Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2001
06/07/2001DE19957123A1 DRAM Zellanordnung und Verfahren zu deren Herstellung DRAM cell arrangement, and processes for their preparation
06/07/2001DE19957117A1 Maskenprogrammierbare ROM-Speichervorrichtung sowie Verfahren zu deren Herstellung A mask programmable read only memory device as well as processes for their preparation
06/07/2001DE19957113A1 Verfahren zur Herstellung eines aktiven Transistorgebietes Process for the preparation of an active transistor region
06/07/2001DE19956978A1 Production of deep trench capacitor comprises patterning substrate having hard mask layer and insulating layer to form trench, thermally treating after doping and forming dielectric capacitor layer and conducting layers
06/07/2001DE19950362C1 DRAM-Zellenanordnung, Verfahren zu deren Betrieb und Verfahren zu deren Herstellung DRAM cell arrangement, method for its operation and procedures for their preparation
06/07/2001DE19940560A1 Verfahren zur Herstellung eines Halbleiterchips mit nach dem Siliziumprozess einstellbarer elektrischer Eigenschaft A process for producing a semiconductor chip with silicon after the process adjustable electrical property
06/07/2001DE10059909A1 Chemisch verstärkte positiv arbeitende Resistzusammensetzung A chemically amplified positive resist composition
06/07/2001DE10056833A1 High-voltage semiconductor integrated circuit wafer has resistor connected between substrate and ground potential to limit current in parasitic diode based on negative voltage peaks on output node
06/07/2001DE10052721A1 Integrated circuit has switching circuit to switch between control signal from controller, and test data from test controller for input into data path unit
06/07/2001DE10051604A1 Semiconductor device production comprises growing polysilicon film on surface of silicon wafer, and wet etching using mixture of ammonia water, hydrogen peroxide water and pure water
06/07/2001DE10044463A1 Dicing procedure for semiconductor wafer, involves rotating blade to align base with exposure area so as to form orthogonal cutting lines on wafer
06/07/2001DE10041623A1 Multi-layered ceramic substrate manufacture involves preparing raw compound multilayer body with metallic foils, and baking it while restraining contraction of green sheets in direction of main surface
06/07/2001DE10030145A1 Semiconductor wafer testing method involves irradiating charged particle on small region of wafer containing maximum opening defect, based on position data
06/07/2001CA2392710A1 Method and apparatus for aligning a crystalline substrate
06/06/2001EP1104947A2 Nitride semiconductor laser and method for fabricating the same
06/06/2001EP1104937A1 Organic light emission element array on semiconductor substrate
06/06/2001EP1104936A1 Method of manufacturing a semiconductor device, and semiconductor device manufactured thereby
06/06/2001EP1104935A1 An integrated device with trimming elements
06/06/2001EP1104934A2 Method to selectively heat semiconductor wafers
06/06/2001EP1104915A2 Defect detection using gray level signatures
06/06/2001EP1104778A2 Method of production of composited particle for chemical mechanical polishing
06/06/2001EP1104647A1 Method for manufacturing solderless high density electronic modules
06/06/2001EP1104583A1 Integrated circuit comprising fuse links which can be separated by the action of energy
06/06/2001EP1104494A1 Control of crystal anisotropy for perovskite oxides on semiconductor-based substrates
06/06/2001EP0930974B1 Inverted stamping process
06/06/2001EP0815481B1 Magnification correction for small field scanning
06/06/2001EP0799512B1 Laser diode with an ion-implanted region
06/06/2001EP0664923B1 Process and device for forming the connection leads of integrated circuits
06/06/2001EP0616726B1 Layered superlattice material applications
06/06/2001CN1298626A Flip chip devices with flexible conductive adhesive
06/06/2001CN1298552A Device for fixing substrates
06/06/2001CN1298428A High-melting polyamide composition for electronic applications
06/06/2001CN1298208A Method for producing light generation electric apparatus
06/06/2001CN1298207A Semiconductor device and its producing method
06/06/2001CN1298204A Technology for producing semiconductor device
06/06/2001CN1298203A Mask detecting apparatus and method
06/06/2001CN1298202A Packaging method of hydrogen ion sensitive FET
06/06/2001CN1298201A Manufacturing method and equipment for semiconductor device
06/06/2001CN1298200A Light annealing device and method for controlling its processing temperature
06/06/2001CN1298168A Electroluminescent display device and electronic apparatus
06/06/2001CN1297963A Polyporous material
06/06/2001CN1297799A Laser corrosion method and its apparatus
06/06/2001CN1066907C Electronic elements assembly unit
06/06/2001CN1066856C Method and apparatus for monitoring and status labeling disk carriers
06/06/2001CN1066829C 形成图形的方法 The method of forming a pattern
06/06/2001CN1066644C Method and equipment for removing surface pollutant
06/05/2001US6243850 Allocation apparatus and method for determining cell allocation of semiconductor circuit
06/05/2001US6243534 Method and apparatus to compensate for non-uniform film growth during chemical vapor deposition
06/05/2001US6243487 Pattern exposure method using electron beam
06/05/2001US6243307 Semiconductor device including tester circuit suppressible of circuit scale increase and testing device of semiconductor device
06/05/2001US6243305 Memory redundancy device and method
06/05/2001US6243295 Nonvolatile semiconductor memory
06/05/2001US6243292 Nonvolatile semiconductor memory device capable of reducing memory array area
06/05/2001US6243289 Dual floating gate programmable read only memory cell structure and method for its fabrication and operation
06/05/2001US6243286 Semiconductor memory device and method of fabricating the same
06/05/2001US6243285 ROM-embedded-DRAM
06/05/2001US6243284 Multivalued mask read-only memory
06/05/2001US6243251 Electrostatic chuck, and method of and apparatus for processing sample using the chuck
06/05/2001US6243209 Method and apparatus for providing rectangular shape array of light beams
06/05/2001US6243206 Illuminating system for vacuum ultraviolet microlithography
06/05/2001US6243203 Optical system with anti-reflection coating
06/05/2001US6243188 Light beam scanning system
06/05/2001US6243159 Projection aligner and exposure method using the same
06/05/2001US6243158 Projection exposure apparatus and method
06/05/2001US6243155 Electronic display device having an active matrix display panel
06/05/2001US6243153 Method of manufacturing pixel electrode for reflection type display device
06/05/2001US6243149 Method of imaging using a liquid crystal display device
06/05/2001US6243146 Liquid crystal displays using organic insulating material and manufacturing methods thereof
06/05/2001US6242985 Composite transistor device
06/05/2001US6242934 Background leakage zeroing by temperature and voltage dependence for IDDQ measurement and defect resolution
06/05/2001US6242879 Touch calibration system for wafer transfer robot
06/05/2001US6242817 Fabricated wafer for integration in a wafer structure
06/05/2001US6242813 Deep-submicron integrated circuit package for improving bondability
06/05/2001US6242812 CSP pin configuration compatible with TSOP pin configuration
06/05/2001US6242811 Interlevel contact including aluminum-refractory metal alloy formed during aluminum deposition at an elevated temperature
06/05/2001US6242809 Integrated circuit memory devices including titanium nitride bit lines
06/05/2001US6242808 Wiring is a stacked structure including a barrier layer which prevents copper(cu) atoms from diffusing into substrate, where a precipitated impmurity from cu layer is present at the interface between barrier and copper layers
06/05/2001US6242807 Semiconductor integrated circuit having heat sinking means for heat generating wires
06/05/2001US6242806 Semiconductor device and method of manufacturing thereof
06/05/2001US6242805 Method of using a polish stop film to control dishing during copper chemical mechanical polishing
06/05/2001US6242804 Fabrication process of a semiconductor device having a nitride film
06/05/2001US6242803 Semiconductor devices with integral contact structures
06/05/2001US6242799 Anisotropic stress buffer and semiconductor device using the same
06/05/2001US6242797 Semiconductor device having pellet mounted on radiating plate thereof
06/05/2001US6242796 Wiring structure of semiconductor memory device and formation method thereof
06/05/2001US6242795 Metal line structure and method of manufacturing the same
06/05/2001US6242794 Self-aligned symmetric intrinsic device
06/05/2001US6242793 Method and a circuit for improving the effectiveness of ESD protection in circuit structures formed in a semiconductor
06/05/2001US6242792 Semiconductor device having oblique portion as reflection
06/05/2001US6242791 Semiconductor inductor
06/05/2001US6242789 Vertical fuse and method of fabrication
06/05/2001US6242788 Semiconductor device and a method of manufacturing the same
06/05/2001US6242787 Semiconductor device and manufacturing method thereof
06/05/2001US6242786 SOI Semiconductor device with field shield electrode
06/05/2001US6242785 Nitride based sidewall spaces for submicron MOSFETs
06/05/2001US6242784 Edge termination for silicon power devices
06/05/2001US6242782 Circuit for providing isolation of integrated circuit active areas
06/05/2001US6242781 Resistor constructions
06/05/2001US6242779 Selective silicide thin-film transistor having polysilicon active layers with crystallizing metal agent introduced only in the source/drain regions
06/05/2001US6242777 Field effect transistor and liquid crystal devices including the same