Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2002
05/02/2002US20020050602 Semiconductor device having diode for input protection circuit of MOS structure device
05/02/2002US20020050601 Semiconductor light-emitting device and method of manufacturing the same
05/02/2002US20020050593 Light receiving device with built-in circuit
05/02/2002US20020050591 Apparatus and method for marking defective sections of laminate substrates
05/02/2002US20020050585 Magnetic field is applied to boron nitride powder increasing thermoconductivity; dielectrics
05/02/2002US20020050577 Device and method for detecting the drive state of a turbo pump in a tendetron accelerator of an ion implantation device
05/02/2002US20020050571 Long stroke mover for a stage assembly
05/02/2002US20020050565 Method and apparatus for processing a micro sample
05/02/2002US20020050507 Wire bonding apparatus
05/02/2002US20020050489 Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
05/02/2002US20020050483 Method of reducing water spotting and oxide growth on a semiconductor structure
05/02/2002US20020050465 Container
05/02/2002US20020050459 Forming insulating film above substrate, forming a to be filled region of interconnecting groove and hole in film, forming conductive film containing catalyst which accelerates electroless plating, forming second and third conductive films
05/02/2002US20020050452 Electrode semiconductor workpiece holder and processing methods
05/02/2002US20020050448 Electronic driver circuit for word lines in a memory matrix, and memory apparatus
05/02/2002US20020050443 Transferring apparatus for chips and method of use
05/02/2002US20020050406 Substrate for mounting semiconductor integrated circuit device
05/02/2002US20020050404 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof
05/02/2002US20020050398 Stress resistant land grid array (LGA) module and method of forming the same
05/02/2002US20020050397 Semiconductor module and method of manufacturing the same
05/02/2002US20020050381 Flexible printed circuit board, integrated circuit chip mounting flexible printed circuit board, display apparatus incorporating, integrated circuit chip mounted structure, and bonding method of integrated circuit chip mounting flexible printed circuit board
05/02/2002US20020050379 Integrated circuit package with bond wires at the corners of an integrated circuit
05/02/2002US20020050339 Heat sink and method for manufacturing same
05/02/2002US20020050333 Heat sink manufacturing device and manufacturing method
05/02/2002US20020050322 Holding unit, processing apparatus and holding method of substrates
05/02/2002US20020050320 Method of bonding a conductive adhesive and an electrode, and a bonded electrode obtained thereby
05/02/2002US20020050299 Modular fluid delivery apparatus
05/02/2002US20020050288 Solar cell and process of manufacturing the same
05/02/2002US20020050282 Method of removing ink from a semiconductor wafer
05/02/2002US20020050281 Used to carry out very clean and low-cost fluid processing on both the front and rear surfaces of an object to be processed without generating rubbing particles and without leakage of fluid; for semiconductor manufacturing process
05/02/2002US20020050279 Introducing a heated liquid including hydrogen fluoride onto the surface of a silicon wafer, diffusing ozone through the liquid,controlling the thickness of the liquid on the surface of the wafer, to maintain a desired level of etch uniformity
05/02/2002US20020050246 Full area temperature controlled electrostatic chuck and method of fabricating same
05/02/2002US20020050244 Device for liquid treatment of wafer-shaped articles
05/02/2002US20020050059 Chip feed device and method of feeding semiconductor chips
05/02/2002US20020050015 Cleaning apparatus for semiconductor wafer
05/02/2002EP1202450A2 Filtering device
05/02/2002EP1202355A2 Semiconductor light-emitting device and method of manufacturing the same
05/02/2002EP1202353A1 Mask programmed ROM and method of fabrication
05/02/2002EP1202352A2 High breakdown voltage semiconductor device
05/02/2002EP1202351A2 Protection circuit provided in semiconductor circuit
05/02/2002EP1202349A2 Semiconductor module and method of manufacturing the same
05/02/2002EP1202348A2 Semiconductor device and method of manufacturing same
05/02/2002EP1202347A2 Method of manufacturing a metal frame, metal frame and using the same
05/02/2002EP1202343A2 Semiconductor device and fabrication process therefor
05/02/2002EP1202341A1 Method for forming a CMOS device on a semiconductor
05/02/2002EP1202340A2 Borderless contact on bit line stud with etch stop layer and manufacturing method thereof
05/02/2002EP1202339A2 Semiconductor substrate, method of manufacturing the same, and bonded substrate stack surface shape measuring method
05/02/2002EP1202338A1 Susceptors for semiconductor-producing apparatuses
05/02/2002EP1202337A2 Probe pin for a probe card
05/02/2002EP1202336A1 Electric charge generating semiconductor substrate bump forming device, method of removing electric charge from electric charge generating semiconductor substrate, device for removing electric charge from electric charge generating semiconductor substrate, and electric charge generating semiconducto
05/02/2002EP1202335A2 Method of fabricating semiconductor side wall fin
05/02/2002EP1202334A1 Method of producing silicon epitaxial wafers
05/02/2002EP1202333A2 Storage capacitor, contact structure and method of manufactoring
05/02/2002EP1202332A2 Contact structure for a ferroelectric capacitor and method of manufactoring
05/02/2002EP1202331A2 Method for forming a structure using redeposition
05/02/2002EP1202330A2 De-coupled wafer lift and five axis adjustable heater lift system for CVD process chamber
05/02/2002EP1202329A2 Mask Restraining method and apparatus
05/02/2002EP1202328A2 Quartz glass wafer support jig and method for producing the same
05/02/2002EP1202327A1 Semiconductor device
05/02/2002EP1202326A1 Apparatus for liquid treatment of wafers-like objects
05/02/2002EP1202325A1 Arrangement for transporting a semiconductor wafer carrier
05/02/2002EP1202321A2 Vaporization of precursors at point of use
05/02/2002EP1202296A1 Out-of-plane microcoil using bonding wires and method for making
05/02/2002EP1202291A2 Illumination system with a grid unit
05/02/2002EP1202288A2 Improvements in or relating to fuse and antifuse link structures for integrated circuits
05/02/2002EP1202284A2 Prevention method of unwanted programming in a MRAM memory device
05/02/2002EP1202283A2 MRAM memory device
05/02/2002EP1202242A2 Light emitting device and method of driving the same
05/02/2002EP1202194A2 High-level synthesis method, high-level synthesis apparatus, method for producing logic circuit using the high-level synthesis method for logic circuit design, and recording medium
05/02/2002EP1202144A1 Method for controlling a process line in semiconductor device manufacturing
05/02/2002EP1202119A1 Method and apparatus for fast aerial image simulation
05/02/2002EP1202117A1 Exposure method and exposure apparatus
05/02/2002EP1202101A2 Variable illumination system
05/02/2002EP1202100A2 Illumination system with reduced heat load
05/02/2002EP1202069A2 Non-destructive inspection method
05/02/2002EP1201975A2 Shaft sealing apparatus
05/02/2002EP1201790A1 Seed layer
05/02/2002EP1201787A2 Plating catalysts
05/02/2002EP1201786A2 Seed layer deposition
05/02/2002EP1201785A1 Method of depositing organosilicate layers
05/02/2002EP1201784A1 Silicon-rich oxide deposition using HDP-CVD
05/02/2002EP1201724A1 Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part
05/02/2002EP1201622A2 A material with a low volume resistivity, aluminium nitride sintered body and article for manufacturing semiconductors
05/02/2002EP1201603A2 Method to remove metal and silicon oxide during gas-phase sacrificial oxide etch
05/02/2002EP1201368A2 Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereof
05/02/2002EP1201367A1 Dresser for polishing cloth and manufacturing method therefor
05/02/2002EP1201365A2 Frequency measuring device, polishing device using the same and eddy current sensor
05/02/2002EP1201108A1 A circuit singulation system and method
05/02/2002EP1201035A1 Capacitor array
05/02/2002EP1201033A1 Circuit configuration for supplying power to an integrated circuit via a pad
05/02/2002EP1200994A2 Punch-through diode and method of manufacturing the same
05/02/2002EP1200993A1 Double triggering mechanism for achieving faster turn-on
05/02/2002EP1200991A1 Semiconductor capacitor with diffusion barrier
05/02/2002EP1200990A2 Integrated circuit interconnect system
05/02/2002EP1200988A2 Method and apparatus for milling copper interconnects in a charged particle beam system
05/02/2002EP1200987A2 Method of preparing a semiconductor substrate for subsequent silicide formation
05/02/2002EP1200982A1 Method for monitoring a production process for preparing a substrate in semiconductor manufacturing
05/02/2002EP1200981A1 Gas distribution apparatus for semiconductor processing
05/02/2002EP1200980A1 Adaptive gas cluster ion beam for smoothing surfaces
05/02/2002EP1200979A1 Minimization of electron fogging in electron beam lithography