Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2001
06/20/2001EP1109208A2 Method for the formation of semiconductor layer
06/20/2001EP1109207A1 Sucking device for holding down a substrat
06/20/2001EP1109206A1 Apparatus and process for mounting of lead frames
06/20/2001EP1109205A1 Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate
06/20/2001EP1109204A2 Compact equipment
06/20/2001EP1109203A2 Dual substrate loadlock process equipment
06/20/2001EP1109202A2 Wafer processing chamber having separable upper and lower halves
06/20/2001EP1109201A2 Serial wafer handling mechanism
06/20/2001EP1109196A1 Diamond-like coated components in an ion implanter for reducing x-ray emissions
06/20/2001EP1109169A2 MRAM having semiconductor device integrated therein
06/20/2001EP1109168A2 Magnetic dual element with dual magnetic states and fabricating method thereof
06/20/2001EP1109133A2 CAD Data compressing method and apparatus thereof
06/20/2001EP1109066A1 Chemical amplification type negative-working resist composition for electron beams or x-rays
06/20/2001EP1109009A1 Image processor
06/20/2001EP1108979A2 Method and apparatus for substrate film thickness measurement and substrate processing
06/20/2001EP1108805A1 Method for fabricating a semiconductor structure having a stable crystalline interface with silicon
06/20/2001EP1108801A1 High temperature filter
06/20/2001EP1108770A2 Removable pressure-sensitive adhesive sheet
06/20/2001EP1108766A2 Adhesion method and electronic component
06/20/2001EP1108763A2 Method for making nanoporous silicone resins from alkylhydridosiloxane resins
06/20/2001EP1108677A1 Method of hermetic In Situ encapsulation of microsystems
06/20/2001EP1108663A1 Storage magazine for chip cartes
06/20/2001EP1108513A2 Apparatus and process for thermal treatment of substrate material
06/20/2001EP1108501A2 Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations
06/20/2001EP1108468A1 Thin film deposition apparatus
06/20/2001EP1108348A1 A flexible circuit with conductive vias and a method of making
06/20/2001EP1108267A1 Capacitors comprising roughened platinum layers, methods of forming roughened layers of platinum and methods of forming capacitors
06/20/2001EP1108266A2 Method for forming a copper film on a substrate
06/20/2001EP1108265A1 Plasma reactor with electrode arrangement for providing a grounding path for the plasma, and method of manufacturing the same
06/20/2001EP1108263A1 Elevated stationary uniformity ring
06/20/2001EP1108257A1 An mram cell requiring low switching field
06/20/2001EP1108237A1 Polymers having silicon-containing acetal or ketal functional groups
06/20/2001EP1108216A1 High resolution analytical probe station
06/20/2001EP1108208A1 Illumination module
06/20/2001EP1107853A1 Dual arm apparatus with co-axial drive shafts
06/20/2001EP1062468A4 Apparatus for packaging contaminant-sensitive articles and resulting package
06/20/2001EP0717762B1 Activated polishing compositions
06/20/2001EP0694211B1 A method for reducing the spacing between the horizontally-adjacent floating gates of a flash eprom array
06/20/2001EP0673548B1 Bipolar transistor
06/20/2001EP0616723B1 Process for fabricating layered superlattice materials
06/20/2001CN2435839Y Testing base for wafers in different specifications
06/20/2001CN1300527A Method of manufacturing method of ceramic multilayer board
06/20/2001CN1300526A Ceramic circuit board and method of manufacture thereof
06/20/2001CN1300521A Organic electroluminescence device and its manufacturing method
06/20/2001CN1300457A Protective circuit for electronic modules, especially deiver modules
06/20/2001CN1300444A Flash memory cell with self-aligned gates and fabrication process
06/20/2001CN1300328A Film deposition system
06/20/2001CN1300301A Reworkable thermosetting resin composition
06/20/2001CN1300237A Decompression tank
06/20/2001CN1300180A Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly
06/20/2001CN1300103A Semiconductor device, liquid crystal display device and mfg. method thereof
06/20/2001CN1300099A Semiconductor package structure
06/20/2001CN1300098A Deep turf mask capable of intensifying performance and reliability of buried channel P field effect transistor
06/20/2001CN1300097A Electronic-beam exposing method
06/20/2001CN1300096A Preparation of nanometer SnO2 crystal film compatible with planar silicon process
06/20/2001CN1300090A Single-piece ceramic electronic element and mfg. method, and ceramic paste and production method
06/20/2001CN1300088A Mfg. method and apparatus for laminated electronic element
06/20/2001CN1300077A MRAM with integrated semiconducter device
06/20/2001CN1299983A Semiconducter device with conductive layer and liquid crystal display device and production method thereof
06/20/2001CN1299852A Connection material
06/20/2001CN1299700A Gas-flow puritying system and method thereof
06/20/2001CN1067488C Carrier for semiconductor wafer and use of carrier
06/20/2001CN1067446C Superhigh vacuum chemical vapor phase deposition epitoxy system
06/19/2001US6249904 Method and apparatus for submicron IC design using edge fragment tagging to correct edge placement distortion
06/19/2001US6249900 Method of designing an LSI pattern to be formed on a specimen with a bent portion
06/19/2001US6249891 High speed test pattern evaluation apparatus
06/19/2001US6249618 Circuit architecture and method for switching sensor resolution
06/19/2001US6249597 Method of correcting mask pattern and mask, method of exposure, apparatus thereof, and photomask and semiconductor device using the same
06/19/2001US6249476 Semiconductor memory device suitable for mounting mixed with logic circuit, having short cycle time in reading operation
06/19/2001US6249472 Semiconductor memory device with antifuse
06/19/2001US6249468 Semiconductor memory device with switching element for isolating bit lines during testing
06/19/2001US6249454 Split-gate flash cell for virtual ground architecture
06/19/2001US6249452 Semiconductor device having offset twisted bit lines
06/19/2001US6249451 Data line connections with twisting scheme technical field
06/19/2001US6249385 Laser irradiation apparatus
06/19/2001US6249382 Illumination optical system and projection exposure apparatus using same
06/19/2001US6249342 Method and apparatus for handling and testing wafers
06/19/2001US6249330 Display device and manufacturing method
06/19/2001US6249326 Active matrix type LCD in which a pixel electrodes width along a scanning line is three times its data line side width
06/19/2001US6249185 Method of speeding power-up of an amplifier, and amplifier
06/19/2001US6249147 Method and apparatus for high speed on-chip signal propagation
06/19/2001US6249145 Level conversion circuit and semiconductor integrated circuit device employing the level conversion circuit
06/19/2001US6249140 Method of screening semiconductor laser device using temperature cycling and variable driving current
06/19/2001US6249136 Bottom side C4 bumps for integrated circuits
06/19/2001US6249134 Semiconductor integrated circuit device and testing method thereof
06/19/2001US6249131 Electronics package having a ball grid array which is electrically accessible
06/19/2001US6249117 Phosphosilicate glass layer containing phosphorus formed in the sio2 layer for providing the stabilized wafer by stabilizing an sio2 interface and containing oxygen ions.
06/19/2001US6249056 Low resistance interconnect for a semiconductor device and method of fabricating the same
06/19/2001US6249055 Self-encapsulated copper metallization
06/19/2001US6249054 Semiconductor memory device with a stacked capacitance structure
06/19/2001US6249053 Chip package and method for manufacturing the same
06/19/2001US6249052 Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configuration
06/19/2001US6249051 Composite bump flip chip bonding
06/19/2001US6249050 Encapsulated transfer molding of a semiconductor die with attached heat sink
06/19/2001US6249043 Resin-sealed type semiconductor device, and method of manufacturing the same
06/19/2001US6249040 Semiconductor device having a high-dielectric capacitor
06/19/2001US6249036 Stepper alignment mark formation with dual field oxide process
06/19/2001US6249035 LOCOS mask for suppression of narrow space field oxide thinning and oxide punch through effect
06/19/2001US6249031 High gain lateral PNP and NPN bipolar transistor and process compatible with CMOS for making BiCMOS circuits
06/19/2001US6249030 BI-CMOS integrated circuit