| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/06/2002 | US20020066775 Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
| 06/06/2002 | US20020066773 Wire bonding apparatus and wire bonding method |
| 06/06/2002 | US20020066767 Bonding apparatus and bonding tool for component |
| 06/06/2002 | US20020066765 Die bonder and/or wire bonder with a device for holding down a substrate |
| 06/06/2002 | US20020066727 Chuck plate of ashing equipment for fabricating semiconductor devices and chuck assembly comprising the same |
| 06/06/2002 | US20020066726 Wafer chuck having thermal plate with interleaved heating and cooling elements, interchangeable top surface assemblies and hard coated layer surfaces |
| 06/06/2002 | US20020066725 Semiconductor wafer baking apparatus |
| 06/06/2002 | US20020066720 Fabrication method of erbium-doped silicon nano-size dots |
| 06/06/2002 | US20020066717 Apparatus for providing ozonated process fluid and methods for using same |
| 06/06/2002 | US20020066694 Tray for storing semiconductor chips |
| 06/06/2002 | US20020066693 Coded tray for holding packaged semiconductor devices |
| 06/06/2002 | US20020066692 SMIF container including an electrostatic dissipative reticle support structure |
| 06/06/2002 | US20020066671 Seed layer deposition |
| 06/06/2002 | US20020066669 Facing-targets-type sputtering apparatus and method |
| 06/06/2002 | US20020066668 Sputter depositing a thin film of nitinol metal material onto the substrate comprising silicon dioxide over silicon |
| 06/06/2002 | US20020066665 Cup - type plating apparatus |
| 06/06/2002 | US20020066664 Method and apparatus for supplying electricity uniformly to a workpiece |
| 06/06/2002 | US20020066593 Method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed with the via |
| 06/06/2002 | US20020066584 Electric terminal for an electronic device |
| 06/06/2002 | US20020066583 Electron device and semiconductor device |
| 06/06/2002 | US20020066537 Plasma reactor |
| 06/06/2002 | US20020066536 Plasma processing apparatus |
| 06/06/2002 | US20020066535 Exhaust system for treating process gas effluent |
| 06/06/2002 | US20020066534 Process for fabricating films of uniform properties on semiconductor devices |
| 06/06/2002 | US20020066532 Corrosion-resistant protective coating for an apparatus and method for processing a substrate |
| 06/06/2002 | US20020066531 Manufactured by charging to heated dryer surface at same time but from separate sources organic polymer having amine groups in backbone and sufficient amount of zirconium compound having valence of plus four to crosslink polymer to fibrous web |
| 06/06/2002 | US20020066530 Method and apparatus for forming cover tape of tape feeder |
| 06/06/2002 | US20020066525 Film transfer method |
| 06/06/2002 | US20020066524 Piezoelectric film type actuator, liquid discharge head, and method of manufacturing the same |
| 06/06/2002 | US20020066523 Attaching devices using polymers |
| 06/06/2002 | US20020066475 Chuck for holding wafer |
| 06/06/2002 | US20020066472 Tray comprises grasping grooves formed in band-shaped peripheral wall surrounding wafers; semiconductors; automatic |
| 06/06/2002 | US20020066471 Reactor for processing a workpiece using sonic energy |
| 06/06/2002 | US20020066468 Distributor with a slot matrix formed close together near the ends of the brush |
| 06/06/2002 | US20020066465 Cleaning method |
| 06/06/2002 | US20020066464 Gas/liquid interface moves across the wafer surface while the bath of heated aqueous solution is energized with sonic energy in the presence of an ozone environment |
| 06/06/2002 | US20020066463 Ultrasonic cleaner tank that the plane of the reticle membrane is oriented perpendicularly to the propagation direction of the waves from the transducer; stencil used in charged-particle-beam microlithography |
| 06/06/2002 | US20020066412 Wafer carrier and semiconductor apparatus for processing a semiconductor substrate |
| 06/06/2002 | US20020066411 Method and apparatus for improved temperature control in atomic layer deposition |
| 06/06/2002 | US20020066410 Pressurized liquid delivery module |
| 06/06/2002 | US20020066408 Domed wafer reactor vessel window with reduced stress at atmospheric and above atmospheric pressures |
| 06/06/2002 | US20020066403 Growing areas using a mask patterned on a substrate surface and growing a nitride in the growing areas, while forming facet structures |
| 06/06/2002 | US20020066402 Method and device for producing optical fluoride crystals |
| 06/06/2002 | US20020066330 Double arm substrate transport unit |
| 06/06/2002 | US20020066234 Acidic slurry of an oxidizer, deionized water, a corrosion inhibitor and a surfactant |
| 06/06/2002 | US20020066181 Semiconductor device and manufacturing method thereof |
| 06/06/2002 | US20020066175 Method of manufacturing inductor |
| 06/06/2002 | DE10151724A1 Verfahren und Vorrichtung zum Korrigieren eines Musterfilms auf einem Halbleitersubstrat Method and apparatus for correcting a pattern film on a semiconductor substrate |
| 06/06/2002 | DE10151127A1 Defect detection method for semiconductor device manufacture, involves estimating similarity between the conductive pad groups based on the secondary electron emission after accumulation of electrons and holes in pads |
| 06/06/2002 | DE10151125A1 Anschlussstruktur und zugehöriges Herstellungsverfahren sowie die Anschlussstruktur verwendende Prüfanschlussanordnung Terminal structure and manufacturing method thereof, and the connection structure Prüfanschlussanordnung use |
| 06/06/2002 | DE10143938A1 Polishing machine for semiconductor wafers includes two-chamber carrier system with membrane and openings in correspondence |
| 06/06/2002 | DE10143173A1 Wafer probe has contact finger array with impedance matching network suitable for wide band |
| 06/06/2002 | DE10134499A1 Halbleiterspeicherelement mit einem mit einer Kondensatorelektrode verbundenen Anschluß und Verfahren zur Herstellung desselben Of the same semiconductor memory element having a capacitor electrode connected to a terminal and method for producing |
| 06/06/2002 | DE10133663A1 Process for removing a photoresist used in the production of semiconductor devices comprises treating the substrate with a removal agent based on fluorine, washing the substrate with water, drying, and repeating the process at least twice |
| 06/06/2002 | DE10129263A1 Non-volatile ferroelectric memory has pulse width generating unit for varying width of reproduction pulse and outputting varied width to word line driver to identify defective cell |
| 06/06/2002 | DE10121188A1 Verfahren zum Entfernen eines restlichen Metall enthaltenden Polymermaterials und von ionenimplantiertem Photoresistmaterial in einem stromabwärtigen atmosphärischen Plasmabearbeitungssystem A method of removing a residual polymeric material containing metal and ion-implanted photoresist material in a downstream atmospheric plasma processing system |
| 06/06/2002 | DE10117777A1 Verfahren zum Herstellen eines Mehrschichtsubstrats hoher Dichte A method of manufacturing a high-density multi-layer substrate |
| 06/06/2002 | DE10113497A1 Production of an integrated circuit used in the semiconductor industry comprises preparing a circuit substrate, forming bumps on the substrate, and providing metallized strips |
| 06/06/2002 | DE10060343A1 Polierslurry für das chemisch-mechanische Polieren von Metall- und Dielektrikastrukturen Polishing slurry for chemical mechanical polishing of metal and dielectric structures |
| 06/06/2002 | DE10059935A1 Dicht gepackte Halbleiterstruktur und Verfahren zum Herstellen einer solchen Densely packed semiconductor structure and method of making such a |
| 06/06/2002 | DE10059765A1 Assembly comprising component mounted on substrate and enclosing intermediate layer, has connecting structure containing aluminum |
| 06/06/2002 | DE10058948A1 Halbleiterschaltungsanordnung sowie dazugehöriges Herstellungsverfahren Semiconductor circuitry and belonging to manufacturing process |
| 06/06/2002 | DE10058782A1 Method for producing a capacitor structure for a memory device fits multiple capacitors on a carrier like a semiconductor substrate with a common contact area. |
| 06/06/2002 | DE10058305A1 Verfahren zur Oberflächenpolitur von Siliciumscheiben A method for surface polishing of silicon wafers |
| 06/06/2002 | DE10058031A1 Verfahren zur Bildung leicht dotierter Gebiete in einem Halbleiterbauelement A method of forming lightly doped regions in a semiconductor device |
| 06/06/2002 | DE10057806A1 Ferro-electric memory arrangement and method for it's manufacture forms contact plugs to top capacitor electrodes from above |
| 06/06/2002 | DE10056544A1 Verfahren und Vorrichtung zum Be- und Entladen von Halbleiterwafern Method and apparatus for loading and unloading of semiconductor wafers, |
| 06/06/2002 | DE10044199A1 Teilchenoptische Komponente und System mit Teilchenoptischer Komponente A particle component and system with particle-component |
| 06/06/2002 | CA2728973A1 A bifacial solar cell |
| 06/06/2002 | CA2727641A1 A semiconductor wafer |
| 06/06/2002 | CA2430377A1 Abrasive article having a window system for polishing wafers, and methods |
| 06/06/2002 | CA2427232A1 Self-aligned non-volatile memory cell |
| 06/06/2002 | CA2427222A1 Field effect transistors and materials and methods for their manufacture |
| 06/05/2002 | EP1211912A1 Hot plate unit |
| 06/05/2002 | EP1211809A1 Protection circuit for field effect transistor |
| 06/05/2002 | EP1211736A2 A semiconductor light-emitting element |
| 06/05/2002 | EP1211734A1 Vertical semiconductor device and method for producing the same |
| 06/05/2002 | EP1211733A1 Semiconductor device |
| 06/05/2002 | EP1211731A2 A symmetric architecture for memory cells having widely spread metal bit lines |
| 06/05/2002 | EP1211729A2 Complementary transistors having respective gates formed from a metal and a corresponding metal-silicide |
| 06/05/2002 | EP1211728A2 Semiconductor device and method of manufacturing the same |
| 06/05/2002 | EP1211727A2 Semiconductor device having shallow trench isolation structure and manufacturing method thereof |
| 06/05/2002 | EP1211725A1 Electrostatic chuck |
| 06/05/2002 | EP1211724A2 Process for automatically monitoring the manufacture of integrated circuits depending on the number of process steps performed, associated units and associated program |
| 06/05/2002 | EP1211723A2 Optimized metal fuse process in semiconductor device |
| 06/05/2002 | EP1211722A1 Manufacturing method of electronic device package |
| 06/05/2002 | EP1211721A1 Improved electronic device package and corresponding manufacturing method |
| 06/05/2002 | EP1211720A2 Bump forming method and bump forming apparatus |
| 06/05/2002 | EP1211719A1 Polishing slurry for the chemical mechanical polishing of metal and dielectric structures |
| 06/05/2002 | EP1211718A2 A method to eliminate top metal corner shaping during bottom metal patterning for MIM capacitors |
| 06/05/2002 | EP1211717A1 Polishing compound for chemimechanical polishing and method for polishing substrate |
| 06/05/2002 | EP1211716A2 Semiconductor device and fabrication process therefor using a dummy gate |
| 06/05/2002 | EP1211715A2 A method for fabricating a IIIV nitride film |
| 06/05/2002 | EP1211693A2 Improvements in or relating to fuse and antifuse link structures for integrated circuits |
| 06/05/2002 | EP1211564A2 Non-corrosive cleaning composition for removing plasma etching residues |
| 06/05/2002 | EP1211563A1 Resist stripper |
| 06/05/2002 | EP1211561A2 Illumination apparatus |
| 06/05/2002 | EP1211560A1 Gas-actuated stages including reaction-force-canceling mechanisms for use in charged-particle-beam microlithography systems |
| 06/05/2002 | EP1211559A1 Photosensitive resin composition, fabricating method for patterned substrate, and device comprising this substrate |
| 06/05/2002 | EP1211558A1 Substrate selector |