010001217 Semiconductor device, manufacturing method thereof and aggregate type semiconductor device |
| 05/17/2001 | US20010001216 Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package |
| 05/17/2001 | US20010001215 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
| 05/17/2001 | US20010001213 Asymmetric MOS technology power device |
| 05/17/2001 | US20010001212 Flash memory structure using sidewall floating gate and method for forming the same |
| 05/17/2001 | US20010001211 Semiconductor device comprising capacitor and method of fabricating the same |
| 05/17/2001 | US20010001210 Capacitor Structures |
| 05/17/2001 | US20010001209 Semiconductor device and manufacturing method thereof |
| 05/17/2001 | US20010001208 Ferroelectric capacitor and a method for manufacturing thereof |
| 05/17/2001 | US20010001191 Method for forming dielectric layers |
| 05/17/2001 | US20010001185 Plasma processing apparatus and method of cleaning the apparatus |
| 05/17/2001 | US20010001183 Exposing to plasma a surface of a molded polymer formed on a substrate, allowing the plasma to convert silicon-containing residue on surface to silica, bonding article to surface by applying adherent between surface and article |
| 05/17/2001 | US20010001175 Method and apparatus for modifying the profile of narrow, high-aspect-ratio gaps using differential plasma power |
| 05/17/2001 | DE19956250C1 Production of a number of semiconductor wafers comprise simultaneously polishing a front side and a rear side of each wafer and evaluating each wafer for further processing according to quality criteria |
| 05/17/2001 | DE19953949A1 Vorrichtung zum Bestücken von Teileträgern für Mikrosysteme Apparatus for populating component carriers for microsystems |
| 05/17/2001 | DE19952195A1 Anlage zur Bearbeitung von Wafern Plant for the processing of wafers |
| 05/17/2001 | DE19952194A1 Anlage zur Bearbeitung von Wafern Plant for the processing of wafers |
| 05/17/2001 | DE19952017A1 Verfahren und Vorrichtung zum thermischen Behandeln von Substraten Method and apparatus for thermal treatment of substrates |
| 05/17/2001 | DE19952015A1 Verfahren zum thermischen Behandeln von Objekten A method for the thermal treatment of objects |
| 05/17/2001 | DE19948455A1 Device for positioning, fitting surface mount component brings first measurement surface of component and substrate into first camera focus plane, second surfaces into second focus plane |
| 05/17/2001 | DE19940033A1 Verfahren und Vorrichtung zum Abscheiden von Schichten auf rotierenden Substraten in einem allseits beheizten Strömungskanal Method and apparatus for depositing layers on rotating substrates in a well-heated flow channel |
| 05/17/2001 | DE19927748C2 Transportvorrichtung für elektronische Bauelemente mit kontaminationsverhindernder Beschichtung Transport device for electronic components with kontaminationsverhindernder coating |
| 05/17/2001 | DE10055431A1 Production of a capacitor used in the production of DRAMs comprises forming a lower electrode on a semiconductor substrate, depositing an amorphous thin layer and forming an upper electrode |
| 05/17/2001 | DE10053834A1 Production of an aluminum nitride thin layer used in thin film technology comprises subjecting the thin layer to a microwave plasma after is has been deposited |
| 05/17/2001 | DE10053532A1 Electronic component e.g. surface acoustic wave device for communication device, has seal cover arranged on upper surface of seal frame through conductive structure or insulating structure |
| 05/17/2001 | DE10051834A1 Semiconductor base material for manufacturing semiconductor wafer or semiconductor device has 1 to 15 micrometer micro dot mark with height whose maximum length along marked surface is 0.01 to 5 micrometers |
| 05/17/2001 | DE10039931A1 Verfahren zur Bildung eines bipolaren Transistors zur Unterdrückung einer Schwankung in der Basisbreite A method of forming a bipolar transistor in order to suppress a fluctuation in the base width |
| 05/17/2001 | DE10036114A1 Ball mount apparatus has ball inspection apparatus which performs inspection of ball adsorbed by mount head, arranged perpendicular to elongated direction of workpiece |
| 05/17/2001 | DE10027003A1 Halbleiterschaltungsvorrichtung mit der Fähigkeit, Stromversorgungspotentiale extern an eine interne Schaltung anzulegen und dabei Rauschen einzuschränken Semiconductor integrated circuit device with the ability to create electricity supply potentials external to an internal circuit and thereby reduce noise |
| 05/17/2001 | DE10000004A1 Production of conducting pathways comprises applying a metal layer and an insulating layer to a substrate, producing nitride and photoresist layers, forming a resist mask |
| 05/17/2001 | CA2390068A1 Inspection method utilizing vertical slice imaging |
| 05/17/2001 | CA2388926A1 Metal redistribution layer having solderable pads and wire bondable pads |
| 05/16/2001 | EP1100298A1 Ceramic circuit board and method of manufacture thereof |
| 05/16/2001 | EP1100296A1 Wiring method and wiring device |
| 05/16/2001 | EP1100128A1 Semiconductor device and method of manufacture thereof |
| 05/16/2001 | EP1100127A1 Soi wafer and method for producing soi wafer |
| 05/16/2001 | EP1100126A2 SOI semiconductor device and fabrication process thereof |
| 05/16/2001 | EP1100124A1 Dielectric separation wafer and production method thereof |
| 05/16/2001 | EP1100123A1 Dip formation of flip-chip solder bumps |
| 05/16/2001 | EP1100122A2 Die used for resin-sealing and molding an electronic component |
| 05/16/2001 | EP1100121A2 Process for forming low k silicon oxide dielectric material while suppressing pressure spiking and inhibiting increase in dielectric constant |
| 05/16/2001 | EP1100120A2 Thin film devices and method for fabricating thin film devices |
| 05/16/2001 | EP1100119A1 Plasma processing method |
| 05/16/2001 | EP1100118A1 Protective metallic film for structure on semiconductor substrate against KOH etchant |
| 05/16/2001 | EP1100117A2 A surface treatment method for a silicon wafer |
| 05/16/2001 | EP1100116A1 Method for relaxing stress in blanket tungsten film formed by chemical vapor deposition |
| 05/16/2001 | EP1100115A1 Device and method for plasma processing |
| 05/16/2001 | EP1100114A2 Zone controlled radiant heating system utilizing focused reflector |
| 05/16/2001 | EP1100113A2 Dielectric barrier discharge lamp |
| 05/16/2001 | EP1100109A1 Electron beam irradiation processing method |
| 05/16/2001 | EP1100096A1 Electronic device and manufacture thereof |
| 05/16/2001 | EP1100039A2 Semiconductor apparatus for fingerprint recognition |
| 05/16/2001 | EP1099983A1 Chemically amplified positive resist composition and patterning method |
| 05/16/2001 | EP1099953A2 Semiconductor device with testing capability |
| 05/16/2001 | EP1099781A2 Conductive biasing member for metal layering |
| 05/16/2001 | EP1099779A1 Surface treatment apparatus |
| 05/16/2001 | EP1099778A2 Trap apparatus |
| 05/16/2001 | EP1099777A1 Sputter target |
| 05/16/2001 | EP1099776A1 Plasma cleaning step in a salicide process |