| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/30/2002 | US20020063261 Semiconductor device and process for fabricating the same |
| 05/30/2002 | US20020063259 A power mosfet having laterally three-layered structure formed among element isolation regions |
| 05/30/2002 | US20020063258 Gallium nitride-type semiconductor device |
| 05/30/2002 | US20020063255 Thin-film transistor and method of manufacturing thin-film transistor |
| 05/30/2002 | US20020063254 Thin-film transistor and method for making the same |
| 05/30/2002 | US20020063253 Method for manufacturing thin film transistor array panel for liquid crystal display |
| 05/30/2002 | US20020063252 Simulation circuit for MOS transistor, simulation testing method, netlist of simulation circuit and storage medium storing same |
| 05/30/2002 | US20020063221 Gap adjustment apparatus and gap adjustment method for adjusting gap between two objects |
| 05/30/2002 | US20020063212 Methods utilizing scanning probe microscope tips and products therefor or produced thereby |
| 05/30/2002 | US20020063169 Wafer spray configurations for a single wafer processing apparatus |
| 05/30/2002 | US20020063144 Wire bonding apparatus |
| 05/30/2002 | US20020063123 Heat treating method and heat treating apparatus |
| 05/30/2002 | US20020063121 Heating device, liquid processing apparatus using the heating device and method of detecting failure thereof |
| 05/30/2002 | US20020063120 Heaters |
| 05/30/2002 | US20020063119 Heat treatment apparatus and method |
| 05/30/2002 | US20020063115 Vertical wafer sawing apparatus |
| 05/30/2002 | US20020063110 Etching of hard masks |
| 05/30/2002 | US20020063107 Methods of fabricating microelectromechanical and microfluidic devices |
| 05/30/2002 | US20020063097 For forming an interconnection by embedding copper in fine interconnection groove defined in surface of semiconductor substrate through copper sulfate plating |
| 05/30/2002 | US20020063096 For semiconductor integrated circuit wafer cleaning fluid in a wafer cleaning |
| 05/30/2002 | US20020063084 Apparatus and method for reducing contamination in a wafer transfer chamber |
| 05/30/2002 | US20020063080 Containment device for retaining semiconductor wafers |
| 05/30/2002 | US20020063062 Depositing a copper seed layer over dielectric layer and into etched features of dielectric layer having a barrier layer; treating copper seed layer to remove oxidized layer from over copper seed layer; electroplating copper fill layer |
| 05/30/2002 | US20020062976 Conductor strip arrangement for a molded electronic component and process for molding |
| 05/30/2002 | US20020062971 Ultra-thin-film package |
| 05/30/2002 | US20020062954 Temperature control system for a workpiece chuck |
| 05/30/2002 | US20020062946 Heat radiation fin using a carbon fiber reinforced resin as heat radiation plates standing on a substrate |
| 05/30/2002 | US20020062923 Methods for reducing void formation upon curing of adhesive formulations and compositions useful therefor |
| 05/30/2002 | US20020062921 Method for applying a substrate |
| 05/30/2002 | US20020062918 Adhesives and electric devices |
| 05/30/2002 | US20020062916 Method and apparatus for processing semiconductor pellets |
| 05/30/2002 | US20020062904 To protect chip component within ceramic main body, first and second sealing are carried out between a metal case and ceramic main body so as to prevent contamination, toimprove shielding effect against external electromagnetic fields |
| 05/30/2002 | US20020062848 For cleaning substrates, for use in semiconductor manufacturing |
| 05/30/2002 | US20020062845 Semiconductor manufacturing system and method for cleaning the same |
| 05/30/2002 | US20020062843 Cleaning and handling methods of electronic component and cleaning apparatus thereof |
| 05/30/2002 | US20020062842 System for cleaning a semiconductor wafer |
| 05/30/2002 | US20020062841 Cleaning wafer in first tank by first solution which comprises a base or an acid; and cleaning wafer in tank containing water and ozone |
| 05/30/2002 | US20020062840 Assisted rinsing in a single wafer cleaning process |
| 05/30/2002 | US20020062839 Method and apparatus for frontside and backside wet processing of a wafer |
| 05/30/2002 | US20020062837 Cleaning method for vapor phase deposition apparatus, and vapor phase deposition apparatus |
| 05/30/2002 | US20020062792 Wafer support device and reactor system for epitaxial layer growth |
| 05/30/2002 | US20020062790 Processing apparatus and processing system |
| 05/30/2002 | US20020062701 Method for intelligent sampling of particulates in exhaust lines |
| 05/30/2002 | US20020062633 Recovery of iron value and concentration of zinc for use as a feed |
| 05/30/2002 | US20020062556 Method for direct chip attach by solder bumps and an underfill layer |
| 05/30/2002 | US20020062552 Multilayered ceramic substrate and production method therefor |
| 05/30/2002 | US20020062549 Optimized metal fuse process |
| 05/29/2002 | EP1209750A2 Npn-heterojunction bipolar transistor including an antimonide base formed on semi-insulating indium phosphide substrate |
| 05/29/2002 | EP1209749A1 Semiconductor device and method of manufacture thereof |
| 05/29/2002 | EP1209748A1 TFT display matrix having pixel electrodes formed simultaneously with the TFT channel |
| 05/29/2002 | EP1209745A2 Vertical MOS semiconductor device |
| 05/29/2002 | EP1209743A2 Leadframe for a molded electronic device and molding process |
| 05/29/2002 | EP1209740A2 Equipment for communication system and semiconductor integrated circuit device |
| 05/29/2002 | EP1209739A2 Method for fabricating intermetal dielectric structures including air-gaps between metal leads |
| 05/29/2002 | EP1209738A2 Method for fabricating an air gap shallow trench isolation (STI) structure |
| 05/29/2002 | EP1209736A2 Semiconductor device and method of fabricating semiconductor device |
| 05/29/2002 | EP1209735A2 Semiconductor device and production process thereof |
| 05/29/2002 | EP1209734A2 Multilayered ceramic substrate and production method therefor |
| 05/29/2002 | EP1209733A1 Self-aligned damascene process for MOSFET gate and raised source/drain |
| 05/29/2002 | EP1209732A2 Method to form an elevated S/D CMOS device by contacting S/D through a contact hole in the oxide |
| 05/29/2002 | EP1209731A1 Polishing composition and polishing method employing it |
| 05/29/2002 | EP1209730A2 High temperature electrode and barrier structure for FRAM and DRAM applications |
| 05/29/2002 | EP1209729A1 Multilayered body, method for fabricating multilayered body, and semiconductor device |
| 05/29/2002 | EP1209728A2 Method of depositing organosilicate layers |
| 05/29/2002 | EP1209727A1 Process for polishing the surface of a silicon wafer |
| 05/29/2002 | EP1209726A2 Semiconductor device using a polysilicon thin film and method for fabrication thereof |
| 05/29/2002 | EP1209725A2 High performance system-on-chip using post passivation process |
| 05/29/2002 | EP1209724A2 Pickup apparatus for semiconductor chips |
| 05/29/2002 | EP1209723A1 A wafer table for die bonding apparatus |
| 05/29/2002 | EP1209721A2 Inductive type plasma processing chamber |
| 05/29/2002 | EP1209695A1 Selective metallisation of nucleic acids via metal nanoparticles produced in-situ |
| 05/29/2002 | EP1209528A1 Photoresist composition |
| 05/29/2002 | EP1209523A2 Composition of positive photosensitive resin precursor, and display device made thereof |
| 05/29/2002 | EP1209502A2 Method for the dynamic adjustment of the position of an element in an optical system |
| 05/29/2002 | EP1209501A2 Apparatus for mounting an optical element |
| 05/29/2002 | EP1209500A2 Arrangement for mounting an optical element |
| 05/29/2002 | EP1209259A2 Low defect density, self-interstitial dominated silicon |
| 05/29/2002 | EP1209258A2 Low defect density silicon |
| 05/29/2002 | EP1209251A2 Temperature control system for wafer |
| 05/29/2002 | EP1209250A1 Apparatus for cleaning a semiconductor process chamber |
| 05/29/2002 | EP1209249A2 Semiconductor manufacturing system and method for cleaning the same |
| 05/29/2002 | EP1209211A1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 05/29/2002 | EP1208627A1 Circuits for dynamic turn off of nmos output drivers during eos/esd stress |
| 05/29/2002 | EP1208612A1 Method for forming a patterned semiconductor film |
| 05/29/2002 | EP1208608A1 Method for the production of a semiconductor device |
| 05/29/2002 | EP1208607A1 Passivation of gan based fets |
| 05/29/2002 | EP1208604A1 Semiconductor diode and method for producing the same |
| 05/29/2002 | EP1208601A1 Unipolar field-effect transistor |
| 05/29/2002 | EP1208597A2 One-time programmable anti-fuse element and method |
| 05/29/2002 | EP1208595A2 Interconnect assemblies and methods |
| 05/29/2002 | EP1208594A2 Trench-diffusion corner rounding in a shallow-trench (sti) process |
| 05/29/2002 | EP1208593A1 Method for treating substrates for microelectronics and substrates obtained by said method |
| 05/29/2002 | EP1208592A1 Method and apparatus for run-to-run controlling of overlay registration |
| 05/29/2002 | EP1208591A1 Method and apparatus for characterizing a semiconductor device |
| 05/29/2002 | EP1208590A1 Manufacture of semiconductor material and devices using that material |
| 05/29/2002 | EP1208589A1 Method for treating substrates for microelectronics and substrates obtained according to said method |
| 05/29/2002 | EP1208588A1 Sidewall polymer forming gas additives for etching processes |
| 05/29/2002 | EP1208587A1 Wafer holder assembly |
| 05/29/2002 | EP1208586A1 Device for treating substrates |
| 05/29/2002 | EP1208585A1 System for controlling the temperature of a reflective substrate during rapid heating |