Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2001
05/29/2001US6238845 Method of forming lead frames with preformation support
05/29/2001US6238844 Process for depositing a plasma polymerized organosilicon photoresist film
05/29/2001US6238826 Apparatus for transferring structures
05/29/2001US6238803 Titanium nitride barrier layers
05/29/2001US6238751 Semiconductor substrate
05/29/2001US6238747 Using nozzle
05/29/2001US6238737 Method for protecting refractory metal thin film requiring high temperature processing in an oxidizing atmosphere and structure formed thereby
05/29/2001US6238735 Using an enclosed substrate; controlled vapor deposition
05/29/2001US6238734 Liquid precursor mixtures for deposition of multicomponent metal containing materials
05/29/2001US6238624 A self-addressable, self-assembling microelectronic device is designed and fabricated to actively carry out and control multi-step and multiplex molecular biological reactions in microscopic formats.
05/29/2001US6238597 Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate
05/29/2001US6238592 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
05/29/2001US6238590 Tribochemical polishing of ceramics and metals
05/29/2001US6238588 High pressure high non-reactive diluent gas content high plasma ion density plasma oxide etch process
05/29/2001US6238587 Method for treating articles with a plasma jet
05/29/2001US6238586 Selectively etching the porous silicon layer of a substrate having a porous and a nonporous silicon layer with an etching solution comprising buffered hydrofluoric acid containing ammonium fluoride, to leave the nonporous layer
05/29/2001US6238585 Method for manufacturing an ink-jet head having nozzle openings with a constant width
05/29/2001US6238582 Reactive ion beam etching method and a thin film head fabricated using the method
05/29/2001US6238576 Chemical liquid supply method and apparatus thereof
05/29/2001US6238533 Integrated PVD system for aluminum hole filling using ionized metal adhesion layer
05/29/2001US6238531 Method and apparatus to improve the properties of ion beam deposited films in an ion beam sputtering system
05/29/2001US6238515 Wafer transfer apparatus
05/29/2001US6238514 Apparatus and method for removing condensable aluminum vapor from aluminum etch effluent
05/29/2001US6238513 Wafer lift assembly
05/29/2001US6238512 Plasma generation apparatus
05/29/2001US6238511 Method and apparatus for processing substrate
05/29/2001US6238494 Polycrystalline, metallic sputtering target
05/29/2001US6238488 Method of cleaning film forming apparatus, cleaning system for carrying out the same and film forming system
05/29/2001US6238487 Method for improving the efficiency of semiconductor chip production
05/29/2001US6238482 Method of producing a wafer with an epitaxial quality layer and device with epitaxial quality layer
05/29/2001US6238478 Silicon single crystal and process for producing single-crystal silicon thin film
05/29/2001US6238477 Process and device for the production of a single crystal
05/29/2001US6238469 Dual-valent rare earth additives to polishing slurries
05/29/2001US6238454 Heat-dissipating microcircuit packaging composite having similar coefficient of thermal expansion as microcircuit and comprising powder metallurgically formed, sintered mixture of copper, carbon and wetting agent metals which form carbides
05/29/2001US6238450 Milling slurry of agglomerated ceria at an alkaline ph to increase the bet surface area to that suitable for optical and chemo-mechanical polishing processes
05/29/2001US6238283 Double-sealed work conveying and transferring apparatus and container inspecting method
05/29/2001US6238272 Polishing compound and a polishing method for silicon wafer
05/29/2001US6238223 Method of depositing a thermoplastic polymer in semiconductor fabrication
05/29/2001US6238161 Cost effective modular-linear wafer processing
05/29/2001US6238160 Method for transporting and electrostatically chucking a semiconductor wafer or the like
05/29/2001US6238107 Developing apparatus
05/29/2001US6237979 Wafer carrier
05/29/2001US6237833 Method of checking wirebond condition
05/29/2001US6237771 Wafer shipping container
05/29/2001US6237585 Wire-sawing machine
05/29/2001US6237527 System for improving energy purity and implant consistency, and for minimizing charge accumulation of an implanted substrate
05/29/2001US6237526 Process apparatus and method for improving plasma distribution and performance in an inductively coupled plasma
05/29/2001US6237422 Apparatus and method for testing strength of electrical bond sites on semiconductor devices
05/29/2001US6237393 Wafer center alignment device and method of wafer alignment
05/29/2001US6237222 Method of producing a radiator and product thereof
05/29/2001US6237219 Method of mounting conductive ball
05/29/2001CA2274577C Injection molding encapsulation for an electronic device directly onto a substrate
05/29/2001CA2173034C Bimos integrated circuit
05/29/2001CA2090556C Method for controlling movement of neutral atom and apparatus for carrying out the same
05/25/2001WO2001037626A2 Transport device and method for transferring product carriers for electronic components
05/25/2001WO2001037621A2 Method for producing a support element for an integrated circuit (ic) component
05/25/2001WO2001037618A1 Method for obtaining an extreme ultraviolet radiation source, radiation source and use in lithography
05/25/2001WO2001037457A1 Virtual laser operator
05/25/2001WO2001037387A1 Semiconductor laser
05/25/2001WO2001037385A1 Contact structure for an electric ii/vi semiconductor component and a method for the production of the same
05/25/2001WO2001037376A1 Arrangement for electrically connecting chips in a circuit that is embodied in a three-dimensional manner
05/25/2001WO2001037349A1 Vertical heterojunction bipolar transistor
05/25/2001WO2001037347A1 Non-volatile semiconductor memory location and method for producing the same
05/25/2001WO2001037346A1 Lateral thin-film soi device having a lateral drift region and method of making such a device
05/25/2001WO2001037345A1 Radiation resistant integrated circuit design
05/25/2001WO2001037344A1 Secure rom memory cell and method for production thereof
05/25/2001WO2001037342A2 Dram cell structure with tunnel barrier
05/25/2001WO2001037340A1 Programmable semiconductor device structures and methods for making the same
05/25/2001WO2001037339A1 Air gap dielectric in self-aligned via structures
05/25/2001WO2001037338A2 Method for integrating a chip in a printed board and integrated circuit
05/25/2001WO2001037334A1 Structure and method for dual sidewall oxidation in high density, high performance drams
05/25/2001WO2001037333A1 Method of fabrication dual threshold voltage n-channel and p-channel mosfets with a single extra masked implant operation
05/25/2001WO2001037331A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE COMPRISING SiGe HBTs
05/25/2001WO2001037330A1 Method for stabilizing oxide-semiconductor interface by using group 5 element and stabilized semiconductor
05/25/2001WO2001037329A1 System and method for removal of material
05/25/2001WO2001037328A1 Method for treating a surface of an sic semiconductor layer and schottky contact
05/25/2001WO2001037327A1 Pendeoepitaxial growth of gallium nitride layers on sapphire substrates
05/25/2001WO2001037326A1 Processing apparatus for microelectronic devices in which polymeric bellows are used to help accomplish substrate transport inside of the apparatus
05/25/2001WO2001037325A2 A method of forming wires on an integrated circuit chip
05/25/2001WO2001037322A2 System and method for product yield prediction using a logic characterization vehicle
05/25/2001WO2001037321A2 Semiconductor devices with selectively doped iii-v nitride layers
05/25/2001WO2001037320A2 Optimized decoupling capacitor using lithographic dummy filler
05/25/2001WO2001037317A1 Plasma processing system with dynamic gas distribution control
05/25/2001WO2001037316A1 Temperature control system for plasma processing apparatus
05/25/2001WO2001037315A1 Plasma processing systems and method therefor
05/25/2001WO2001037314A1 Materials and gas chemistries for processing systems
05/25/2001WO2001037313A1 Plasma processing apparatus with an electrically conductive wall
05/25/2001WO2001037311A2 Method and apparatus for controlling the volume of a plasma
05/25/2001WO2001037310A2 Method and apparatus for ionized physical vapor deposition
05/25/2001WO2001037309A1 Plasma focus light source with improved pulse power system
05/25/2001WO2001037306A1 Stabilized oscillator circuit for plasma density measurement
05/25/2001WO2001037150A1 System and method for product yield prediction using device and process neighborhood characterization vehicle
05/25/2001WO2001037148A1 Ip base lsi designing system and designing method
05/25/2001WO2001037053A1 Imaging method using phase boundary masking with modified illumination
05/25/2001WO2001037052A1 Photolithography method, photolithography mask blanks, and method of making
05/25/2001WO2001037051A1 Beam positioning in microlithographic writing
05/25/2001WO2001037050A1 Use of polyimide for adhesive layers, lithographic method for producing microcomponents and method for producing composite material
05/25/2001WO2001037047A2 Nitrile/fluoroalcohol polymer-containing photoresists and associated processes for microlithography
05/25/2001WO2001037044A1 Ultraviolet and vacuum ultraviolet transparent polymer compositions and their uses
05/25/2001WO2001037043A1 Ultraviolet and vacuum ultraviolet transparent polymer compositions and their uses