Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2002
05/28/2002US6395627 Semiconductor device a burried wiring structure and process for fabricating the same
05/28/2002US6395626 Method of forming bonding projecting electrodes
05/28/2002US6395624 Method for forming implants in semiconductor fabrication
05/28/2002US6395623 Semiconductor processing methods of forming a contact opening to a conductive line and methods of forming substrate active area source/drain regions
05/28/2002US6395622 Manufacturing process of semiconductor devices
05/28/2002US6395621 Forming thin oxide layer on semiconductor substrate; depositing amorphous silicon or polysilicon layer; forming epitaxial semiconductor layer of crystallization amorphous silicon layer or the polysilicon layer
05/28/2002US6395620 Method for forming a planar surface over low density field areas on a semiconductor wafer
05/28/2002US6395619 Process for fabricating a semiconductor device
05/28/2002US6395618 Method for manufacturing integrated structures including removing a sacrificial region
05/28/2002US6395617 Method of manufacturing semiconductor device
05/28/2002US6395616 Process and apparatus for revealing an alignment mark on an integrated circuit wafer
05/28/2002US6395615 Selective silicon formation for semiconductor devices
05/28/2002US6395614 Methods of forming materials comprising tungsten and nitrogen, and methods of forming capacitors
05/28/2002US6395613 Semiconductor processing methods of forming a plurality of capacitors on a substrate, bit line contacts and method of forming bit line contacts
05/28/2002US6395612 Semiconductor device and method of manufacturing the same
05/28/2002US6395611 Inductor or low loss interconnect and a method of manufacturing an inductor or low loss interconnect in an integrated circuit
05/28/2002US6395610 Method of making bipolar transistor semiconductor device including graded, grown, high quality oxide layer
05/28/2002US6395608 Heterojunction bipolar transistor and its fabrication method
05/28/2002US6395607 Integrated circuit fabrication method for self-aligned copper diffusion barrier
05/28/2002US6395606 MOSFET with metal in gate for reduced gate resistance
05/28/2002US6395604 Method of fabricating semiconductor device
05/28/2002US6395603 Multilayer; forming dielectric; patterning
05/28/2002US6395602 Method of forming a capacitor
05/28/2002US6395601 Method for forming a lower electrode for use in a semiconductor device
05/28/2002US6395600 Method of forming a contact structure and a container capacitor structure
05/28/2002US6395599 Method for fabricating semiconductor storage device
05/28/2002US6395598 Semiconductor device and method for fabricating the same
05/28/2002US6395597 Trench DRAM cell with vertical device and buried word lines
05/28/2002US6395596 Method of fabricating a MOS transistor in an embedded memory
05/28/2002US6395595 Multi-layer tunneling device with a graded stoichiometry insulating layer
05/28/2002US6395594 Method for simultaneously forming a storage-capacitor electrode and interconnect
05/28/2002US6395593 Method of manufacturing high side and low side guard rings for lowest parasitic performance in an H-bridge configuration
05/28/2002US6395592 Methods for fabricating scalable non-volatile semiconductor memory device with double-sides erase cathodes
05/28/2002US6395591 Selective substrate implant process for decoupling analog and digital grounds
05/28/2002US6395590 Capacitor plate formation in a mixed analog-nonvolatile memory device
05/28/2002US6395589 Fabrication of fully depleted field effect transistor with high-K gate dielectric in SOI technology
05/28/2002US6395588 Forming channel in semiconductor substrate; carrier supplying layers; gallium-arsenide layer; silicon nitride layer
05/28/2002US6395587 Fully amorphized source/drain for leaky junctions
05/28/2002US6395586 Method for fabricating high aperture ratio TFT's and devices formed
05/28/2002US6395585 Method for housing sensors in a package
05/28/2002US6395581 BGA semiconductor package improving solder joint reliability and fabrication method thereof
05/28/2002US6395579 Encapsulating integrated circuits (ic's) by defining an encapsulation chamber about an ic die; filling the chamber with encapsulant; and controlling overflow of encapsulant by providing a collection cavity proximate to said chamber
05/28/2002US6395578 Semiconductor package and method for fabricating the same
05/28/2002US6395577 Photodetecting device and method of manufacturing the same
05/28/2002US6395571 Method for fabricating polysilicon TFT
05/28/2002US6395569 Method for characterization of LDMOS devices at the die reference plane
05/28/2002US6395568 Method and apparatus for achieving bond pad crater sensing and ESD protection integrated circuit products
05/28/2002US6395566 Method of wire-bonding a repair die in a multi-chip module using a repair solution generated during testing of the module
05/28/2002US6395563 Device for manufacturing semiconductor device and method of manufacturing the same
05/28/2002US6395457 Method for manufacturing a semiconductor device
05/28/2002US6395456 Semiconductor device achieving higher integration, method of manufacturing thereof, and method of forming resist pattern used therefor
05/28/2002US6395455 Low thermal distortion Extreme-UV lithography reticle and method
05/28/2002US6395454 Integrated electrical circuit with passivation layer
05/28/2002US6395453 Using an a,b unsaturated ketone
05/28/2002US6395451 Photoresist composition containing photo base generator with photo acid generator
05/28/2002US6395450 Positive working photoresist composition
05/28/2002US6395434 Phase shift mask and phase shift mask blank
05/28/2002US6395432 Forming semiconductor using mask; detection radiation intensity profile
05/28/2002US6395397 Submicrolithography, e.g., an argon fluoride (arf) light source; crosslinked acrylic tetramer of high absorbance at specific wavelengths based on a 4-(hydroxyphenoxy)alkyl-carbonyloxy-alkyl(-hydroxy) acrylic ester
05/28/2002US6395391 Multilayer; metal substrate, adhesive layers
05/28/2002US6395374 Method of making microwave, multifunction modules using fluoropolymer composite substrates
05/28/2002US6395363 Sloped substrate support
05/28/2002US6395337 Substrate with ceramic coating for camber modification and method for making
05/28/2002US6395334 Using motor
05/28/2002US6395240 Electrolytic cell
05/28/2002US6395194 Slurry of abrasive, bromide, bromate, organic acid, and bromine-chloride complex
05/28/2002US6395192 Method and apparatus for removing native oxide layers from silicon wafers
05/28/2002US6395164 Copper seed layer repair technique using electroless touch-up
05/28/2002US6395157 Method and apparatus for sputter etch conditioning a ceramic body
05/28/2002US6395152 Methods and apparatus for electropolishing metal interconnections on semiconductor devices
05/28/2002US6395150 High density plasma (hdp) chemical vapor deposition (cvd); gas mixture of silicon-containing and oxygen-containing components and replacing argon with helium so the sidewall sputtering and redeposition effect is greatly reduced
05/28/2002US6395130 Hydrophobic optical endpoint light pipes for chemical mechanical polishing
05/28/2002US6395129 Process to decapsulate a FBGA package
05/28/2002US6395128 RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition
05/28/2002US6395118 Method for manufacturing ceramic substrate and non-fired ceramic substrate
05/28/2002US6395101 Single semiconductor wafer processor
05/28/2002US6395097 Cleaning cavities of electronics, solvents baths, coupling, immersion and drawing a solvent
05/28/2002US6395095 Process apparatus and method for improved plasma processing of a substrate
05/28/2002US6395094 Process system with transfer unit for object to be processed
05/28/2002US6395092 Apparatus for depositing high deposition rate halogen-doped silicon oxide layer
05/28/2002US6395086 Shield for wafer station
05/28/2002US6395085 Purity silicon wafer for use in advanced semiconductor devices
05/28/2002US6394888 Abrasive tools for grinding electronic components
05/28/2002US6394797 Substrate temperature control system and method for controlling temperature of substrate
05/28/2002US6394733 Substrate body transfer apparatus
05/28/2002US6394670 Parts maintenance managing system
05/28/2002US6394638 Trench isolation for active areas and first level conductors
05/28/2002US6394523 Portable enclosure for semiconductor processing
05/28/2002US6394440 Dual orientation leveling platform for semiconductor apparatus
05/28/2002US6394334 Method and apparatus for forming solder bumps
05/28/2002US6394281 Hermetic sealing
05/28/2002US6394158 Method and device for thermally bonding connecting surfaces of two substrates
05/28/2002US6394138 Manifold system of removable components for distribution of fluids
05/28/2002US6394119 Method for conserving a resource by flow interruption
05/28/2002US6394114 Method for stripping copper in damascene interconnects
05/28/2002US6394110 Substrate processing apparatus and substrate processing method
05/28/2002US6394109 Method and apparatus for removing carbon contamination in a sub-atmospheric charged particle beam lithography system
05/28/2002US6394104 Spinning on glass; prevention deposits; dry plasma cleaning
05/28/2002US6394026 Low contamination high density plasma etch chambers and methods for making the same
05/28/2002US6394023 Process kit parts and method for using same