| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 06/26/2001 | US6251470 Depositing polysilicon proximate a substrate, forming cavities within the polysilicon to enhance porosity of the polysilicon, and transforming the polysilicon into porous silicon dioxide |
| 06/26/2001 | US6251469 Method of rendering a substrate selectively non-wettable chip carrier with enhanced wire bondability |
| 06/26/2001 | US6251242 Magnetron and target producing an extended plasma region in a sputter reactor |
| 06/26/2001 | US6251241 Inductive-coupled plasma apparatus employing shield and method for manufacturing the shield |
| 06/26/2001 | US6251238 Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistance |
| 06/26/2001 | US6251235 Apparatus for forming an electrical contact with a semiconductor substrate |
| 06/26/2001 | US6251219 Method and apparatus for use in assembling electronic devices |
| 06/26/2001 | US6251218 Ion beam processing apparatus |
| 06/26/2001 | US6251217 Reticle adapter for a reactive ion etch system |
| 06/26/2001 | US6251215 Carrier head with a multilayer retaining ring for chemical mechanical polishing |
| 06/26/2001 | US6251211 Circuitry interconnection method |
| 06/26/2001 | US6251195 Processing a semiconductor wafer under evacuated conditions that is capable of transfer of the wafer from the processing chamber under conditions that are substantially equal to the pressure of an adjacent environment. |
| 06/26/2001 | US6251192 Vacuum exhaust system |
| 06/26/2001 | US6251191 Processing apparatus and processing system |
| 06/26/2001 | US6251190 Gate electrode connection structure by in situ chemical vapor deposition of tungsten and tungsten nitride |
| 06/26/2001 | US6251189 Substrate processing apparatus and substrate processing method |
| 06/26/2001 | US6251188 Apparatus for forming laminated thin films or layers |
| 06/26/2001 | US6251187 Gas distribution in deposition chambers |
| 06/26/2001 | US6251184 Insulating-containing ring-shaped heat shields for czochralski pullers |
| 06/26/2001 | US6251182 Susceptor for float-zone apparatus |
| 06/26/2001 | US6251150 Provide the desired level of planarization and selectivity for both metal and oxide surfaces without causing undesirable scratching of the surface. |
| 06/26/2001 | US6251000 Substrate holder, method for polishing substrate, and method for fabricating semiconductor device |
| 06/26/2001 | US6250998 Hand-held cutting tool for cutting fiber |
| 06/26/2001 | US6250995 Apparatus for polishing outer periphery of workpiece |
| 06/26/2001 | US6250994 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 06/26/2001 | US6250990 CSP plate cutting apparatus |
| 06/26/2001 | US6250933 Contact structure and production method thereof |
| 06/26/2001 | US6250914 Wafer heating device and method of controlling the same |
| 06/26/2001 | US6250870 Apparatus for handling and processing microelectronic-device substrate assemblies |
| 06/26/2001 | US6250869 Three chamber load lock apparatus |
| 06/26/2001 | US6250852 Spherical object supplying apparatus |
| 06/26/2001 | US6250822 Semiconductor wafer manufacturing method and apparatus for an improved heat exchanger for a photoresist developer |
| 06/26/2001 | US6250606 Substrate for semiconductor device, semiconductor device and manufacturing method thereof |
| 06/26/2001 | US6250541 Method of forming interconnections on electronic modules |
| 06/26/2001 | US6250539 Wire bonding method |
| 06/26/2001 | US6250534 Wire bonding method |
| 06/26/2001 | US6250374 Apparatus and method for treating substrates |
| 06/26/2001 | US6250318 Method and apparatus for washing and drying semi-conductor devices |
| 06/26/2001 | US6250251 Vacuum processing apparatus and vacuum processing method |
| 06/26/2001 | US6250192 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 06/26/2001 | US6250189 Rotary die cutter |
| 06/26/2001 | US6250188 Ultrasonic vibration cutting method and apparatus |
| 06/26/2001 | US6250153 Continuous, non-metallic, media sensors for corrosive environments |
| 06/26/2001 | US6250143 Method of mapping a surface using a probe for stylus nanoprofilometry having a non-circular cross-section |
| 06/26/2001 | US6250141 Scanning device |
| 06/26/2001 | US6250127 Light-weight for microelectronic or automotive components; metal matrix formed into extruded thin ribbon, then stamping/coining formation into the structure; flip-chip covers or lids; microelectronic heat-dissipating structures |
| 06/26/2001 | US6249990 Method and apparatus for transporting articles |
| 06/26/2001 | US6249943 Automatic semiconductor wafer applying apparatus |
| 06/26/2001 | US6249932 Apparatus and method for removing fine particles |
| 06/23/2001 | CA2328395A1 Single inlet and multiple outlet electronic switching machine and its application to a switching matrix |
| 06/21/2001 | WO2001045260A1 Electronic component with reduced inductive coupling |
| 06/21/2001 | WO2001045258A2 Method for implementing a physical design for a dynamically reconfigurable logic circuit |
| 06/21/2001 | WO2001045178A1 Intermediate suction support and use thereof for making a thin-layered structure |
| 06/21/2001 | WO2001045177A1 Capacitor for analog circuit, and manufacturing method thereof |
| 06/21/2001 | WO2001045175A2 Self-aligned ldd formation with one-step implantation for transistor formation |
| 06/21/2001 | WO2001045174A1 Bi-directional esd diode structure |
| 06/21/2001 | WO2001045173A1 Improved esd diode structure |
| 06/21/2001 | WO2001045172A1 Method and device for interconnecting electronic components in three dimensions |
| 06/21/2001 | WO2001045170A1 An integrated circuit with a serpentine conductor track for circuit selection |
| 06/21/2001 | WO2001045162A1 Trench capacitor |
| 06/21/2001 | WO2001045161A1 Nonvolatile memory and method of driving nonvolatile memory |
| 06/21/2001 | WO2001045160A1 Ceramic heater and support pin |
| 06/21/2001 | WO2001045159A1 System and method for contacting switching circuits |
| 06/21/2001 | WO2001045158A1 Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition |
| 06/21/2001 | WO2001045157A1 Mosfet device system and method |
| 06/21/2001 | WO2001045156A1 A method of manufacturing a semiconductor device |
| 06/21/2001 | WO2001045155A1 Manufacture of semiconductor material and devices using that material |
| 06/21/2001 | WO2001045154A1 Method for a tungsten silicide etch |
| 06/21/2001 | WO2001045153A1 Method for removal of hard mask used to define noble metal electrode |
| 06/21/2001 | WO2001045152A1 Plasma processing of tungsten using a gas mixture comprising a fluorinated gas and oxygen |
| 06/21/2001 | WO2001045151A2 Thin-film resistor with high temperature coefficient for use as passive semiconductor component for integrated circuits, and method for producing the same |
| 06/21/2001 | WO2001045150A1 Pressure control method |
| 06/21/2001 | WO2001045149A1 Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst |
| 06/21/2001 | WO2001045148A1 Method of achieving higher inversion layer mobility in silicon carbide semiconductor devices |
| 06/21/2001 | WO2001045147A1 Method of manufacturing a transistor |
| 06/21/2001 | WO2001045146A1 Superior silicon carbide integrated circuits and method of fabricating |
| 06/21/2001 | WO2001045144A1 A vertically configured chamber used for multiple processes |
| 06/21/2001 | WO2001045143A1 Device and method for treating substrates |
| 06/21/2001 | WO2001045141A2 Method and apparatus for smoothing thin conductive films by gas cluster ion beam |
| 06/21/2001 | WO2001045136A1 Method and system for the examination of specimen using a charged particle beam |
| 06/21/2001 | WO2001045135A2 Plasma reactor cooled ceiling with an array of thermally isolated plasma heated mini-gas distribution plates |
| 06/21/2001 | WO2001045134A2 Method and apparatus for producing uniform process rates |
| 06/21/2001 | WO2001045113A1 Method to provide a reduced constant e-field during erase of eeproms for reliability improvement |
| 06/21/2001 | WO2001044913A1 Interface device and information processing system |
| 06/21/2001 | WO2001044802A1 Method for the determination of gaseous chemical components in a process reactor for treating electrical components, in particular wafers |
| 06/21/2001 | WO2001044794A1 Detection of voids in semiconductor wafer processing |
| 06/21/2001 | WO2001044540A2 Method and device for monitoring etching chambers |
| 06/21/2001 | WO2001044402A1 Method of polishing or planarizing a substrate |
| 06/21/2001 | WO2001044396A1 Polishing compositions for noble metals |
| 06/21/2001 | WO2001044395A1 Polishing compositions for semiconductor substrates |
| 06/21/2001 | WO2001043938A1 Microreaction systems and molding methods |
| 06/21/2001 | WO2001043920A1 Method of manufacturing a polymer or polymer composite polishing pad |
| 06/21/2001 | WO2001009925B1 Apparatus and method for texture analysis on semiconductor wafers |
| 06/21/2001 | WO2000073531A3 Copper sputtering target assembly and method of making same |
| 06/21/2001 | WO1998005807A8 CaTiO3 INTERFACIAL TEMPLATE STRUCTURE ON SUPERCONDUCTOR |
| 06/21/2001 | US20010004765 Method of checking exposure patterns formed over photo-mask |
| 06/21/2001 | US20010004763 Layout and wiring system, wiring method for use in automatic layout and wiring system, and recording medium recording the wiring method |
| 06/21/2001 | US20010004762 Computer-aided design supporting system in which cells can be arranged independently |
| 06/21/2001 | US20010004651 Comprising an epoxy resin, a curing agent, and an inorganic filler in the form of porous silica having a specific surface area of 6 to 200 m2/g, a true specific gravity of 2.0 to 2.2, and a mean particle size of 2-50 micro m |
| 06/21/2001 | US20010004633 Post chemical-mechanical planarization (CMP) cleaning composition |