Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2001
06/14/2001US20010003658 Leaving the photoresist layer on the gate electrode after patterning it, then heating to reflow the photoresist to cover the side edges of the gate electrode; three-layer thin film is used as source, drain and pixel electrodes
06/14/2001US20010003657 Method for manufacturing a thin-film transistor
06/14/2001US20010003656 Electronic device assembly and a method of connecting electronic devices constituting the same
06/14/2001US20010003655 Which can correct position of an electron-beam based on an amount of position of the electron beam, while reflecting charge-up of a semiconductor wafer used, obtaining alignment accuracy in superposing
06/14/2001US20010003620 High purity, siliconized silicon carbide having high thermal shock resistance
06/14/2001US20010003607 Alternate steps of imp and sputtering process to improve sidewall coverage
06/14/2001US20010003572 Mini-environment control system and method
06/14/2001US20010003567 Article feeding apparatus
06/14/2001US20010003511 Voltage-level shifter and semiconductor memory using the same
06/14/2001US20010003501 Polypyrrole and/ or polythiophene
06/14/2001US20010003481 Process and equipment for recovering developer from photoresist development waste and reusing it
06/14/2001US20010003480 Apertures and illuminating apparatus including aperture openings dimensioned to compensate for directional critical dimension differences
06/14/2001US20010003477 Liquid crystal display apparatus and TFT panel
06/14/2001US20010003385 Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used therein
06/14/2001US20010003382 Semiconductor device comprising layered positional detection marks and manufacturing method therof
06/14/2001US20010003381 Method to locate particles of a predetermined species within a solid and resulting structures
06/14/2001US20010003379 Semiconductor device and method of fabricating the same
06/14/2001US20010003378 Semiconductor device and manufacturing method therefor
06/14/2001US20010003371 Unit type clip lead terminal, clip lead terminal connecting method, lead terminal connecting board, and method of producing board with lead terminals
06/14/2001US20010003368 Open drain input/output structure and manufacturing method thereof in semiconductor device
06/14/2001US20010003367 Trenched dmos device with low gate charges
06/14/2001US20010003366 Semiconductor device, nonvolatile semiconductor storage apparatus using the device, and manufacuture method of the device
06/14/2001US20010003365 Semiconductor device including a capacity element for analog circuit and manufacturing method of that
06/14/2001US20010003364 Semiconductor and fabrication method thereof
06/14/2001US20010003334 Ceramic heating jig
06/14/2001US20010003299 Liquid processing apparatus and liquid processing method
06/14/2001US20010003298 Comprising primary electrode chargeable to form plasma of the gas in the chamber, dielectric covering primary electrode, dielectric having surface adapted to receive substrate and having a conduit therethrough
06/14/2001US20010003296 Forming a projecting electrode by applying and hardening a thermosetting conductive adhesive on first connecting electrode, applying a hardenable conductive adhesive on projecting electrode, aligning components, hardening
06/14/2001US20010003287 Fluid control apparatus
06/14/2001US20010003272 Method for improving the rate of a plasma enhanced vacuum treatment
06/14/2001US20010003271 Processing apparatus with a chamber having therein a high-corrosion-resistant sprayed film
06/14/2001US20010003270 Rf powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition
06/14/2001US20010003269 Etch stop layer system
06/14/2001CA2394458A1 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
06/13/2001EP1107655A2 Low profile interconnect structure
06/13/2001EP1107654A1 Sheet for printed wiring board, method of forming via, resin sheet having filled via, printed wiring board and method of manufacturing the same
06/13/2001EP1107653A1 Discharge electrode, high-frequency plasma generator, method of power feeding, and method of manufacturing semiconductor device
06/13/2001EP1107332A2 Photoelectric conversion device
06/13/2001EP1107330A2 Modification of infrared reflectivity using silicon dioxide thin films derived from silsesquioxane resins
06/13/2001EP1107329A2 Magnetic tunnel junction device, magnetic memory adopting the same, magnetic memory cell and access method of the same
06/13/2001EP1107320A2 Sheet manufacturing method, sheet, sheet manufacturing apparatus, and solar cell
06/13/2001EP1107317A1 Memory device
06/13/2001EP1107313A2 On-chip test circuit to control the succession of exposure masks
06/13/2001EP1107309A1 Manufacturing process for non-volatile floating gate memory cells and control circuitry
06/13/2001EP1107308A1 Methods for fabricating a multilevel interconnection for an integrated circuit device utilizing a selective overlayer
06/13/2001EP1107307A1 Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package
06/13/2001EP1107306A1 Semiconductor package, semiconductor device, electronic device and production method for semiconductor package
06/13/2001EP1107305A2 Method for mounting a semiconductor device
06/13/2001EP1107304A2 Article comprising a dielectric material of Zr-Ge-Ti-O or Hf-Ge-Ti-O and method of making the same
06/13/2001EP1107303A2 Surface treatment anneal of silicon-oxy-carbide semiconductor surface layer
06/13/2001EP1107302A2 Method and apparatus for reducing fixed charges in a semiconductor device
06/13/2001EP1107301A2 Methods for cleaning substrate surfaces after etch operations
06/13/2001EP1107300A2 Preconditioning abrasive articles for use in chemical-mechanical polishing
06/13/2001EP1107299A2 Process for producing semiconductor devices
06/13/2001EP1107298A2 Solution containing metal component, method of and apparatus for forming thin metal film
06/13/2001EP1107297A1 Apparatus for manufacturing semiconductor device and method of manufacture thereof
06/13/2001EP1107296A2 Method of manufacturing a nitride system III-V compound layer and method of manufacturing a substrate
06/13/2001EP1107295A2 Composite member separating method, thin film manufacturing method, and composite member separating apparatus
06/13/2001EP1107294A2 Method for making diaphragm-based sensors and apparatus constructed therewith
06/13/2001EP1107292A1 Apparatus and process for controlling a mini-environment
06/13/2001EP1107291A2 Ceramic heating jig
06/13/2001EP1107290A2 Wafer scrubbing brush core
06/13/2001EP1107289A2 Planarization apparatus
06/13/2001EP1107288A2 Substrate processing system and method
06/13/2001EP1107282A2 Method and apparatus for semiconductor wafer process monitoring
06/13/2001EP1107258A1 Multibit MTJ stacked cell memory sensing method and apparatus
06/13/2001EP1107066A2 Lithographic apparatus with mask clamping apparatus
06/13/2001EP1107039A2 System for compensating direction and position variations of laser produced illumination
06/13/2001EP1107034A2 Device and method for supporting an optical element with reduced deformation
06/13/2001EP1107012A1 Visual inspection apparatus
06/13/2001EP1106994A2 Inspection apparatus and method
06/13/2001EP1106990A2 Method for measuring water concentration in ammonia
06/13/2001EP1106946A2 Supercritical drying method and supercritical drying apparatus
06/13/2001EP1106826A2 Flow rate control with a positive displacement liquid pump
06/13/2001EP1106715A1 Self aligning non contact shadow ring process kit
06/13/2001EP1106712A1 Method and apparatus of producing thin film of metal or metal compound
06/13/2001EP1106709A2 Pulsed-mode RF bias for side-wall coverage improvement
06/13/2001EP1106708A2 Two step AIN-PVD for improved film properties
06/13/2001EP1106663A1 Slurry for chemical mechanical polishing silicon dioxide
06/13/2001EP1106305A2 Chemical mechanical planarization system
06/13/2001EP1106040A1 Method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections
06/13/2001EP1105950A1 Laser repetition rate multiplier
06/13/2001EP1105925A1 Method for double-sided patterning of high temperature superconducting circuits
06/13/2001EP1105921A1 Process for mapping metal contaminant concentration on a silicon wafer surface
06/13/2001EP1105920A1 Pattern formation method using light-induced suppression of etching
06/13/2001EP1105919A1 A system and method for residue entrapment utilizing a polish and sacrificial fill for semiconductor fabrication
06/13/2001EP1105917A1 Elastomer bonded parts for plasma processes and method for manufacture and use thereof
06/13/2001EP1105908A1 Ion beam generation apparatus
06/13/2001EP1105890A1 Magnetoresistive element and the use thereof as storage element in a storage cell array
06/13/2001EP1105880A1 Method and apparatus for providing an embedded flash-eeprom technology
06/13/2001EP1105879A1 Mram array having a plurality of memory banks
06/13/2001EP1105878A2 Storage cell array and corresponding production method
06/13/2001EP1105875A1 On-chip word line voltage generation for dram embedded in logic process
06/13/2001EP1105780A1 Reaction force isolation system for a planar motor
06/13/2001EP1105778A1 Silicate-containing alkaline compositions for cleaning microelectronic substrates
06/13/2001EP1105743A1 Method for manufacturing a magnetic sensor device
06/13/2001EP1105742A1 Method for measuring two-dimensional potential distribution in cmos semiconductor components
06/13/2001EP1105703A1 Method and apparatus for monitoring plasma processing operations
06/13/2001EP1105605A1 Pod door to port door retention system
06/13/2001EP1105549A1 High throughput organometallic vapor phase epitaxy (omvpe) apparatus