Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2001
06/12/2001US6245580 Low temperature process for fabricating layered superlattice materials and making electronic devices including same
06/12/2001US6245508 Hybridizing dna of first length to capture probes at site, hybridizing dna of second length to capture probes at another site, observing fluorescent signals as potential is reversed, detecting sites which dehybridize at a potential
06/12/2001US6245493 Method for reducing surface reflectivity by increasing surface roughness
06/12/2001US6245490 Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same
06/12/2001US6245489 Fluorinated hard mask for micropatterning of polymers
06/12/2001US6245488 Method for forming features using frequency doubling hybrid resist and device formed thereby
06/12/2001US6245478 Resist composition
06/12/2001US6245470 Exposure, masking, transparent substrates, micro patterns and focusing
06/12/2001US6245466 Mask pattern design method and a photomask
06/12/2001US6245451 Ferroelectric material, method of manufacturing the same, semiconductor memory, and method of manufacturing the same
06/12/2001US6245442 Aluminum-silicon carbide composite
06/12/2001US6245396 CVD apparatus and method of using same
06/12/2001US6245380 Multilayer; dielectrics, barriers, glue, metal; polishing
06/12/2001US6245311 Method for heat treatment of silicon wafer and silicon wafer
06/12/2001US6245250 Process vessel
06/12/2001US6245202 Plasma treatment device
06/12/2001US6245192 Gas distribution apparatus for semiconductor processing
06/12/2001US6245191 Wet etch apparatus
06/12/2001US6245190 Plasma processing system and plasma processing method
06/12/2001US6245189 High Throughput plasma treatment system
06/12/2001US6245186 Electronic package with compressible heatsink structure
06/12/2001US6245185 Method of making a multilayer ceramic product with thin layers
06/12/2001US6245171 Multi-thickness, multi-layer green sheet lamination and method thereof
06/12/2001US6245161 Economical silicon-on-silicon hybrid wafer assembly
06/12/2001US6245158 Wet processing methods for the manufacture of electronic components using liquids of varying temperature
06/12/2001US6245156 Substrate transport method and apparatus, and substrate processing system
06/12/2001US6245155 Method for removing photoresist and plasma etch residues
06/12/2001US6245149 Inert barrier for high purity epitaxial deposition systems
06/12/2001US6245148 SOG dispensing system and its controlling sequences
06/12/2001US6245147 Thermal processing jig for use in manufacturing semiconductor devices and method of manufacturing the same
06/12/2001US6244945 Polishing system including a hydrostatic fluid bearing support
06/12/2001US6244935 Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
06/12/2001US6244932 Method for detecting the presence of a substrate in a carrier head
06/12/2001US6244931 Buffer station on CMP system
06/12/2001US6244929 Chemical-mechanical-polishing system with continuous filtration
06/12/2001US6244812 Low profile automated pod door removal system
06/12/2001US6244811 Atmospheric wafer transfer module with nest for wafer transport robot
06/12/2001US6244717 Reduction objective for extreme ultraviolet lithography
06/12/2001US6244641 Wafer transfer arm
06/12/2001US6244634 Apparatus for actuating the retaining locks of a cassette
06/12/2001US6244569 Controlled motion lift mechanism
06/12/2001US6244499 Structure of a ball bump for wire bonding and the formation thereof
06/12/2001US6244493 Die bonding apparatus
06/12/2001US6244422 Apparatus for sensing and controlling tipping movement of a semiconductor boat
06/12/2001US6244282 Substrate treatment device
06/12/2001US6244281 Method and apparatus for drying substrate
06/12/2001US6244280 Method and apparatus for immersion treatment of semiconductor and other devices
06/12/2001US6244211 Plasma processing apparatus
06/12/2001US6244192 XY table
06/12/2001US6244121 Sensor device for non-intrusive diagnosis of a semiconductor processing system
06/12/2001US6243966 Air amplifier with uniform output flow pattern
06/12/2001US6243945 Method for manufacturing electronic parts
06/12/2001US6243944 Residue-free method of assembling and disassembling a pressed joint with low thermal resistance
06/07/2001WO2001041518A1 Low species buffered rinsing fluids and methods
06/07/2001WO2001041508A1 Ceramic heater
06/07/2001WO2001041221A1 Method and apparatus for self-doping contacts to a semiconductor
06/07/2001WO2001041218A1 Method for recycled separated wafer and recycled separated wafer
06/07/2001WO2001041216A1 Method for producing monolithically integrated semiconductor components
06/07/2001WO2001041212A2 Integrated circuit package
06/07/2001WO2001041211A1 Semiconductor device
06/07/2001WO2001041210A1 Bipolar transistor structure
06/07/2001WO2001041209A1 Chip bonding device
06/07/2001WO2001041208A1 Chip mounter
06/07/2001WO2001041207A1 Packaging of integrated circuits and vertical integration
06/07/2001WO2001041206A2 Manufacture of trench-gate semiconductor devices
06/07/2001WO2001041205A1 Method for producing a bipolar transistor and method for producing an integrated circuit arrangement with such a bipolar transistor
06/07/2001WO2001041204A1 Method and apparatus for forming thin film of metal
06/07/2001WO2001041203A1 Improved flourine doped sio2 film
06/07/2001WO2001041201A1 Process for fabricating a uniform gate oxide of a vertical transistor
06/07/2001WO2001041200A1 Nitrided re-oxidised polysilicon gate to improve hot carrier performance
06/07/2001WO2001041199A1 Integrated memory cell and method of fabrication
06/07/2001WO2001041197A1 Wafer processing system
06/07/2001WO2001041196A1 Resistively heated single wafer furnace
06/07/2001WO2001041195A1 Single wafer annealing oven
06/07/2001WO2001041194A2 Semiconductor circuit arrangement and a method for producing same
06/07/2001WO2001041193A1 Device and method for aligning disc-shaped substrates
06/07/2001WO2001041191A2 Method and apparatus for forming an oxidized structure on a microelectronic workpiece
06/07/2001WO2001041190A2 A method for measuring stress induced leakage current and gate dielectric integrity using corona discharge
06/07/2001WO2001041189A2 Cobalt silicide etch process and apparatus
06/07/2001WO2001041188A2 Process chamber cooling
06/07/2001WO2001041187A2 Semiconductor circuit arrangement and a method for producing same
06/07/2001WO2001041183A1 Dose monitor for plasma doping system
06/07/2001WO2001041182A1 Plasma processor, cluster tool, and method of controlling plasma
06/07/2001WO2001041181A1 Gas cluster ion beam smoother apparatus
06/07/2001WO2001041067A1 Method for extracting objective image
06/07/2001WO2001040943A2 A system, method and apparatus pertaining to flexible selection scan test
06/07/2001WO2001040884A2 Monitoring system for a conveying device that conveys flat articles, especially wafers
06/07/2001WO2001040876A1 Method and apparatus for aligning a crystalline substrate
06/07/2001WO2001040873A1 Positive type photosensitive polyimide resin composition
06/07/2001WO2001040871A1 Mitigation of substrate defects in reticles using multilayer buffer layers
06/07/2001WO2001040868A2 Alternating phase mask
06/07/2001WO2001040864A1 Photoresist dispense method by compensation for substrate reflectivity
06/07/2001WO2001040856A1 Active matrix substrate for liquid crystal display and method of manufacture for making the same
06/07/2001WO2001040735A1 Analyzer/observer
06/07/2001WO2001040692A1 Compact gate valve
06/07/2001WO2001040552A1 Mini batch furnace
06/07/2001WO2001040541A1 Atomic-layer-chemical-vapor-deposition of films that contain silicon dioxide
06/07/2001WO2001040540A1 Improved reactor with heated and textured electrodes and surfaces
06/07/2001WO2001040145A2 Power assisted automatic supervised classifier creation tool for semiconductor defects
06/07/2001WO2001040138A1 Porous silicon carbide sintered compact and silicon carbide metal composite suitable for use in table for wafer polishing machine