Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2002
05/07/2002US6383837 Method of manufacturing a multi-chip semiconductor device effective to improve alignment
05/07/2002US6383836 Diode and method for manufacturing the same
05/07/2002US6383831 Methods of forming thin-film transistor display devices
05/07/2002US6383826 Method for determining etch depth
05/07/2002US6383825 Method and system for testing semiconductor dice, semiconductor packages and semiconductor wafers
05/07/2002US6383824 Method of using scatterometry measurements to control deposition processes
05/07/2002US6383823 Probe for scanning probe microscope (SPM) and SPM device
05/07/2002US6383821 Semiconductor device and process
05/07/2002US6383724 Organic removal process
05/07/2002US6383723 Method to clean substrate and improve photoresist profile
05/07/2002US6383718 Photomask and pattern forming method employing the same
05/07/2002US6383709 Positive resist composition comprising N-(n-octylsulfonyloxy) succinimide
05/07/2002US6383708 Positive resist composition
05/07/2002US6383697 Lithographic imaging and printing, photoresists with mask, demagnification
05/07/2002US6383689 Fine resist pattern comprising plurality of opaque patterns and transparent opening pattern; uniform thickness; semiconductors
05/07/2002US6383659 Autopolymerizable epoxy resin or curable phenolic resin; semiconductor packaging; filler, curing catalyst, and thermoplastic resin
05/07/2002US6383606 Semiconductor wafer diaphragm
05/07/2002US6383574 Ion implantation method for fabricating magnetoresistive (MR) sensor element
05/07/2002US6383566 Reduction of tungsten- or molybdenum halide or organometallic compound; vapor deposition; glazings, mirrors, emissive screens
05/07/2002US6383555 Misted precursor deposition apparatus and method with improved mist and mist flow
05/07/2002US6383466 Method of dehydroxylating a hydroxylated material and method of making a mesoporous film
05/07/2002US6383414 Slurries containing 2-mercaptothiazole, 2-mercaptobenzothiazole, or benzothiazole
05/07/2002US6383410 Ammonium fluoride or an organic derivative of ammonium fluoride or polyammonium fluoride, ethylene glycol and an amine
05/07/2002US6383403 Dry etching method
05/07/2002US6383357 Three-dimensional metallic structure
05/07/2002US6383346 Method for forming thin films
05/07/2002US6383334 Method and apparatus for controlling the temperature of a gas distribution plate in a process reactor
05/07/2002US6383333 Protective member for inner surface of chamber and plasma processing apparatus
05/07/2002US6383332 For semiconductors
05/07/2002US6383331 Device for discharging two or more media with media nozzles
05/07/2002US6383330 Quartz wafer processing chamber
05/07/2002US6383327 Conductive pattern producing method
05/07/2002US6383304 Cleaning semiconductors; drying
05/07/2002US6383303 High volume fluid head
05/07/2002US6383302 Apparatus and method for manufacturing semiconductor device
05/07/2002US6383300 Heat treatment apparatus and cleaning method of the same
05/07/2002US6383299 Silicon oxide film, method of forming the silicon oxide film, and apparatus for depositing the silicon oxide film
05/07/2002US6383294 Coated film forming apparatus
05/07/2002US6383292 Semiconductor device encapsulators
05/07/2002US6383291 Process solution supplying apparatus
05/07/2002US6383289 Apparatus for liquid carbon dioxide systems
05/07/2002US6383288 Method of forming diamond film
05/07/2002US6383286 Method of making semiconductor super-atom and aggregate thereof
05/07/2002US6383240 Containing amphipathic compound; polishing semiconductors
05/07/2002US6383065 Catalytic reactive pad for metal CMP
05/07/2002US6383060 Method of polishing silicon wafer
05/07/2002US6383058 Adaptive endpoint detection for chemical mechanical polishing
05/07/2002US6382902 Method for controlling handling robot
05/07/2002US6382901 Wafer flat zone aligner
05/07/2002US6382900 Apparatus for conveyance of semiconductor chips
05/07/2002US6382896 Front-opening unified pod closing/opening control structure
05/07/2002US6382895 Substrate processing apparatus
05/07/2002US6382849 Developing method and developing apparatus
05/07/2002US6382609 Chuck table
05/07/2002US6382495 Chip junction nozzle
05/07/2002US6382419 Wafer container box
05/07/2002US6382413 Disk holder and disk storage device
05/07/2002US6382395 Method and system for package orientation checking for laser mark operations
05/07/2002US6382292 Method and apparatus for separating composite member using fluid
05/07/2002US6382249 Vacuum exhaust system
05/07/2002US6381873 Method for drying a polymer coating on a substrate
05/07/2002US6381872 Method for drying a semiconductor wafer, a mixture for drying, and a dryer
05/07/2002US6381838 BGA package and method of manufacturing the same
05/07/2002US6381796 Spinning washer for wafers
05/02/2002WO2002035903A2 Electronic component, component mounting equipment, and component mounting method
05/02/2002WO2002035897A1 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production
05/02/2002WO2002035610A1 Nonvolatile semiconductor storage and method for manufacturing the same
05/02/2002WO2002035609A1 Method for producing a gate oxide formed on a semiconductor substrate
05/02/2002WO2002035608A2 Implanted hidden interconnections in a semiconductor device for preventing reverse engineering
05/02/2002WO2002035606A1 Semiconductor device and its production method
05/02/2002WO2002035605A1 Method for forming contacts in integrated circuits
05/02/2002WO2002035604A1 Treated substrate transfer system in semiconductor treatment equipment
05/02/2002WO2002035603A1 Wafer prover device, and ceramic substrate used for wafer prover device
05/02/2002WO2002035602A1 Bump forming method and bump forming device
05/02/2002WO2002035601A1 Laser thermal process for fabricating field-effect transistors
05/02/2002WO2002035600A2 Method for producing a dmos transistor
05/02/2002WO2002035599A1 Production method for silicon wafer and silicon wafer
05/02/2002WO2002035598A1 Method and device for cleaning a semiconductor wafer
05/02/2002WO2002035597A2 Multilayer devices having frequency agile materials
05/02/2002WO2002035596A1 Highly selective ionic lithography method
05/02/2002WO2002035595A1 Flexible laser system for severing semiconductor wafers
05/02/2002WO2002035594A1 Method for manufacturing semiconductor device
05/02/2002WO2002035593A1 Wafer manufacturing method, polishing apparatus, and wafer
05/02/2002WO2002035592A1 Polishing device
05/02/2002WO2002035591A1 Method for applying a substrate
05/02/2002WO2002035590A1 Heat-treating device
05/02/2002WO2002035589A1 Method for shifting the bandgap energy of a quantum well layer
05/02/2002WO2002035588A1 Production method of semiconductor device and production system of semiconductor device
05/02/2002WO2002035587A1 Method of producing semiconductor device and processing conditions setting device
05/02/2002WO2002035586A2 Monitoring substrate processing using reflected radiation
05/02/2002WO2002035585A1 Apparatus and method to dice integrated circuits from a wafer using a pressurized jet
05/02/2002WO2002035584A1 Method for processing a wafer of integrated circuits
05/02/2002WO2002035583A1 Arrangement for transporting a semiconductor wafer carrier
05/02/2002WO2002035582A1 Treatment device for wafers
05/02/2002WO2002035559A2 Magnetic layer formed of multiple sub-element layers
05/02/2002WO2002035300A2 Method and apparatus for embedded process control framework in tool systems
05/02/2002WO2002035289A2 Method and materials for printing particle-enhanced electrical contacts
05/02/2002WO2002035273A1 Catadioptric system and exposure device having this system
05/02/2002WO2002035217A2 Methods for continuous embedded process monitoring and optical inspection of substrates using specular signature analysis
05/02/2002WO2002035195A1 Temperature measuring method, heat treating device and method, computer program, and radiation thermometer