Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2002
05/21/2002US6391116 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
05/21/2002US6391114 Vacuum processing apparatus
05/21/2002US6391113 Semiconductor wafer processing apparatus and method of controlling the same
05/21/2002US6391112 Heat-exchanging workholder for a vacuum unit
05/21/2002US6391111 Coating apparatus
05/21/2002US6391067 Baths for processing wafers, holding, driving and contacting with rotation
05/21/2002US6390908 Determining when to replace a retaining ring used in substrate polishing operations
05/21/2002US6390905 Workpiece carrier with adjustable pressure zones and barriers
05/21/2002US6390904 Retainers and non-abrasive liners used in chemical mechanical polishing
05/21/2002US6390903 Precise polishing apparatus and method
05/21/2002US6390897 Cleaning station integral with polishing machine for semiconductor wafers
05/21/2002US6390896 Method and device for cutting a multiplicity of disks from a hard brittle workpiece
05/21/2002US6390895 Wetting abrasive; prepolishing
05/21/2002US6390853 Laser wire bonding for wire embedded dielectrics to integrated circuits
05/21/2002US6390811 High-temperature and high-pressure treatment device
05/21/2002US6390767 Positioning assembly
05/21/2002US6390755 Exhaust device for use in a clean room, cleanroom, and method
05/21/2002US6390754 Wafer processing apparatus, method of operating the same and wafer detecting system
05/21/2002US6390753 System for loading, processing and unloading substrates arranged on a carrier
05/21/2002US6390677 Fluid bearings and vacuum chucks and methods for producing same
05/21/2002US6390448 Single shaft dual cradle vacuum slot valve
05/21/2002US6390394 Nozzle and adjust module
05/21/2002US6390356 Method of forming cylindrical bumps on a substrate for integrated circuits
05/21/2002US6390351 Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive balls
05/21/2002US6390271 Leadframe transport and method therefor
05/21/2002US6390182 Heat sink assembly
05/21/2002US6390145 Container and method for sealing the container
05/21/2002US6390111 Collapsible structures
05/21/2002US6390020 Dual face shower head magnetron, plasma generating apparatus and method of coating substrate
05/21/2002US6390019 Chamber having improved process monitoring window
05/21/2002US6390018 Microwave plasma treatment apparatus
05/21/2002US6389829 Temperature control system
05/21/2002US6389708 Tab and slot design optimized for blind alignment of components
05/21/2002US6389707 Wafer container having electrically conductive kinematic coupling groove to detect the presence of the wafer container on a support surface, the support surface, and method
05/21/2002US6389706 Wafer container having electrically conductive kinematic coupling groove, support surface with electrically conductive kinematic coupling pin, transportation system, and method
05/21/2002US6389702 Method and apparatus for motion control
05/21/2002US6389691 Methods for forming integrated redistribution routing conductors and solder bumps
05/21/2002US6389689 Method of fabricating semiconductor package
05/21/2002US6389688 Method and apparatus for chip placement
05/21/2002US6389687 Method of fabricating image sensor packages in an array
05/21/2002US6389680 Method of manufacturing electronic component
05/21/2002US6389677 Perimeter wafer lifting
05/21/2002CA2363437A1 Equipment for communication system and semiconductor integrated circuit device
05/21/2002CA2037490C Wet-etch process and composition
05/16/2002WO2002039797A1 A dielectric spacing layer
05/16/2002WO2002039796A1 Definable integrated passives for circuitry
05/16/2002WO2002039583A1 Electronic device, semiconductor device comprising such a device and method of manufacturing such a device
05/16/2002WO2002039507A1 Semiconductor device and method for fabricating the same
05/16/2002WO2002039502A1 Nonvolatile semiconductor storage device and production method therefor
05/16/2002WO2002039501A2 Method for producing trench capacitors
05/16/2002WO2002039500A2 Use of a barrier sputter reactor to remove an underlying barrier layer
05/16/2002WO2002039499A1 Method of transferring processed body and processing system for processed body
05/16/2002WO2002039498A2 Methods and systems for positioning substrates
05/16/2002WO2002039496A1 Method for manufacturing annealed wafer and annealed wafer
05/16/2002WO2002039495A1 Plasma processing device and method of assembling the plasma processing device
05/16/2002WO2002039494A1 Dry etching gas and method for dry etching
05/16/2002WO2002039493A1 Plasma processing device and exhaust ring
05/16/2002WO2002039492A1 Method for producing trench capacitors for large-scale integrated semiconductor memories
05/16/2002WO2002039490A2 A power distribution printed circuit board for a semiconductor processing system
05/16/2002WO2002039489A2 Method for removing etch residue resulting from a process for forming a via
05/16/2002WO2002039488A2 Method for producing an integrated circuit
05/16/2002WO2002039485A2 Platen for retaining polishing material
05/16/2002WO2002039483A2 Single metal programmability in a customizable integrated circuit device
05/16/2002WO2002039481A2 Device for detecting three-dimensional electromagnetic radiation and method for making same
05/16/2002WO2002039480A2 Ion beam deposition targets having a replaceable insert
05/16/2002WO2002039463A2 Methods and system for attaching substrates using solder structures
05/16/2002WO2002039455A2 Mram arrangement with selection transistors of large channel width
05/16/2002WO2002039454A2 Magnetoresistive memory (mram)
05/16/2002WO2002039188A1 Method for exposing a semiconductor wafer
05/16/2002WO2002039186A2 Photoacid generators in photoresist compositions for microlithography
05/16/2002WO2002039185A1 Optical recording materials
05/16/2002WO2002039184A1 Optical recording materials
05/16/2002WO2002039183A1 Optical recording materials
05/16/2002WO2002039182A1 Systems and methods for exposing substrate periphery
05/16/2002WO2002039131A2 Method for locating defects and measuring resistance in a test structure
05/16/2002WO2002039099A2 Measurement of surface defects
05/16/2002WO2002039066A1 Position measuring device and method for determining a position
05/16/2002WO2002038841A2 Atomic layer doping apparatus and method
05/16/2002WO2002038840A1 Method and device for controlling the surface temperatures of substrates in a chemical vapour deposition reactor
05/16/2002WO2002038839A1 Cvd reactor comprising a substrate holder rotatably mounted and driven by a gas flow
05/16/2002WO2002038838A1 Cvd reactor with graphite-foam insulated, tubular susceptor
05/16/2002WO2002038386A1 A process and an apparatus for the formation of patterns in films using temperature gradients
05/16/2002WO2002038335A1 Methods, apparatus and slurries for chemical mechanical planarization
05/16/2002WO2002025665A3 Non-volatile passive matrix and method for readout of the same
05/16/2002WO2002018100A3 Method and apparatus for measuring a polishing condition
05/16/2002WO2002017383A3 Flexure based translation stage
05/16/2002WO2002009149A3 Post deposition sputtering
05/16/2002WO2002005298A3 Semiconductor inductor and methods for making the same
05/16/2002WO2001099183A3 Method and apparatus for a direct buried strap for same level interconnections for semiconductor devices
05/16/2002WO2001099163A3 Multiplayer pillar arry capacitor structure for deep -sub-micron cmos
05/16/2002WO2001098755A3 Optical inspection method and apparatus with adaptive spatial filter
05/16/2002WO2001095369A3 Halo-free non-rectifying contact on chip with halo source/drain diffusion
05/16/2002WO2001088997A3 Trench-gate semiconductor device and method of making the same
05/16/2002WO2001084591A3 Pulsed rf power delivery for plasma processing
05/16/2002WO2001082368A3 Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module
05/16/2002WO2001082361A3 Method of forming an integrated circuit package at a wafer level
05/16/2002WO2001082359A3 Method of making a semiconductor device having a recessed insulating layer of varying thickness
05/16/2002WO2001079863A3 Method and apparatus for testing signal paths between an integrated circuit wafer and a wafer tester
05/16/2002WO2001078119A3 Multilayered capacitor structure with alternately connected concentric lines for deep submicron cmos
05/16/2002WO2001078110B1 Low dielectric constant organic dielectrics based on cage-like structures